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PFM18030F

Description
1805-1880 MHz, 30W, 2-Stage Power Module Enhancement-Mode Lateral MOSFETs
File Size487KB,13 Pages
ManufacturerETC
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PFM18030F Overview

1805-1880 MHz, 30W, 2-Stage Power Module Enhancement-Mode Lateral MOSFETs

PRELIMINARY 
PFM18030 
SPECIFICATION 
1805­1880 MHz, 30W, 2­Stage Power Module 
Enhancement­Mode Lateral MOSFETs 
This versatile DCS module provides excellent linearity and efficiency in a 
low­cost surface mount package.  The PFM18030SM includes two stages 
Package Type: Surface Mount 
of amplification, along with internal sense FETs that are on the same 
silicon die as the RF devices.  These thermally coupled sense FETs 
PN: PFM18030SM 
simplify the task of bias temperature compensation of the overall amplifier. 
The module includes RF input, interstage, and output matching elements. 
The source and load impedances required for optimum operation of the 
module are much higher (and simpler to realize) than for unmatched Si 
LDMOS transistors of similar performance. 
The surface mount package base is typically soldered to a conventional 
PCB pad with an array of via holes for grounding and thermal sinking of 
the module.  Optimized internal construction supports low FET channel 
temperature for reliable operation.
Package Type: Flange 
PN: PFM18030F
·
29 dB Gain
·
30 Watts Peak Output Power
·
Internal Tracking FETs 
(for improved bias control)
·
IS95 CDMA Performance 
5 Watts Average Output Level 
20% Power Added Efficiency 
–49 dBc ACPR 
Module Schematic Diagram 
Module Substrate 
Q1 Die Carrier 
Q1 
Q2 Die Carrier 
Q2 
Drain 2 
RF OUT 
Output 
Match 
Lead 
Gate 1 
RF IN 
Lead 
Input 
Match 
Output 
Match 
Input 
Match 
S1 
S2 
Sense S1 
Lead 
Gate 2 
Lead 
Sense S2 
Lead 
D1 
Lead 
Note:  Additionally, there are 250 KOhm resistors connected in shunt with all leads, to enhance ESD protection. 
Page 1 of 13 
Specifications subject to change without notice.  U.S. Patent No. 6,822,321 
http://www.cree.com/ 
Rev. 3 

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