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B82412-A3270-+

Description
1 ELEMENT, 0.015 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
CategoryThe sensor   
File Size70KB,6 Pages
ManufacturerEPCOS (TDK)
Download Datasheet Parametric View All

B82412-A3270-+ Overview

1 ELEMENT, 0.015 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD

B82412-A3270-+ Parametric

Parameter NameAttribute value
Rated inductance0.0150 µH
Number of functions1
Number of terminals2
Minimum operating temperature-55 Cel
Maximum operating temperature125 Cel
self resonant frequency3000 MHz
Processing package descriptionROHS COMPLIANT
each_compliYes
EU RoHS regulationsYes
China RoHS regulationsYes
stateActive
Inductor typeGENERAL PURPOSE INDUCTOR
core materialCERAMIC
DC Resistance0.1200 ohm
Inductor applicationsRF INDUCTOR
jesd_609_codee4
Manufacturer SeriesB82412A
1 Minimum quality factor for rated value25
Maximum rated current0.6400 A
Shape and size descriptionRECTANGULAR PACKAGE
isolationNO
special functionQ MEASURED AT 100MHZ
surface mountYES
terminal coatingSILVER OVER COPPER
Terminal layoutDUAL ENDED
Terminal shapeFLAT
Test frequency10 MHz
deviation20 %
SMT Inductors, SIMID Series
SIMID 1210-01
Size 1210 (EIA) or 3225 (IEC)
Rated inductance 0,010 to 10
µH
Rated current 90 to 700 mA
Construction
s
s
s
s
B82412-A
Ceramic or ferrite core
Single-layer winding fixed by glue
US-welded winding
Without encapsulation
Features
s
s
s
s
Low height
High
Q
factor
High resonance frequency
Suitable for reflow (IR and vapor phase)
and wave soldering
Applications
s
s
s
s
Filtering of supply voltages, coupling, decoupling
Antenna systems
Automotive electronics
Telecommunications
Terminals
s
s
s
s
s
Silver-plated
1–2
µm
Cu, 4–6
µm
Ag
Base material CuSn6
Suitable for soldering and conductive adhesion
No leaching during wave soldering
Marking
No marking on component
Minimum data on reel:
Manufacturer, part number, ordering code,
L
value and tolerance of
L
value,
quantity, date of packing
Delivery mode
8-mm blister tape, wound on 180-mm or 330-mm
reel
For details on taping, packing and packing units
see page 153
87
04/00

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