EEWORLDEEWORLDEEWORLD

Part Number

Search

WCR2512-732KFI

Description
Thick Film Resistors - SMD
CategoryPassive components   
File Size553KB,3 Pages
ManufacturerTT Electronics
Download Datasheet Parametric View All

WCR2512-732KFI Overview

Thick Film Resistors - SMD

WCR2512-732KFI Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerTT Electronics
Product CategoryThick Film Resistors - SMD
TechnologyThick Film
Mounting StylePCB Mount
General Purpose Surface
Resistors
Mounted Resistors
General Purpose Surface
Mounted Resistors
General Purpose Surface
WCR Series
Mounted Resistors
Excellent reliability
WCR Series
Excellent reliability
WCR Series
Wrap around terminations
Wide range of sizes and ohmic values
Inner electrode protection
Excellent reliability
Wrap
range of sizes and ohmic values
Wide
around terminations
Inner electrode protection
Wrap around terminations
Inner electrode protection
AEC-Q200 grade available
Wide range of sizes and ohmic values
Welwyn Components
Welwyn Components
Electrical Data
Electrical
rating @ 70°C
Data
Power
0201
All parts are Pb-free and comply with EU Directive 2011/65/EU (RoHS2)
0402
0603
0805
1206
1210
2010
2512
0.1
0.125
0.25
0.5
1.0
0.05
0.25
0.063
watts
Resistance range
ohms 10R to 1M0 1R0 to 1M0
1R0 to 10M
0603
0805
1206
2010
2512
1210
0402
0201
150
25
50
75
Limiting element votage
volts
200
0.1
0.125
0.25
0.5
1.0
0.05
0.063
Power ratingTCR*
@ 70°C
watts
100 0.25
200
250
ppm/°C
Resistance range
ohms 10R to 1M0 1R0 to 1M0
1R0 to 10M
1
Resistance Tolerance
%
150
25
50
75
Limiting element votage
volts
200
E24 or E96
Standard values
100
200
250
TCR*
ppm/°C
-55 to 155
Ambient temperature range
°C
1
Resistance Tolerance Jumper Chip Rating %
Zero-ohm
amps
1.5
2
0.5
1
E24 or E96
Standard values
<50
Zero-ohm Jumper Chip Resistance milliohms
-55 to 155
Ambient temperature range
°C
* Notes – TCR for low values 1R to 10R: -400 to +600ppm/ºC, 11R to 100R: ±200ppm/ºC
Zero-ohm Jumper Chip Rating
amps
1.5
2
0.5
1
TCR for high values 3M3 to 10M: ±300ppm/º
<50
Zero-ohm Jumper Chip Resistance milliohms
Physical Data
Dimensions (mm)
Physical Data
L
Style
* Notes – TCR for low values 1R to 10R: -400 to +600ppm/ºC, 11R to 100R: ±200ppm/ºC
TCR for high values 3M3 to 10M: ±300ppm/º
The chips have a high alumina substrate (96% minimum) with
a ruthenium oxide resistance element and silver palladium,
Figure
Construction
and tin plated terminations. A glazed protection coat
1
nickel
The chips have a high alumina substrate (96% minimum) with
is applied to the resistive element (See Fig.1)
a ruthenium oxide resistance element and silver palladium,
Terminations
nickel and tin plated terminations. A glazed protection coat
Solderability
The terminations meet the requirements of
is applied to the resistive element (See Fig.1)
IEC 115-1, Clause 4.17.3.2.
Terminations
Strength
The terminations meet requirements of
Solderability
The terminations meet the requirements of
IEC 68.2.21.
IEC 115-1, Clause 4.17.3.2.
Strength
The terminations meet requirements of
IEC 68.2.21.
General Note
T
C
A
W
0.6 ± 0.03
0.23 ± 0.03
0.12 ± 0.05
0.15 ± 0.05
0.3 ± 0.03
0201
Dimensions (mm)
1.0 ± 0.1
0.35 ± 0.05
0.2 ± 0.1
0.25 ± 0.1
0.5 ± 0.05
0402
L
T
C
1.6 ± 0.15
0.5 ± 0.15
0.25 ±A
0.2
0.25 ± 0.2
W
Style
0.8 ± 0.15
0603
C
A
0.6 ± 0.03
0.23 ± 0.03
0.12 ± 0.05
0.15 ± 0.05
2.0 ± ± 0.03 1.25+ 0.2 -0.1 0.5 + 0.15 -0.10
0.4 ± 0.2
0.4 ± 0.2
0.3 0.2
0201
0805
1.0 ± 0.1
0.35 -0.15
0.2 ± -0.1
0.25 ± 0.1
L
3.2 +0.1±-0.25 1.6 + 0.1 ± 0.05 0.55 +0.150.1 0.5 + 0.2-0.25 0.5+ 0.2 -0.25
0.5 0.05
0402
1206
W
A T
1.6 ± 0.15 3.2 0.8 ± 0.15
0.50.15
± 0.15 0.550.25 ± 0.2
0.25 ± 0.2
+ 0.1 -0.2
+0.15 -0.1
0.5 ± 0.25
0.5 ± 0.2
0603
2.6 ±
1210
A
Wrap-around terminations
2.0 ± 0.2
0.4 0.15
0.4 ± 0.2
