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BCN162ABI33J7

Description
RESISTOR, NETWORK, FILM, ISOLATED, 0.5 W, SURFACE MOUNT, 2112
CategoryPassive components   
File Size127KB,10 Pages
ManufacturerBITECH
Websitehttp://www.bitechnologies.com/
Download Datasheet Parametric View All

BCN162ABI33J7 Overview

RESISTOR, NETWORK, FILM, ISOLATED, 0.5 W, SURFACE MOUNT, 2112

BCN162ABI33J7 Parametric

Parameter NameAttribute value
Maximum operating temperature125 Cel
Minimum operating temperature-55 Cel
Number of functions4
Number of terminals8
Processing package descriptionChip, ROHS COMPLIANT
Lead-freeYes
EU RoHS regulationsYes
stateACTIVE
packaging shapeRectangular PACKAGE
Terminal shapeWRAPAROUND
terminal coatingNickel Tin
Installation featuressurface mount
Rated temperature70 Cel
Manufacturer SeriesBCN
size code2112
deviation5 %
CraftsmanshipMetallic glaze/THICK film
Network Typeisolation
Resistor typethin film
Operating Voltage75 V
Number of components1
Temperature Coefficient200
The first resistive element56 ohm
Component power consumption0.1250 W
Rated power P0.5000 W
MODEL BCN SERIES
Thick Film
Chip Resistor Arrays
MODEL STYLES
Edge Finish / Termination
Model (Width)
Model BCN 102 (1.0mm)
Model BCN 104 (1.0mm)
Model BCN 16 4ABI (1.6mm)
Model BCN 16 4A/AB (1.6mm)
Model BCN 16 8RB/8SB (1.6mm)
Model BCN 21 (2.1mm)
Model BCN 4D (3.1mm)
Model BCN 4DBI (3.1mm)
Model BCN 31 8RB/8SB (3.1mm)
Model BCN 31 8RBI/8SBI (3.1mm)
Jumper Chip Array
# of Resistors
2
4
4
4
8
8
4
4
8
8
4/8
2/4
Circuit
Isolated
Isolated
Isolated
Isolated
Bussed
Bussed
Isolated
Isolated
Bussed
Bussed
Isolated/Bussed
Isolated
Industry Size
0404
0804
1206
1206
1206
1608
2112
2112
2512
2512
1206/2512
0404/0804
Scalloped
Convex
Square
Convex
Square
Concave
4
FEATURES
BENEFITS
• Reliable monolithic construction
• Nickel barrier terminations
• Top side marking for easy identification
• Concave or convex termination styles
• Square or scalloped edges available
APPLICATIONS
• Saves board space over equivalent rated chip resistors
• Eliminates up to seven pick & place operations
• Single component reliability
• Leadless chip, reduced inductance
• Mounts close to active devices
• Pull up/pull down resistors for digital IC’s
• Series termination on high speed data busses
• Current limit for LED displays
Specifications subject to change without notice.
4-5
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