IN .............................................................–15V to 15V
FB, EN/SHDN ..........................–0.3V to DRV
CC
+ 0.3V
RBLANK, BLANK (LTC4441 Only)............ –0.3V to 5V
OUT Output Current ............................................ 100mA
Operating Junction Temperature Range
(Note 2) .................................................. –55°C to 125°C
Storage Temperature Range .................. –65°C to 150°C
Lead Temperature (Soldering, 10 sec).................. 300°C
pin conFiguraTion
TOP VIEW
PGND
BLANK
RBLANK
SGND
IN
1
2
3
4
5
10
9
8
7
6
OUT
DRV
CC
V
IN
FB
EN/SHDN
PGND 1
SGND 2
IN 3
EN/SHDN 4
TOP VIEW
8
7
6
5
OUT
DRV
CC
V
IN
FB
11
MSE PACKAGE
10-LEAD PLASTIC MSOP
T
JMAX
= 125°C,
θ
JA
= 38°C/W (Note 3)
EXPOSED PAD (PIN 11) IS GND, MUST BE SOLDERED TO PCB
S8 PACKAGE
8-LEAD PLASTIC SO
T
JMAX
= 125°C,
θ
JA
= 150°C/W
orDer inForMaTion
LEAD FREE FINISH
LTC4441EMSE#PBF
LTC4441IMSE#PBF
LTC4441MPMSE#PBF
LTC4441ES8-1#PBF
LTC4441IS8-1#PBF
LEAD BASED FINISH
LTC4441EMSE
LTC4441IMSE
LTC4441MPMSE
LTC4441ES8-1
LTC4441IS8-1
TAPE AND REEL
LTC4441EMSE#TRPBF
LTC4441IMSE#TRPBF
LTC4441MPMSE#TRPBF
LTC4441ES8-1#TRPBF
LTC4441IS8-1#TRPBF
TAPE AND REEL
LTC4441EMSE#TR
LTC4441IMSE#TR
LTC4441MPMSE#TR
LTC4441ES8-1#TR
LTC4441IS8-1#TR
PART MARKING*
LTBJQ
LTBJP
LTBJP
44411
4441I1
PART MARKING*
LTBJQ
LTBJP
LTBJP
44411
4441I1
PACKAGE DESCRIPTION
10-Lead Plastic MSOP
10-Lead Plastic MSOP
10-Lead Plastic MSOP
8-Lead Plastic SO
8-Lead Plastic SO
PACKAGE DESCRIPTION
10-Lead Plastic MSOP
10-Lead Plastic MSOP
10-Lead Plastic MSOP
8-Lead Plastic SO
8-Lead Plastic SO
TEMPERATURE RANGE
–40°C to 125°C
–40°C to 125°C
–55°C to 125°C
–40°C to 125°C
–40°C to 125°C
TEMPERATURE RANGE
–40°C to 125°C
–40°C to 125°C
–55°C to 125°C
–40°C to 125°C
–40°C to 125°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
For more information on lead free part marking, go to:
http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to:
http://www.linear.com/tapeandreel/
44411fa
2
LTC4441/LTC4441-1
elecTrical characTerisTics
SYMBOL
V
DRVCC
I
VIN
PARAMETER
Driver Supply Programmable Range
V
IN
Supply Current
EN/SHDN = 0V, IN = 0V
EN/SHDN = 5V, IN = 0V
f
IN
= 100kHz, C
OUT
= 4.7nF (Note 4)
V
IN
= 7.5V
V
IN
= 7.5V to 25V
Load = 0mA to 40mA
Load = 40mA
Rising Edge
Falling Edge
Rising Edge
Falling Edge
Rising-Falling Edge
V
IN
= ±10V
V
EN/SHDN
= 9V
Falling Edge
Rising Edge
Falling Edge
Rising-Falling Edge
I
OUT
= 100mA
DRV
CC
= 8V
DRV
CC
= 8V
IN = 0V, I
BLANK
= 100mA LTC4441 Only
RBLANK = 200kΩ LTC4441 Only
C
OUT
= 4.7nF (Note 5)
C
OUT
= 4.7nF (Note 5)
C
OUT
= 4.7nF (Note 5)
C
OUT
= 4.7nF (Note 5)
RBLANK = 200kΩ (Note 6)
l
l
l
l
l
l
The
l
denotes the specifications which apply over the full operating
junction temperature range, otherwise specifications are at T
A
= 25°C (Note 2). V
IN
= 7.5V, DRV
CC
= 5V, unless otherwise specified.