5.0 ± 0.15 -0.1 0.5 + 0.15 -0.10 0.56 ± ± 0.2
0.60 ± 0.25
0.60 ± 0.25
1.25+ 0.2
0805
2.5 ± 0.15
2010
(3 faces)
L
3.2 +0.1 -0.25 1.6 + 0.1 -0.15 0.55 +0.15 -0.1 0.56+ 0.2-0.25 0.60 ±0.2 -0.25 1.2 ± 0.85
0.5 ± 0.15
0.5+ 0.25
6.3 ± 0.15
1206
3.2 ± 0.15
W
2512
A
3.2 + 0.1 -0.2
0.55 +0.15 -0.1
0.5 ± 0.25
0.5 ± 0.2
2.6 ± 0.15
1210
Wrap-around terminations
5.0 ± 0.15
0.56 ± 0.15
0.60 ± 0.25
0.60 ± 0.25
2.5 ± 0.15
2010
Figure 1
(3 faces)
Construction
± 0.15
6.3 ± 0.15
0.56 ± 0.15
0.60 ± 0.25
1.2 ± 0.85
3.2
2512
C
T
Tin Plating
Epoxy Melamine
Protection
Nickel Barrier
Glass Dielectric
Silver
Dipped Conductor
Resistance Element
Palladium
Epoxy Melamine
Protection
Glass Dielectric
Silver
Resistance Element
Palladium
96% min Alumina Substrate
96% min Alumina Substrate
Tin Plating
Nickel Barrier
Dipped Conductor
Welwyn Components reserves the right to make changes in product specification without notice or liability.
All information is subject to Welwyn’s own data and is considered accurate at time of going to print.
General
Note
© Welwyn Components Limited
· Bedlington, Northumberland NE22 7AA, UK
General
Note
Welwyn Components
the right to make changes in
changes
specification
specification without notice or liability.
Telephone: +44 (0) 1670 make
product
in product
without notice or
Email:
TT Electronics reserves
reserves the right to 822181 · Facsimile: +44 (0) 1670 829465 ·
liability.
info@welwyn-tt.com · Website: www.welwyn-tt.com
All information is subject to Welwyn’s own data and is considered accurate at time of going to print.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
Iss 07.03
A subsidiary of
TT electronics plc
www.ttelectronics.com/resistors
Iss 07.03
05.18
A subsidiary of
TT electronics plc
© Welwyn Components Limited
· Bedlington, Northumberland NE22 7AA, UK
© TT Electronics plc
Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com
May I ask the experts, how to modify the refresh rate of wince?
My development board is 2440+10-inch LCD screen. The damn development board manufacturer gave me a 640*480 BSP. After the system started, it did not display full screen. I finally changed it to 800*60...
linaiwen Embedded System
Design Method of Standalone Photovoltaic Power System
Design Method of Standalone Photovoltaic Power SystemThrough the unremitting efforts of photovoltaic workers, the production technology of solar cells has been continuously improved and is increasingl...
zbz0529 Power technology
Embedded Linux driver arm driver header file corresponding problem
I am developing an analog-to-digital conversion driver for an S3C2440 development board under Linux. I don't know where to put my .c and .h files. Can I put them anywhere?...
deeply Linux and Android
Very good! ! 7-inch serial port & video LCD display module M070AS26 with patent
Key Features ●Support dual-channel PAL/NTSC input, single-channel real-time display ●Character images can be superimposed at any position, support 4- level video zoom, and can store and play back 6 vi...
KINGEYE88 MCU
What data is stored behind the OS in WM's NAND
We know that the nand allocation of WM is like this, stepldr, eboot, MBR, OS... What is stored immediately after OS? FAT table? Or something else? The second question is, when is the FAT table in WM c...
szbeta Embedded System
[2008新書]Advanced FPGA Design Architecture, Implementation, and Optimization
Copyright # 2008 by John Wiley & Sons, Inc. All rights reserved. Published by John Wiley & Sons, Inc., Hoboken, New Jersey. Published simultaneously in Canada. No part of this publication may be repro...
koras FPGA/CPLD

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2584  2624  2761  587  2687  53  56  12  55  44 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号