
I2C BUS 1Kbit (128 x 8bit) EEPROM
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | ROHM Semiconductor |
| Parts packaging code | SOIC |
| package instruction | LSOP, SOP8,.25 |
| Contacts | 8 |
| Reach Compliance Code | compli |
| ECCN code | EAR99 |
| Maximum clock frequency (fCLK) | 0.1 MHz |
| Data retention time - minimum | 40 |
| Durability | 1000000 Write/Erase Cycles |
| I2C control byte | 1010DDDR |
| JESD-30 code | R-PDSO-G8 |
| JESD-609 code | e2 |
| length | 5 mm |
| memory density | 1024 bi |
| Memory IC Type | EEPROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 8 |
| word count | 128 words |
| character code | 128 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 128X8 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | LSOP |
| Encapsulate equivalent code | SOP8,.25 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, LOW PROFILE |
| Parallel/Serial | SERIAL |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 2/5 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.71 mm |
| Serial bus type | I2C |
| Maximum standby current | 0.000002 A |
| Maximum slew rate | 0.002 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 1.8 V |
| Nominal supply voltage (Vsup) | 2.5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Copper (Sn/Cu) |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 10 |
| width | 4.4 mm |
| Maximum write cycle time (tWC) | 5 ms |
| write protect | HARDWARE |
| BR24L01AF-W | BR24L01AFJ-W | BR24L01AFV-W | BR24L01AFVM-W | BR24L01AFVT-W | BR24L01AFVJ-W | |
|---|---|---|---|---|---|---|
| Description | I2C BUS 1Kbit (128 x 8bit) EEPROM | I2C BUS 1Kbit (128 x 8bit) EEPROM | I2C BUS 1Kbit (128 x 8bit) EEPROM | I2C BUS 1Kbit (128 x 8bit) EEPROM | I2C BUS 1Kbit (128 x 8bit) EEPROM | I2C BUS 1Kbit (128 x 8bit) EEPROM |
| Is it lead-free? | Lead free | Lead free | Lead free | Lead free | Lead free | Lead free |
| Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | conform to |
| Maker | ROHM Semiconductor | ROHM Semiconductor | ROHM Semiconductor | ROHM Semiconductor | ROHM Semiconductor | ROHM Semiconductor |
| Parts packaging code | SOIC | SOIC | SOIC | MSOP | SOIC | SOIC |
| package instruction | LSOP, SOP8,.25 | SOP-8 | LSSOP, TSSOP8,.25 | MSOP-8 | TSSOP, TSSOP8,.25 | TSSOP-8 |
| Contacts | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compli | compli | compli | compli | compli | compli |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum clock frequency (fCLK) | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz |
| Data retention time - minimum | 40 | 40 | 40 | 40 | 40 | 40 |
| Durability | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles |
| I2C control byte | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR |
| JESD-30 code | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | S-PDSO-G8 |
| JESD-609 code | e2 | e2 | e2 | e2 | e2 | e2 |
| length | 5 mm | 4.9 mm | 4.4 mm | 2.9 mm | 4.4 mm | 3 mm |
| memory density | 1024 bi | 1024 bi | 1024 bi | 1024 bi | 1024 bi | 1024 bi |
| Memory IC Type | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 8 | 8 | 8 | 8 | 8 | 8 |
| word count | 128 words | 128 words | 128 words | 128 words | 128 words | 128 words |
| character code | 128 | 128 | 128 | 128 | 128 | 128 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| organize | 128X8 | 128X8 | 128X8 | 128X8 | 128X8 | 128X8 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | LSOP | LSOP | LSSOP | VSSOP | TSSOP | TSSOP |
| Encapsulate equivalent code | SOP8,.25 | SOP8,.25 | TSSOP8,.25 | TSSOP8,.16 | TSSOP8,.25 | TSSOP8,.19 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| Package form | SMALL OUTLINE, LOW PROFILE | SMALL OUTLINE, LOW PROFILE | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Parallel/Serial | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | 260 | 260 | 260 |
| power supply | 2/5 V | 2/5 V | 2/5 V | 2/5 V | 2/5 V | 2/5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 1.71 mm | 1.65 mm | 1.35 mm | 0.9 mm | 1.2 mm | 1.1 mm |
| Serial bus type | I2C | I2C | I2C | I2C | I2C | I2C |
| Maximum standby current | 0.000002 A | 0.000002 A | 0.000002 A | 0.000002 A | 0.000002 A | 0.000002 A |
| Maximum slew rate | 0.002 mA | 0.002 mA | 0.002 mA | 0.002 mA | 0.002 mA | 0.002 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Nominal supply voltage (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| surface mount | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin/Copper (Sn/Cu) | Tin/Copper (Sn/Cu) | Tin/Copper (Sn/Cu) | Tin/Copper (Sn97.5Cu2.5) | Tin/Copper (Sn/Cu) | Tin/Copper (Sn/Cu) |
| Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 1.27 mm | 1.27 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | 10 | 10 | 10 | 10 | 10 | 10 |
| width | 4.4 mm | 3.9 mm | 3 mm | 2.8 mm | 3 mm | 3 mm |
| Maximum write cycle time (tWC) | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms |
| write protect | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE |