Peak Transient Voltage (output off mode, output pin only)
Lead Temperature Soldering:
1. 60 second maximum above 183°C.
*The maximum package power dissipation must be observed.
(26 V Load Dump @ 14 V V
BAT
)
Reflow: (SMD styles only) (Note 1)
Value
–65 to +150
–0.5 to 6.0
2.0
40
230 peak
Unit
°C
V
kV
V
°C
ELECTRICAL CHARACTERISTICS
(4.75
≤
V
CC
≤
5.25 V, –40°C
≤
T
A
≤
85°C, –40°C
≤
T
J
≤
150°C; unless other-
wise specified.)
Characteristic
Supply Requirements
V
CC
Quiescent Current
V
CC
Quiescent Current
Output
Leakage Current
Saturation Voltage
V
OUTPUT
(self–bias)
Current Sense
Short Circuit Current
Open Circuit Current
Control–Input
Input Voltage
Input Current
Fault Output – (Open Collector)
Output Low Voltage
Overtemperature Shutdown
T
J
Output Disable Threshold
T
J
Hysteresis
(Guaranteed by Design)
(Guaranteed by Design)
150
5.0
180
–
–
–
°C
°C
I
FAULT
= 250
µA
(sink)
–
0.24
0.40
V
Logic = High
Logic = Low
Logic = V
CC
Logic = 0 V
2.0
–
–
–50
–
–
20
–20
–
0.8
40
–
V
V
µA
µA
–
Output in the ON state
350
20
500
40
650
60
mA
mA
V
BAT
= 14 V
I
OUTPUT
= 350 mA
I
OUTPUT
= 180 mA
V
CC
< 4.5 V, I
OUTPUT
< 200 mA
–
–
–
–
16
1.1
0.9
–
100
1.5
1.3
3.5
µA
V
V
V
Output ON
Output OFF
–
–
3.0
100
6.0
250
mA
µA
Test Conditions
Min
Typ
Max
Unit
Note: A fault signal will be shown (at the fault pin) during inrush as the short circuit threshold is exceeded.
PACKAGE PIN DESCRIPTION
PACKAGE PIN #
8 Lead SO Narrow
1
2
3
4
5, 6, 7, 8
PIN SYMBOL
Output
V
CC
Fault
Control
Ground
Open collector output.
5.0 V regulated supply input.
Open collector diagnostic output low during open load, short
circuit and overtemperature conditions.
TTL compatible input.
Signal ground.
FUNCTION
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2
CS1108
CIRCUIT DESCRIPTION
The CS1108 lamp driver IC provides up to 350 mA of
drive current in a low–side configuration. The Output driver
pin is controlled through the TTL compatible Control input
pin. A high condition on the Control pin turns the output pin
on.
The Fault pin reports short circuit, open circuit, and
overtemperature conditions on the IC. If a fault is present,
the open collector output Fault pin will be low. Typical
numbers for faults are: exceeding 500 mA of drive current
will report a short circuit. Less than 40 mA (typical) will
report an open circuit. A temperature fault will be reported
when the die temperature exceeds 180°C (typical). Faults
are only reported when the Control pin is high, due to the low
quiescent current when the Control pin is low and the output
device is turned off.
The CS1108 is designed to provide overcurrent protection
by duty cycle control. When the lamp current exceeds the
internally programmed current limit threshold (typically
500 mA), the output enters duty cycle mode to reduce power
dissipation of the IC to a safe level.
Typical lamps have a low resistance when off and the
current will exceed the current limit threshold during the
initial inrush period. During this inrush time, the IC will be
operating in the duty cycle mode. Due to characteristics of
lamps in this mode, they may appear dimly lit. This
condition will persist for a breif time until the lamp
resistance has increased enough to reduce it’s current below
the threshold. Once this occurs the lamp will appear at full
brightness. During the inrush period the Fault pin will be
forced low indicating that duty cycle mode is in operation.
Thermal protection has been designed into this IC. Should
duty cycle mode operate for an extended amount of time and
the power limitations of the IC are exceeded the IC die
temperature will rise. Once the die temperature reaches the
thermal temperature limit, the internal cicuitry will shutoff
the output and the lamp will turn off. Once the die temperature
lowers below the thermal threshold, the output will be
allowed to turn back on.
Output
10 nF
V
CC
Fault
20 k
Control
V
BAT
V
CC
GND
CS1108
GND
GND
GND
microprocessor
Figure 2. Applications Diagram
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3
CS1108
PACKAGE DIMENSIONS
SO–8
DF SUFFIX
CASE 751–07
ISSUE V
A
8
5
–X–
B
1
4
S
0.25 (0.010)
M
Y
M
–Y–
G
C
–Z–
H
D
0.25 (0.010)
M
SEATING
PLANE
K
MILLIMETERS
MIN
MAX
4.80
5.00
3.80
4.00
1.35
1.75
0.33
0.51
1.27 BSC
0.10
0.25
0.19
0.25
0.40
1.27
0
_
8
_
0.25
0.50
5.80
6.20
INCHES
MIN
MAX
0.189
0.197
0.150
0.157
0.053
0.069
0.013
0.020
0.050 BSC
0.004
0.010
0.007
0.010
0.016
0.050
0
_
8
_
0.010
0.020
0.228
0.244
N
X 45
_
0.10 (0.004)
M
J
Z Y
S
X
S
DIM
A
B
C
D
G
H
J
K
M
N
S
PACKAGE THERMAL DATA
Parameter
R
ΘJC
R
ΘJA
Typical
Typical
SO–8
25
110
Unit
°C/W
°C/W
ON Semiconductor
and
are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,
including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
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