CONDITIONS
l
l
l
MIN
5
TYP
5
250
3
MAX
8
12
500
6
1.31
40
UNITS
V
μA
μA
mA
V
mV
%
mV
V
V
DRV
CC
Regulator
V
FB
ΔV
DRVCC(LINE)
V
DROPOUT
V
UVLO
Input
V
IH
V
IL
V
IH
-V
IL
I
INP
I
EN/SHDN
V
SHDN
V
EN
V
EN(HYST)
Output
R
ONL
I
PU
I
PD
R
ON(BLANK)
V
RBLANK
t
PHL
t
PLH
t
r
t
f
t
BLANK
Driver Output Pull-Down Resistance
Driver Output Peak Pull-Up Current
Driver Output Peak Pull-Down Current
BLANK Pin Pull-Down Resistance
RBLANK Pin Voltage
Driver Output High-Low Propagation Delay
Driver Output Low-High Propagation Delay
Driver Output Rise Time
Driver Output Fall Time
Driver Output High to BLANK Pin High
0.35
6
6
11
1.3
30
36
13
8
200
0.8
Ω
A
A
Ω
V
ns
ns
ns
ns
ns
IN Pin High Input Threshold
IN Pin Low Input Threshold
IN Pin Input Voltage Hysteresis
IN Pin Input Current
EN/SHDN Pin Input Current
EN/SHDN Pin Shutdown Threshold
EN/SHDN Pin Enable Threshold
EN/SHDN Pin Enable Hysteresis
2
1
2.4
1.4
1
±0.01
±0.01
0.45
1.036
1.21
1.09
0.12
1.145
±10
±1
2.8
1.8
V
V
V
μA
μA
V
V
V
V
Regulator Feedback Voltage
Regulator Line Regulation
Regulator Dropout Voltage
FB Pin UVLO Voltage
l
1.11
1.21
9
–0.1
370
1.09
0.97
ΔV
DRVCC(LOAD)
Load Regulation
Switching Timing
Note 1:
Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2:
The LTC4441/LTC4441-1 are tested under pulsed load conditions
such that T
J
≈ T
A
. The LTC4441E/LTC4441E-1 are guaranteed to meet
performance specifications from 0°C to 85°C operating junction
temperature. Specifications over the –40°C to 125°C operating junction
temperature range are assured by design characterization and correlation
with statistical process controls. The LTC4441I/LTC4441I-1 grade are
guaranteed over the –40°C to 125°C operating junction temperature
range. The LTC4441MP is guaranteed and tested over the full –55°C to
125°C operating junction temperature range. Note that the maximum
ambient temperature consistent with these specifications is determined by
specific operating conditions in conjunction with board layout, the rated
package thermal impedance and other environmental factors. The junction
temperature (T
J
, in °C) is calculated from the ambient temperature
(T
A
, in °C) and power dissipation (P
D
, in Watts) according to the formula:
T
J
= T
A
+ (P
D
•
θ
JA
)
where
θ
JA
(in °C/W) is the package thermal impedance.
44411fa
3
LTC4441/LTC4441-1
elecTrical characTerisTics
Note 3:
Failure to solder the Exposed Pad of the MSE package to the PC
board will result in a thermal resistance much higher than 38°C/W.
Note 4:
Supply current in normal operation is dominated by the current
needed to charge and discharge the external power MOSFET gate. This
current will vary with supply voltage, switching frequency and the external
MOSFETs used.
Note 5:
Rise and fall times are measured using 10% and 90% levels.
Delay times are measured from 50% of input to 20%/80% levels at driver
output.
Note 6:
Blanking time is measured from 50% of OUT leading edge to 10%
of BLANK with a 1kΩ pull-up at BLANK pin. LTC4441 only.
Note 7:
Guaranteed by design, not subject to test.
Note 8:
This IC includes overtemperature protection that is intended to
protect the device during momentary overload conditions. The junction
temperature will exceed 125°C when overtemperature protection is active.
Continuous operation above the maximum operating junction temperature
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