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BR24L01AFJ-W

Description
I2C BUS 1Kbit (128 x 8bit) EEPROM
Categorystorage    storage   
File Size310KB,6 Pages
ManufacturerROHM Semiconductor
Websitehttps://www.rohm.com/
Environmental Compliance
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BR24L01AFJ-W Overview

I2C BUS 1Kbit (128 x 8bit) EEPROM

BR24L01AFJ-W Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerROHM Semiconductor
Parts packaging codeSOIC
package instructionSOP-8
Contacts8
Reach Compliance Codecompli
ECCN codeEAR99
Maximum clock frequency (fCLK)0.1 MHz
Data retention time - minimum40
Durability1000000 Write/Erase Cycles
I2C control byte1010DDDR
JESD-30 codeR-PDSO-G8
JESD-609 codee2
length4.9 mm
memory density1024 bi
Memory IC TypeEEPROM
memory width8
Number of functions1
Number of terminals8
word count128 words
character code128
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize128X8
Package body materialPLASTIC/EPOXY
encapsulated codeLSOP
Encapsulate equivalent codeSOP8,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE, LOW PROFILE
Parallel/SerialSERIAL
Peak Reflow Temperature (Celsius)260
power supply2/5 V
Certification statusNot Qualified
Maximum seat height1.65 mm
Serial bus typeI2C
Maximum standby current0.000002 A
Maximum slew rate0.002 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)1.8 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Copper (Sn/Cu)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperature10
width3.9 mm
Maximum write cycle time (tWC)5 ms
write protectHARDWARE

BR24L01AFJ-W Related Products

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Description I2C BUS 1Kbit (128 x 8bit) EEPROM I2C BUS 1Kbit (128 x 8bit) EEPROM I2C BUS 1Kbit (128 x 8bit) EEPROM I2C BUS 1Kbit (128 x 8bit) EEPROM I2C BUS 1Kbit (128 x 8bit) EEPROM I2C BUS 1Kbit (128 x 8bit) EEPROM
Is it lead-free? Lead free Lead free Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to conform to conform to
Maker ROHM Semiconductor ROHM Semiconductor ROHM Semiconductor ROHM Semiconductor ROHM Semiconductor ROHM Semiconductor
Parts packaging code SOIC SOIC SOIC MSOP SOIC SOIC
package instruction SOP-8 LSOP, SOP8,.25 LSSOP, TSSOP8,.25 MSOP-8 TSSOP, TSSOP8,.25 TSSOP-8
Contacts 8 8 8 8 8 8
Reach Compliance Code compli compli compli compli compli compli
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum clock frequency (fCLK) 0.1 MHz 0.1 MHz 0.1 MHz 0.1 MHz 0.1 MHz 0.1 MHz
Data retention time - minimum 40 40 40 40 40 40
Durability 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles
I2C control byte 1010DDDR 1010DDDR 1010DDDR 1010DDDR 1010DDDR 1010DDDR
JESD-30 code R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 S-PDSO-G8
JESD-609 code e2 e2 e2 e2 e2 e2
length 4.9 mm 5 mm 4.4 mm 2.9 mm 4.4 mm 3 mm
memory density 1024 bi 1024 bi 1024 bi 1024 bi 1024 bi 1024 bi
Memory IC Type EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM
memory width 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1
Number of terminals 8 8 8 8 8 8
word count 128 words 128 words 128 words 128 words 128 words 128 words
character code 128 128 128 128 128 128
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
organize 128X8 128X8 128X8 128X8 128X8 128X8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LSOP LSOP LSSOP VSSOP TSSOP TSSOP
Encapsulate equivalent code SOP8,.25 SOP8,.25 TSSOP8,.25 TSSOP8,.16 TSSOP8,.25 TSSOP8,.19
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR SQUARE
Package form SMALL OUTLINE, LOW PROFILE SMALL OUTLINE, LOW PROFILE SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL
Peak Reflow Temperature (Celsius) 260 260 260 260 260 260
power supply 2/5 V 2/5 V 2/5 V 2/5 V 2/5 V 2/5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.65 mm 1.71 mm 1.35 mm 0.9 mm 1.2 mm 1.1 mm
Serial bus type I2C I2C I2C I2C I2C I2C
Maximum standby current 0.000002 A 0.000002 A 0.000002 A 0.000002 A 0.000002 A 0.000002 A
Maximum slew rate 0.002 mA 0.002 mA 0.002 mA 0.002 mA 0.002 mA 0.002 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
Nominal supply voltage (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Copper (Sn/Cu) Tin/Copper (Sn/Cu) Tin/Copper (Sn/Cu) Tin/Copper (Sn97.5Cu2.5) Tin/Copper (Sn/Cu) Tin/Copper (Sn/Cu)
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 1.27 mm 1.27 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 10 10 10 10 10 10
width 3.9 mm 4.4 mm 3 mm 2.8 mm 3 mm 3 mm
Maximum write cycle time (tWC) 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms
write protect HARDWARE HARDWARE HARDWARE HARDWARE HARDWARE HARDWARE
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