Datasheet
Automotive IPD Series
1ch Low Side Switch IC
BV1LB085FJ-C
Features
Built-in overcurrent limiting circuit(OCP)
Built-in thermal shutdown circuit(TSD)
Built-in active clamp circuit
Direct control enabled from CMOS logic IC, etc.
Low On resistance R
ON
=85mΩ(Typ)
(when V
IN
½5V,
I
D
=0.5A, Tj½25C)
■
Monolithic power management IC with the control
block (CMOS) and power MOS FET mounted on a
single chip
■
AEC-Q100 Qualified
(Note 1)
■
■
■
■
■
(Note 1)
Grade1
Product Summary
On-state resistance (T
j
=25°C, Typ)
Overcurrent limit (T
j
=25°C, Typ)
Output clamp voltage (Min)
Active clamp energy (T
j
=25°C)
85mΩ
17.5A
42V
260mJ
Package
SOP-J8
W(Typ) x D(Typ) x H(Max)
4.90mm x 6.00mm x 1.65mm
General Description
The BV1LB085FJ-C is an automotive 1ch low side
switch IC, which has built-in overcurrent limiting circuit,
thermal shutdown circuit, and overvoltage (active clamp)
protection circuit.
Applications
1ch low side switch for driving resistive, Inductive load, Capacitive load
Block Diagram
○Product
structure: Silicon monolithic integrated circuit
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This
product is not designed to protect it from radiation.
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BV1LB085FJ-C
Pin Configurations
SOP-J8
(TOP VIEW)
Datasheet
SOURCE
SOURCE
SOURCE
IN
Pin Descriptions
Pin No.
1
2
3
4
5
6
7
8
Symbol
SOURCE
SOURCE
SOURCE
IN
DRAIN
DRAIN
DRAIN
DRAIN
1
2
BV1LB085FJ
3
4
8
7
6
5
DRAIN
DRAIN
DRAIN
DRAIN
Function
GND pin
GND pin
GND pin
Input pin
(Note 1)
Output pin
Output pin
Output pin
Output pin
(Note 1) Input pin is used to internally connect a pull-down resistor.
Difinition
Figure 1. Difinition
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BV1LB085FJ-C
Absolute Maximum Ratings
(T
j
=25°C)
Parameter
Drain-Source voltage in output block
Input voltage
Output current (DC)
Active clamp energy (Single pulse)
T
j(start)
= 25°C
(Note 3)
Active clamp energy (Single pulse)
T
j(start)
= 150°C
(Note 3) (Note 4)
Operating temperature range
Storage temperature range
Maximum junction temperature
Symbol
V
DS
V
IN
I
D
E
AS(25°C)
E
AS(150°C)
T
j
T
stg
T
jmax
Ratings
-0.3 to +42
(Note 1)
-0.3 to +7
13
(Note 2)
260
Datasheet
Unit
V
V
A
mJ
105
-40 to +150
-55 to +150
150
°C
°C
°C
(Note 1) Please refer to P.16 “Operation Notes”, when is used at less than -0.3V.
(Note 2) Internally limited by the overcurrent limiting circuit.
(Note 3) Maximum Active clamp energy, using single non-repetitive pulse of 1.5A, V
B
= 16V.
(Note 4)
Not 100% tested.
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BV1LB085FJ-C
Datasheet
Thermal Characteristics
(Note 1)
Parameter
SOP-J8
143.7
Thermal Resistance between channel and ambient temperature
θ
JA
86.9
67.5
(Note 1)
(Note 2)
(Note 3)
Symbol
Ratings
Unit
Conditions
°C / W
°C / W
°C / W
1s
2s
2s2p
(Note 2)
(Note 3)
(Note 4)
(Note 4)
The thermal impedance is based on JESD51 - 2A (Still - Air) standard. It is used the chip of BV1LB085FJ-C.
JESD51 - 3 compliance FR4 114.3 mm × 76.2 mm × 1.57 mm 1 layer (1s)
(top layer copper：Rohm recommend land pattern + measurement wiring, copper thickness 2oz)
JESD51 -5 compliance FR4 114.3 mm × 76.2 mm × 1.60 mm
2 layer (2s)
(top layer copper：Rohm recommend land partten + measurement wiring, bottom layer copper area：74.2 mm × 74.2 mm、
Copper thickness (top and bottom layer) 2 oz)
JESD51 -5 / -7 compliance FR4 114.3 mm × 76.2 mm × 1.60 mm 4 layer (2s2p)
(top layer copper
：Rohm
recommend land pattern + measurement wiring / 2 layer, 3 layer, bottom layer copper area: 74.2 mm × 74.2 mm,
Copper thickness (top and bottom layer / inner layer) 2 oz / 1oz)
■
PCB layout 1s (1 layer)
Footprint Only
Figure 2. PCB layout 1s (1 layer)
Dimension
Board finish thickness
Board dimension
Board material
Copper thickness (Top layer)
Value
1.57 mm ± 10%
76.2 mm x 114.3 mm
FR4
0.070mm (Cu:2oz)
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BV1LB085FJ-C
Datasheet
■
PCB layout 2s (2layer)
Top Layer
Bottom Layer
Cross section
Top Layer
Bottom Layer
Figure 3. PCB layout 2s(2 layer)
Dimension
Board finish thickness
Board dimension
Board material
Copper thickness (Top/Bottom layers)
Value
1.60 mm ± 10%
76.2 mm x 114.3 mm
FR4
0.070mm (Cu + Plating)
■
PCB layout 2s2p (4layer)
Top Layer
2nd Layer
3rd Layer
Bottom Layer
Cross section
Top Layer
2nd/3rd/Bottom Layer
Figure 4. PCB layout 2s2p (4 layer)
Dimension
Board finish thickness
Board dimension
Board material
Copper thickness (Top/Bottom layers)
Copper thickness (Inner layers)
Value
1.60 mm ± 10%
76.2 mm x 114.3 mm
FR4
0.070mm (Cu + Plating)
0.035mm
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