ATFS05 datasheet, PDF - EEWORLD Datasheet

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ATFS05: DescriptionSupport Device; File Size117KB，14 Pages; ManufacturerAtmel (Microchip)

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ATFS05 Overview

Support Device

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Features

•

Designed to Store Configurator Programs for Field Programmable System Level

•

Integrated Circuits (FPSLICs)

In-System Programmable (ISP) via 2-wire Bus

Spare Memory Available for System Parameters Storage

Low-power CMOS EEPROM Process

Available in 6 mm x 6 mm x 1 mm 8-lead LAP Package (Pin Compatible Across Product

Family)

Emulation of Atmel’s AT24CXXX Serial EEPROMs

Available in 3.3V ± 10% LV

Low-power Standby Mode

High-reliability

– Endurance: 100,000 Write Cycles

– Data Retention: 90 Years for Industrial Parts (at 85°C) and 190 Years for

Commercial Parts (at 70°C)

Support Device

ATFS05

ATFS10

ATFS40

Advance

Information

Description

The FPSLIC Support Devices provide an easy-to-use, cost-effective configuration

memory for programming Field Programmable System Level Integrated Circuits by

using a simple serial-access procedure to configure one or more FPSLIC devices.

See Table 1 for a list of supported FPSLIC devices.

The FPSLIC Support Device can be programmed with industry-standard program-

mers, Atmel’s ATDH2200E Programming Kit or Atmel’s ATDH2225 ISP Cable.

Table 1.

ATFS FPSLIC Support Devices

FPSLIC Device

AT94K05

AT94K10

AT94K40

FPSLIC Support Device

ATFS05

ATFS10

ATFS40

Configuration Data

226520 Bits

430488 Bits

815382 Bits

Spare Memory

35624 Bits

93800 Bits

233194 Bits

Pin Configurations

8-lead LAP

DATA

CLK

RESET/OE

VCC

SER_EN

CEO (A2)

GND

Rev. 3017C–FPSLI–07/02

ATFS05 Related Products

	ATFS05	ATFS05-CC	ATFS05-CI	ATFS10	ATFS10-CC	ATFS10-CI	ATFS40	ATFS40-CC	ATFS40-CI
Description	Support Device	Support Device	Support Device	Support Device	Support Device	Support Device	Support Device	Support Device	Support Device
Is it Rohs certified?	-	incompatible	incompatible	-	incompatible	incompatible	-	incompatible	incompatible
Maker	-	Atmel (Microchip)	Atmel (Microchip)	-	Atmel (Microchip)	Atmel (Microchip)	-	Atmel (Microchip)	Atmel (Microchip)
Parts packaging code	-	SOIC	SOIC	-	SOIC	SOIC	-	SOIC	SOIC
package instruction	-	SON, SOLCC8,.25	SON, SOLCC8,.25	-	SON, SOLCC8,.25	SON, SOLCC8,.25	-	TSON, SOLCC8,.25	TSON, SOLCC8,.25
Contacts	-	8	8	-	8	8	-	8	8
Reach Compliance Code	-	compli	compli	-	compli	compli	-	compli	compli
ECCN code	-	EAR99	EAR99	-	EAR99	EAR99	-	EAR99	EAR99
Maximum clock frequency (fCLK)	-	10 MHz	10 MHz	-	15 MHz	15 MHz	-	15 MHz	10 MHz
JESD-30 code	-	R-XDSO-N8	R-XDSO-N8	-	R-XDSO-N8	R-XDSO-N8	-	S-PDSO-N8	S-PDSO-N8
JESD-609 code	-	e0	e0	-	e0	e0	-	e0	e0
length	-	5.99 mm	5.99 mm	-	5.99 mm	5.99 mm	-	6 mm	6 mm
memory density	-	284992 bi	284992 bi	-	750400 bi	750400 bi	-	815382 bi	815382 bi
Memory IC Type	-	CONFIGURATION MEMORY	CONFIGURATION MEMORY	-	CONFIGURATION MEMORY	CONFIGURATION MEMORY	-	CONFIGURATION MEMORY	CONFIGURATION MEMORY
memory width	-	1	1	-	1	1	-	1	1
Humidity sensitivity level	-	3	3	-	3	3	-	3	3
Number of functions	-	1	1	-	1	1	-	1	1
Number of terminals	-	8	8	-	8	8	-	8	8
word count	-	284992 words	284992 words	-	750400 words	750400 words	-	815382 words	815382 words
character code	-	284992	284992	-	750400	750400	-	815382	815382
Operating mode	-	SYNCHRONOUS	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	-	70 °C	85 °C	-	70 °C	85 °C	-	70 °C	85 °C
organize	-	284992X1	284992X1	-	750400X1	750400X1	-	815382X1	815382X1
Package body material	-	UNSPECIFIED	UNSPECIFIED	-	UNSPECIFIED	UNSPECIFIED	-	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	SON	SON	-	SON	SON	-	TSON	TSON
Encapsulate equivalent code	-	SOLCC8,.25	SOLCC8,.25	-	SOLCC8,.25	SOLCC8,.25	-	SOLCC8,.25	SOLCC8,.25
Package shape	-	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	-	SQUARE	SQUARE
Package form	-	SMALL OUTLINE	SMALL OUTLINE	-	SMALL OUTLINE	SMALL OUTLINE	-	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	-	SERIAL	SERIAL	-	SERIAL	SERIAL	-	SERIAL	SERIAL
Peak Reflow Temperature (Celsius)	-	240	240	-	240	240	-	240	240
power supply	-	3.3 V	3.3 V	-	3.3 V	3.3 V	-	3.3 V	3.3 V
Certification status	-	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified
Maximum seat height	-	1.14 mm	1.14 mm	-	1.14 mm	1.14 mm	-	1.14 mm	1.14 mm
Maximum standby current	-	0.00005 A	0.0001 A	-	0.0001 A	0.0001 A	-	0.0001 A	0.0001 A
Maximum slew rate	-	0.005 mA	0.005 mA	-	0.005 mA	0.005 mA	-	0.005 mA	0.005 mA
Maximum supply voltage (Vsup)	-	3.6 V	3.6 V	-	3.6 V	3.6 V	-	3.6 V	3.6 V
Minimum supply voltage (Vsup)	-	3 V	3 V	-	3 V	3 V	-	3 V	3 V
Nominal supply voltage (Vsup)	-	3.3 V	3.3 V	-	3.3 V	3.3 V	-	3.3 V	3.3 V
surface mount	-	YES	YES	-	YES	YES	-	YES	YES
technology	-	CMOS	CMOS	-	CMOS	CMOS	-	CMOS	CMOS
Temperature level	-	COMMERCIAL	INDUSTRIAL	-	COMMERCIAL	INDUSTRIAL	-	COMMERCIAL	INDUSTRIAL
Terminal surface	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	-	NO LEAD	NO LEAD	-	NO LEAD	NO LEAD	-	NO LEAD	NO LEAD
Terminal pitch	-	1.27 mm	1.27 mm	-	1.27 mm	1.27 mm	-	1.27 mm	1.27 mm
Terminal location	-	DUAL	DUAL	-	DUAL	DUAL	-	DUAL	DUAL
Maximum time at peak reflow temperature	-	30	30	-	30	30	-	30	30
width	-	5.99 mm	5.99 mm	-	5.99 mm	5.99 mm	-	6 mm	6 mm

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