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SC3200

Description
AMD GEODE-TM SC3200 PROCESSOR
File Size3MB,447 Pages
ManufacturerAMD
Websitehttp://www.amd.com
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SC3200 Overview

AMD GEODE-TM SC3200 PROCESSOR

AMD Geode™ SC3200 Processor
Data Book
March 2004
Publication ID: Revision 5.1
AMD Geode™ SC3200 Processor Data Book

SC3200 Related Products

SC3200 SC3200UCL-266F SC3200UCL-266 SC3200UFH-233 SC3200UFH-266F SC3200UFH-266 SC3200UFH-233F
Description AMD GEODE-TM SC3200 PROCESSOR AMD GEODE-TM SC3200 PROCESSOR AMD GEODE-TM SC3200 PROCESSOR AMD GEODE-TM SC3200 PROCESSOR AMD GEODE-TM SC3200 PROCESSOR AMD GEODE-TM SC3200 PROCESSOR AMD GEODE-TM SC3200 PROCESSOR
Is it Rohs certified? - conform to incompatible incompatible conform to incompatible conform to
Maker - AMD AMD AMD AMD AMD AMD
Parts packaging code - BGA BGA BGA BGA BGA BGA
package instruction - BGA, BGA432,31X31,50 BGA, BGA432,31X31,50 40 X 40 MM, 2.38 MM HEIGHT, 1.27 MM PITCH, PLASTIC, MS-034BAU-1, TEBGA-481 LEAD FREE, MS-034BAU-1, TEBGA-481 40 X 40 MM, 2.38 MM HEIGHT, 1.27 MM PITCH, PLASTIC, MS-034BAU-1, TEBGA-481 LEAD FREE, MS-034BAU-1, TEBGA-481
Contacts - 432 432 481 481 481 481
Reach Compliance Code - compli compli _compli unknow _compli unknow
ECCN code - 3A991.A.2 3A991.A.2 3A991.A.2 3A991.A.2 3A991.A.2 3A991.A.2
Address bus width - 13 13 13 32 13 32
bit size - 32 32 32 32 32 32
boundary scan - YES YES YES YES YES YES
maximum clock frequency - 27 MHz 27 MHz 27 MHz 27 MHz 27 MHz 27 MHz
External data bus width - 64 64 64 64 64 64
Format - FLOATING POINT FLOATING POINT FLOATING POINT FIXED POINT FLOATING POINT FIXED POINT
Integrated cache - YES YES YES YES YES YES
JESD-30 code - S-PBGA-B432 S-PBGA-B432 S-PBGA-B481 S-PBGA-B481 S-PBGA-B481 S-PBGA-B481
JESD-609 code - e1 e0 e0 e2 e0 e2
length - 40 mm 40 mm 40 mm 40 mm 40 mm 40 mm
low power mode - YES YES YES YES YES YES
Number of terminals - 432 432 481 481 481 481
Maximum operating temperature - 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - BGA BGA HBGA BGA HBGA BGA
Encapsulate equivalent code - BGA432,31X31,50 BGA432,31X31,50 BGA481,31X31,50 BGA481,31X31,50 BGA481,31X31,50 BGA481,31X31,50
Package shape - SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form - GRID ARRAY GRID ARRAY GRID ARRAY, HEAT SINK/SLUG GRID ARRAY GRID ARRAY, HEAT SINK/SLUG GRID ARRAY
Peak Reflow Temperature (Celsius) - 260 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply - 1.8,3.3 V 1.8,3.3 V 1.8,3.3 V 1.8,3.3 V 1.8,3.3 V 1.8,3.3 V
Certification status - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height - 1.75 mm 1.75 mm 2.59 mm 2.59 mm 2.59 mm 2.59 mm
speed - 266 MHz 266 MHz 233 MHz 266 MHz 266 MHz 233 MHz
Maximum supply voltage - 1.89 V 1.89 V 1.89 V 1.89 V 1.89 V 1.89 V
Minimum supply voltage - 1.71 V 1.71 V 1.71 V 1.71 V 1.71 V 1.71 V
Nominal supply voltage - 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
surface mount - YES YES YES YES YES YES
technology - CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level - OTHER OTHER OTHER OTHER OTHER OTHER
Terminal surface - TIN SILVER COPPER Tin/Lead (Sn/Pb) Tin/Lead (Sn63Pb37) Tin/Silver (Sn96.5Ag3.5) Tin/Lead (Sn63Pb37) Tin/Silver (Sn96.5Ag3.5)
Terminal form - BALL BALL BALL BALL BALL BALL
Terminal pitch - 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location - BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width - 40 mm 40 mm 40 mm 40 mm 40 mm 40 mm
uPs/uCs/peripheral integrated circuit type - MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR
Humidity sensitivity level - - - 3 3 3 3
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