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MRC1/25033R0FLF

Description
MELF Resistors
CategoryPassive components   
File Size241KB,2 Pages
ManufacturerTT Electronics
Download Datasheet Parametric View All

MRC1/25033R0FLF Overview

MELF Resistors

MRC1/25033R0FLF Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerTT Electronics
Product CategoryMELF Resistors
Mounting StylePCB Mount
Resistors
Metal Glaze™ High Power Density
Surface Mount Power Resistor
MRC Series
Metal Glaze High Power Density
MRC Series
Surface Mount Power Resistor
TM
1/2 watt in 1/8 watt package
MRC1/2: 0.05 Ω to 1.0 Ω (contact factory for higher values)
1/2 watt in 1/8 watt package
150°C maximum operating temperature
1 watt in 1/2 watt package (2010 footprint)
Superior surge handling capability
MRC1/2: 0.05
to 1.0
(contact factory for higher values)
RoHS compliant Versions available
150°C maximum operating temperature
Superior surge handling capability
Metal Glaze
thick film
element fired at 1000°C to
solid ceramic substrate
High temperature
dielectric coating
All Pb-free parts comply with EU Directive 2011/65/EU (RoHS2)
60/40 Solder over nickel barrier
Electrical Data
Size
Industry
Code
1
Footprint
IRC
Type
Max.
Power Rating
Working
Voltage
2
Max.
Resistance
TCR
Tolerance
Voltage Range (ohms)
3
(ppm/°C)
3
(±%)
3
0.1 to 0.99
C
1206
MRC1/2
1/2W @ 70°C
200
400
1.0 to 10K
20 to 10K
1,2,5
1,2,5
0.25, 0.5
100
50,100
50,100
Product
Catagory
Low Range
Standard
Tight Tolerance
MRC Applications:
The MRC1/2 will dissipate 1/2 watt at 70°C on a 1206 footprint. The MRC is recommended for applications where
board real estate is a major concern. Due to high power density and superior surge handling capability, it is also
recommended as a direct replacement on existing board designs where standard 1206 resistors are marginal or failing.
Environmental Data
Characteristics
Temperature Coefficient
Thermal Shock
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Bonding Exposure
Solderability
Moisture Resistance
Life Test
Terminal Adhesion Strength
Resistance to Board Bending
Maximum Change
As specified
±(0.5% + 0.01Ω)
±(0.25% + 0.01Ω)
±(1.0% + 0.01Ω)
±(0.5% + 0.01Ω)
±(0.25% + 0.01Ω)
95% minimum coverage
±(0.5% + 0.01Ω)
±(1.0% + 0.01Ω)
±(1% + 0.01Ω)
no mechanical damage
±(1% + 0.01Ω)
no mechanical damage
Test Method
MIL-R-55342E Par 4.7.9 (-55°C + 125°C)
MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles)
MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)
MIL-R-55342E Par 4.7.5
2.5 x
PxR for 5 seconds
MIL-R-55342E Par 4.7.6 (+150°C for 100 hours)
MIL-R-55342E Par 4.7.7
(Reflow soldered to board at 260°C for 10 seconds)
MIL-STD-202, Method 208 (245°C for 5 seconds)
MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours)
MIL-R-55342E Par 4.7.10 (2000 hours @ 70°C intermittent)
1200 gram push from underside of mounted chip
for 60 seconds
Chip mounted in center of 90mm long board, deflected 5mm
so as to exert pull on chip contacts for 10 seconds
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
http://www.ttelectronics.com/resistors
© TT Electronics plc
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