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CY7C1366C-200BZXI

Description
9-Mbit (256K x 36/512K x 18) Pipelined DCD Sync SRAM
File Size492KB,29 Pages
ManufacturerCypress Semiconductor
Download Datasheet View All

CY7C1366C-200BZXI Overview

9-Mbit (256K x 36/512K x 18) Pipelined DCD Sync SRAM

CY7C1366C
CY7C1367C
9-Mbit (256K x 36/512K x 18) Pipelined DCD Sync SRAM
Features
• Supports bus operation up to 250 MHz
• Available speed grades are 250, 200, and 166 MHz
• Registered inputs and outputs for pipelined operation
• Optimal for performance (Double-Cycle deselect)
—Depth expansion without wait state
• 3.3V –5% and +10% core power supply (V
DD
)
• 2.5 V/3.3V I/O power supply (V
DDQ
)
• Fast clock-to-output times
— 2.8 ns (for 250-MHz device)
• Provide high-performance 3-1-1-1 access rate
User-selectable burst counter supporting Intel
®
Pentium
®
interleaved or linear burst sequences
• Separate processor and controller address strobes
• Synchronous self-timed writes
• Asynchronous output enable
• Available in lead-Free 100-Pin TQFP, lead-free and non
lead-free 119-Ball BGA package and 165-Ball FBGA
package
• IEEE 1149.1 JTAG-Compatible Boundary Scan
• “ZZ” Sleep Mode Option
Functional Description
[1]
The CY7C1366C/CY7C1367C SRAM integrates 256K x 36
and 512K x 18 SRAM cells with advanced synchronous
peripheral circuitry and a two-bit counter for internal burst
operation. All synchronous inputs are gated by registers
controlled by a positive-edge-triggered Clock Input (CLK). The
synchronous inputs include all addresses, all data inputs,
address-pipelining Chip Enable (CE
1
), depth-expansion Chip
Enables (CE
2
and CE
3[2]
), Burst Control inputs (ADSC, ADSP,
and ADV), Write Enables (BW
X
, and BWE), and Global Write
(GW). Asynchronous inputs include the Output Enable (OE)
and the ZZ pin.
Addresses and chip enables are registered at rising edge of
clock when either Address Strobe Processor (ADSP) or
Address Strobe Controller (ADSC) are active. Subsequent
burst addresses can be internally generated as controlled by
the Advance pin (ADV).
Address, data inputs, and write controls are registered on-chip
to initiate a self-timed Write cycle.This part supports Byte Write
operations (see Pin Descriptions and Truth Table for further
details). Write cycles can be one to four bytes wide as
controlled by the byte write control inputs. GW active LOW
causes all bytes to be written. This device incorporates an
additional pipelined enable register which delays turning off
the output buffers an additional cycle when a deselect is
executed.This feature allows depth expansion without penal-
izing system performance.
The CY7C1366C/CY7C1367C operates from a +3.3V core
power supply while all outputs operate with a +3.3V or a +2.5V
supply. All inputs and outputs are JEDEC-standard
JESD8-5-compatible.
Selection Guide
250 MHz
Maximum Access Time
Maximum Operating Current
Maximum CMOS Standby Current
2.8
250
40
200 MHz
3.0
220
40
166 MHz
3.5
180
40
Unit
ns
mA
mA
Notes:
1. For best-practices recommendations, please refer to the Cypress application note
System Design Guidelines
on www.cypress.com.
2. CE
3
is for TQFP and 165 FBGA package only. 119 BGA is offered only in 2 Chip Enable.
Cypress Semiconductor Corporation
Document #: 38-05542 Rev. *E
198 Champion Court
San Jose
,
CA 95134-1709
408-943-2600
Revised September 14, 2006
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