MF194
860 nm - 70 MHz High Performance LED
Data Sheet
September 2004
Ordering Information
MF194
MF194
MF194
MF194
MF194
ST
SC
SMA
FC
TO-46 Package
ST Housing
SC Housing
SMA Housing
FC Housing
-40
°
C to +85
°
C
Note: Rated Fiber coupled power apply only on the TO-46
package, for housing options fiber coupled power is
typically 10% less.
Features
•
•
•
860 nm Surface-Emitting LED
70 MHz Bandwidth
Designed for 50/125 µm fiber
Description
This device is designed for Ethernet and general
applications and offers an excellent price/performance
ratio for cost-effective solutions. Its double-lens optical
system results in optimum coupling of power into the
fiber.
Applications
•
•
•
LANs
Test Equipment
General Purpose
CASE
CATHODE
ANODE
CATHODE
ANODE
Bottom View
The diode chip is isolated from the case.
Figure 1 - Pin Diagram
Figure 2 - Functional Schematic
1
Zarlink Semiconductor Inc.
Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
Copyright 2001-2004, Zarlink Semiconductor Inc. All Rights Reserved.
MF194
Optical and Electrical Characteristics - Case Temperature 25
°
C
Parameter
Fiber-Coupled Power
(Figures 3, 4, and 5) (Table 1)
Rise and Fall Time (10-90%)
Bandwidth (3dB
el
)
Peak Wavelength
Spectral Width (FWHM)
Forward Voltage (Figure 7)
Reverse Current
Capacitance
Note 1:
Data Sheet
Symbol
P
fiber
t
r
,t
f
f
c
λ
p
∆λ
V
F
I
R
C
Min
25
Typ
45
5
70
Max
Unit
µW
Test Condition
I
F
=60 mA
(Note 1)
I
F
=60 mA
(no bias)
I
F
=60 mA
I
F
=60mA
I
F
=60 mA
I
F
=60 mA
V
R
=1 V
V
R
-0 V, f=1 MHz
Fiber:
50/125
µm
Graded
Index
NA=0.20
7
ns
MHz
840
860
50
1.7
250
880
1.9
20
nm
nm
V
µA
pF
Measured at the exit of 100 meters of fiber.
Absolute Maximum Ratings
Parameter
Storage Temperature
Operating Temperature (derating: Figure 6)
Electrical Power Dissipation (derating: Figure 6)
Continuous Forward Current (f<10 kHz)
Peak Forward Current (duty cycle<50%,f>1 MHz
Reverse Voltage
Soldering Temperature (2 mm from the case for 10 sec.)
Symbol
T
stg
T
op
P
tot
I
F
I
FRM
V
R
T
sld
Limit
-55 to +125
°
C
-40 to +85
°
C
160 mW
80 mA
130 mA
1.5 V
260
°
C
2
Zarlink Semiconductor Inc.
MF194
Thermal Characteristics
Parameter
Thermal Resistance - Infinite Heat Sink
Thermal Resistance - No Heat Sink
Temperature Coefficient - Optical Power
Temperature Coefficient - Wavelength
Symbol
R
thjc
R
thja
dP/dT
j
d
λ
/dT
j
-0.5
0.3
Min.
Typ.
Max.
200
500
Data Sheet
Unit
°
C/W
°
C/W
%/
°
C
nm/
°
C
Typical Fiber-Coupled Power
Core Diameter/Cladding Diameter Numerical Aperture
50/12 5µm
0.20
45
µW
62.5/125
µm
0.275
95
µW
100/140
µm
0.29
210
µW
200/230
µm
0.37
440
µW
3
Zarlink Semiconductor Inc.
MF194
100
Data Sheet
r
80
Relative Fiber-coupled Power (%)
r - optimal
Ø
C
= 50
µm
z
60
40
20
0
0.5
1
1.5
2
2.5
3
z - Axial Displacem ent of Fiber
(µm)
)
(m m
Figure 3 - Relative Fiber-coupled Power vs. z - Axial Displacement of Fiber
100
r
Relative Fiber-coupled Power (%)
80
z - optimal
Ø
C
= 50
µm
z
60
40
20
0
0
20
40
60
80
100
r - Radial Displacem ent of Fiber
(µm)
(m )
Figure 4 - Relative Fiber-coupled Power vs. r - Radial Displacement of Fiber
4
Zarlink Semiconductor Inc.
MF194
Data Sheet
100
Relative Fiber-coupled Power (%)
80
60
50% Duty Cycle
40
DC
20
Heat Sinked
0
0
20
40
60
80
100
120
140
160
180
200
Forw ard Current (m A)
Figure 5 - Relative Fiber-coupled Power vs. Forward Current
300
Max. Electrical Power Dissipation (mW)
250
Infinite Heat Sink
200
150
No Heat Sink
100
50
0
0
25
50
75
100
125
150
Operating Tem perature (
o
C)
Figure 6 - Max. Electrical Power Dissipation vs. Operating Temperature
5
Zarlink Semiconductor Inc.
京公网安备 11010802033920号
EEWORLD
