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GWCR2010-3R9FT4

Description
Thick Film Resistors - SMD 3/4W 3.9 Ohm 1%
CategoryPassive components   
File Size397KB,2 Pages
ManufacturerTT Electronics
Environmental Compliance
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Thick Film Resistors - SMD 3/4W 3.9 Ohm 1%

GWCR2010-3R9FT4 Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerTT Electronics
Product CategoryThick Film Resistors - SMD
RoHSDetails
Resistance3.9 Ohms
Power Rating750 mW (3/4 W)
Tolerance1 %
Temperature Coefficient400 PPM / C
Minimum Operating Temperature- 55 C
Maximum Operating Temperature+ 155 C
Voltage Rating200 V
Case Code - in2010
Case Code - mm5025
PackagingReel
Height0.55 mm
Length5 mm
Package / Case2010 (5025 metric)
ProductThick Film Resistors SMD
TechnologyThick Film
Termination StyleSMD/SMT
Width2.5 mm
Mounting StylePCB Mount
Factory Pack Quantity4000
Resistors
Green Thick-Film Chip Resistors
GWCR Series
Completely free of Pb and its compounds
RoHS compliant without exemption
Sizes 01005 to 2512
Values 1R0 to 10M
All parts are Pb-free and comply with EU Directive 2011/65/EU (RoHS2)
Electrical Data
01005
Power rating @ 70°C
Resistance range
Limiting element voltage
TCR
Resistance tolerance
Standard values
Ambient temperature range
Dielectric withstand
Insulation resistance
Zero-ohm jumper chip rating
Zero-ohm resistance
°C
volts
ohms
amps
milliohms
N/A
N/A
0.5
1
<50
100
watts
ohms
volts
0.031
10R-1M0
15
25
1R0 – 10R: ±400,
>10R: ±200
50
75
0201
0.05
0402
0.063
0603
0.1
0805
0.125
150
1206
0.25
1210
0.5
200
1812
2010
2512
1
250
0.75
1R0 – 10M
10R: ±600,
ppm/°C 10R2 - 100R: ±400,
>100R: ±250
%
1R0 – 10R: ±400, 10R2 - 100R: ±200, >100R: ±100
±1
E24 or E96
-55 to 155
300
≥1G0
2
500
Physical Data
Dimensions (mm) and Weight (mg)
L
W
01005
0.40 ± 0.02
0.2 ± 0.02
0201
0.6 ± 0.03
0.30 ± 0.03
0402
1.00 ± 0.10
0.50 ± 0.05
0603
1.60 ± 0.10
0.80 ± 0.10
0805
2.00 ± 0.15
1.25 ± 0.15
1206
3.10 ± 0.15
1.55 ± 0.15
1210
3.10 ± 0.15
2.60 ± 0.20
1812
4.50 ± 0.20
3.20 ± 0.20
2010
5.00 ± 0.10
2.50 ± 0.10
2515
6.35 ± 0.10
3.20 ± 0.10
T
0.13 ± 0.05
0.23 ± 0.05
0.35 ± 0.05
0.45 ± 0.10
0.55 ± 0.10
0.55 ± 0.10
0.55 ± 0.10
0.55 ± 0.10
0.55 ± 0.10
0.55 ± 0.10
C
0.10 ± 0.05
0.10 ± 0.05
0.20 ± 0.10
0.30 ± 0.20
0.40 ± 0.20
0.45 ± 0.20
0.50 ± 0.20
0.50 ± 0.20
0.60 ± 0.25
0.60 ± 0.25
A
0.10 ± 0.03
0.15 ± 0.05
0.25 ± 0.10
0.30 ± 0.20
0.40 ± 0.20
0.45 ± 0.20
0.50 ± 0.20
0.50 ± 0.20
0.50 ± 0.20
0.50 ± 0.20
Wt (nom.)
0.2
0.3
0.5
2.2
4.7
8.5
17.2
29.5
24.8
34.3
C
T
A
L
A
W
Wrap-around terminations
(3 faces)
Construction
The chips have a high alumina substrate (96% minimum) with a
ruthenium oxide resistance element and silver palladium, nickel and tin
plated terminations. A glazed protection coat is applied to the resistive
element (see fig1)
Terminations
Solderability
Strength
The terminations meet the requirements of IEC 115-1, Clause 4.17.3.2
The terminations meet requirements of IEC 68.2.21
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
http://www.ttelectronics.com/resistors
© TT Electronics plc
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