NTC thermistors for
temperature measurement
SMD NTC thermistors,
EIA case size 0805 (2012), automotive series
Series/Type:
Date:
B574**V5
January 2018
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Temperature measurement and compensation
SMD NTC thermistors, case size 0805 (2012)
B574**V5
Automotive series
Applications
Temperature measurement and compensation
Features
Qualification based on AEC-Q200 Rev-D
Multilayer SMD NTC with inner electrodes
Nickel barrier termination
For temperature measurement up to 150
°C
Excellent long-term aging stability in high
temperature and high humidity environment
High mechanical robustness
Short response time
100% Pb free
UL approval (E69802)
Options
Alternative resistance ratings, resistance
tolerances and B value tolerances available on
request.
Delivery mode
Cardboard tape, 180-mm reel
General technical data
Operating temperature range
Max. power
Resistance tolerance
Rated temperature
Dissipation factor
Thermal cooling time constant
Heat capacity
Dimensional drawing
Dimensions in mm
Approx. weight 13 mg
T
op
(at 25
°C,
on PCB) P
251)
∆R
R
/R
R
T
R
(on PCB)
δ
th1)
(on PCB)
τ
c1)
C
th1)
40 ... 150
210
±3, ±5
25
approx. 3.5
approx. 10
approx. 35
°C
mW
%
°C
mW/K
s
mJ/K
1) Depends on mounting situation
Please read
Cautions and warnings
and
Important notes
at the end of this document.
Page 2 of 27
Temperature measurement and compensation
SMD NTC thermistors, case size 0805 (2012)
B574**V5
Automotive series
Electrical specification and ordering codes
R
25
Ω
4.7 k
4.7 k
10 k
10 k
10 k
22 k
33 k
47 k
100 k
∆R
R
/R
R
%
±3, ±5
±3, ±5
±3, ±5
±3, ±5
±3, ±5
±5
±3, ±5
±3, ±5
±3, ±5
No. of R/T
characteristic
8500
8507
8500
8502
8507
8507
8502
8502
8507
B
25/50
K
3590
4386
3590
3940
4386
4386
3940
3940
4386
B
25/85
K
3635
4455
3635
3980
4455
4455
3980
3980
4455
B
25/100
K
3650
±3%
4480
±3%
3650
±3%
4000
±3%
4480
±3%
4480
±3%
4000
±3%
4000
±3%
4480
±3%
Ordering code
B57442V5472+062
B57452V5472+062
B57442V5103+062
B57451V5103+062
B57452V5103+062
B57452V5223J062
B57451V5333+062
B57451V5473+062
B57452V5104+062
+ = Resistance tolerance
H =
±3%
J =
±5%
Please read
Cautions and warnings
and
Important notes
at the end of this document.
Page 3 of 27
Temperature measurement and compensation
SMD NTC thermistors, case size 0805 (2012)
B574**V5
Automotive series
Reliability data
Tests of SMD NTC thermistors are based on AEC-Q200 Rev-D. The parts are mounted on
standardized PCB.
Test
Pre- and
post-stress
electrical test
High temperature
exposure
(storage)
Temperature
cycling
Standard
Test conditions
Resistance at: 25
°C
and 100
°C
∆R
25
/R
25
Remarks
(typical)
Biased humidity
Operational life
External visual
Physical
dimensions
Resistance to
solvents
Mechanical shock
Test temperature: 150
°C
Duration: 1000 h
Unpowered
JESD22,
Lower test temperature: 40
°C
method JA-104 Upper test temperature: 150
°C
Number of cycles: 1000
Transfer time: < 10 s
Dwell time: 15 min
Air Air
MIL-STD-202, Test temperature: 85
°C
method 103
Rel. humidity of air: 85%
Duration: 1000 h
Test voltage: V
NTC
= 0.3 V DC
MIL-STD-202, Test temperature: 150
°C
method 108
P
max
= 0.35 mW
Duration: 1000 h
MIL-STD-883E, Visual inspection
method 2009
JESD22,
Measured with calibers
method JB-100
MIL-STD-202,
method 108
MIL-STD-202,
method 215
MIL-STD-202,
method 213
MIL-STD-202,
method 204
Not applicable for SMD thermistors
(component has no marking, color
coding or coating)
Peak value: 1500
g
Half sine
Condition F
Acceleration: 5
g
Sweep time: 20 min
Frequency range: 10 ... 2000 Hz
3
×
12 cycles
Dip: 260
°C;
10 s
1 heat cycle
< 5%
< 5%
< 5%
< 5%
Within the
specified
values
< 5%
Vibration
< 5%
Resistance to
soldering heat
MIL-STD-202,
method 210
< 3%
Please read
Cautions and warnings
and
Important notes
at the end of this document.
Page 4 of 27
Temperature measurement and compensation
SMD NTC thermistors, case size 0805 (2012)
B574**V5
Automotive series
Test
ESD
Standard
Test conditions
Solderability
Electrical
characterization
Flammability
AEC-Q200-002, Discharge capacitance: 150 pF
method -002
Discharge resistance: 2 kΩ
Charging voltage: 6 kV
Contact discharge
2 pulses in each polarity
J-STD-002
a) Dip: 235
°C;
5 s:
aging 4 h @ 155
°C
b) Dip: 215
°C;
5 s:
steam aging 8 h @ 92
°C
c) Dip: 260
°C;
7 s:
steam aging 8 h @ 92
°C
R(25
°C),
R(100
°C),
B(25/100)
∆R
25
/R
25
Remarks
(typical)
< 5%
95% of
termination
wetted
Within the
specified
values
Board flex
Terminal strength
Resistance drift
after soldering
Not applicable for SMD thermistors
(component is not coated or
encapsulated with plastic materials)
AEC-Q200-005, Max. bending: 2 mm
method -005
Duration @ max. bending: 60 s
AEC-Q200-006, Max. F: 17.7 N
method -006
Reflow soldering profile
Wave soldering profile
UL-94,
V-0 or V-1
< 5%
< 5%
< 1%
Please read
Cautions and warnings
and
Important notes
at the end of this document.
Page 5 of 27
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