Tantalum Chip Capacitors
Performance, High Temperature 175
°C
Series/Type:
Date:
B45196T, B45198T
July 2006
© KEMET 2006. Reproduction, publication and dissemination of this publication, enclosures hereto and the
information contained therein without KEMET's prior express consent is prohibited.
Tantalum chip capacitors
Performance, High Temperature 175
°C
Construction
Polar tantalum capacitors with solid
electrolyte
Conventional, optimized TaMnO
2
technology
Flame-retardant plastic case (UL 94 V-0)
Optionally tinned or gold-plated terminals
Features
Operating temperature up to 175
°C
Outstanding reliability
Very low failure rate
High volumetric efficiency
Excellent solderability
Stable temperature and frequency characteristics
Low leakage current, low dissipation factor
Low self-inductance
High resistance to shock and vibration
B45196T, B45198T
Suitable for use without series resistor
(special operating conditions recommended)
Lead-free and material content compatible with RoHS
Applications
Automotive electronics (safety applications e.g. airbag, ABS, motor management, electronic
control unit)
Measuring and control engineering (e.g. voltage regulators)
Medical engineering
DC/DC converters
Telecommunications (e.g. mobile phones, infrastructure)
Data processing (e.g. laptops, mainframes)
Soldering
Suitable for reflow soldering (IR and vapor phase, in compliance with JEDEC J-STD-020 C) and
wave soldering
Delivery mode
Taped and reeled in accordance with IEC 60286-3
Please read
Important notes
and
Cautions and warnings
at the end of this document.
Page 2 of 13
Tantalum chip capacitors
Performance, High Temperature 175
°C
Dimensional drawing
B45196T, B45198T
Encapsulation: molded epoxy resin
NiFe; tinned surface Sn100 or gold-plated
Reduced slot length for case size A
Dimensions
Case size
Dimensions in mm (inches)
EIA/IECQ
L
W
A
3216-18
3.2
±0.2
(.126
±0.008)
3.5
±0.2
(.138
±0.008)
6.0
±0.3
(.236
±0.012)
7.3
±0.3
(.287
±0.012)
1.6
±0.2
(.063
±0.008)
2.8
±0.2
(.110
±0.008)
3.2
±0.3
(.126
±0.012)
4.3
±0.3
(.169
±0.012)
H
B
3528-21
C
6032-28
D
7343-31
1.6
±0.2
(.063
±0.008)
1.9
±0.2
(.075
±0.008)
2.5
±0.3
(.098
±0.012)
2.8
±0.3
(.110
±0.012)
L
2
typ. W
2
±0.1
H
2
typ. P
±0.3
±(.004)
±(.012)
3.2
1.2
1.3
0.8
(.126) (.047)
(.051) (.031)
3.5
2.2
(.138) (.087)
6.1
2.2
(.240) (.087)
7.3
2.4
(.287) (.094)
1.4
0.7
(.055) (.027)
1.8
1.3
(.071) (.051)
1.8
1.3
(.071) (.051)
Please read
Important notes
and
Cautions and warnings
at the end of this document.
Page 3 of 13
Tantalum chip capacitors
Performance, High Temperature 175
°C
Marking
Case size A
Case size B
B45196T, B45198T
Case size C, D
Voltage coding for case size A
Rated voltage
Code letter
4
G
6.3 10
J
A
16
C
20
D
25
E
35
V
50
T
Capacitance coding
1st and 2nd digit
3rd digit
Capacitance in pF
Multiplier:
6 = 10
6
pF
7 = 10
7
pF
8 = 10
8
pF
Date coding
Year
S = 2004
T = 2005
U = 2006
V = 2007
W = 2008
X = 2009
Month
1 = January
2 = February
3 = March
4 = April
5 = May
6 = June
7 = July
8 = August
9 = September
O = October
N = November
D = December
Please read
Important notes
and
Cautions and warnings
at the end of this document.
Page 4 of 13
Tantalum chip capacitors
Performance, High Temperature 175
°C
Specifications and characteristics in brief
Series
Ordering code
Technology
Terminals
Rated voltage
(up to 85
°C)
(up to 125
°C)
(up to 150
°C)
(up to 175
°C)
(20
°C,
120 Hz)
(20
°C,
100 kHz)
(at 40
°C; ≤
V
R
,
R
S
≥
3
Ω/V)
≤0.8
≤2.5
(V
R
, 5 min, 20
°C)
( 55
°C/+125 °C/56
days damp heat
test)
I
leak
>500000
10
V
R
B45196T, B45198T
Performance,
High Temperature 175
°C
B45196T
Ta-MnO
2
Tinned
6.3 ... 35
4.0 ... 23
3.2 ... 17.5
2.1 ... 11.7
0.15 ... 150
±20%, ±10%
Z
max
T
op
0.5 ... 23
55 ... +175
Ω
°C
fit
B45198T
Ta-MnO
2
Gold-plated
VDC
Rated capacitance
Capacitance tolerance
Maximum impedance
Operating temperature range
Failure rate
(1 fit = 1 10
-9
failures/h)
C
R
V
R
≤
330
µF
V
C
R
V
R
> 330
µF
V
Service life
Leakage current
Detail specification
Climatic category
(to IEC 60068-1)
C
R
µF
h
nA/µC
CECC 30801-801/-802
55/125/56
Maximum working voltage at 175
°C:
0.33 V
R
(Maximum 500 h).
Details for this operating condition must be agreed upon between supplier and customer.
For high temperature types, individual tests are carried out under more extreme conditions,
supplementary to the tests specified by CECC.
Please read
Important notes
and
Cautions and warnings
at the end of this document.
Page 5 of 13
NXP MCU
京公网安备 11010802033920号
EEWORLD
