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Z02205

Description
1.2 kbps DATA, MODEM-SUPPORT CIRCUIT, PDIP28
CategoryTopical application    Wireless rf/communication   
File Size184KB,30 Pages
ManufacturerZilog, Inc.
Websitehttps://www.zilog.com/
Download Datasheet Parametric Compare View All

Z02205 Overview

1.2 kbps DATA, MODEM-SUPPORT CIRCUIT, PDIP28

Z02205 Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals28
Maximum operating temperature70 Cel
Minimum operating temperature0.0 Cel
Rated supply voltage5 V
Processing package descriptionPlastic, DIP-28
stateACTIVE
CraftsmanshipCMOS
packaging shapeRectangle
Package SizeIN-line
Terminal formTHROUGH-hole
Terminal spacing2.54 mm
terminal coatingtin lead
Terminal locationpair
Packaging MaterialsPlastic/Epoxy
Temperature levelCOMMERCIAL
data transfer rate1.2 kbps
Communication typeModem-Support Circuit
Z02205
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Z02205 Z0220516SSCR3641 Z0220516SSC1961 Z0220516PSCR4259 Z0220516PSCR4292 Z0220516PSCR3641
Description 1.2 kbps DATA, MODEM-SUPPORT CIRCUIT, PDIP28 1.2 kbps DATA, MODEM-SUPPORT CIRCUIT, PDIP28 1.2 kbps DATA, MODEM-SUPPORT CIRCUIT, PDIP28 1.2 kbps DATA, MODEM-SUPPORT CIRCUIT, PDIP28 1.2 kbps DATA, MODEM-SUPPORT CIRCUIT, PDIP28 1.2 kbps DATA, MODEM-SUPPORT CIRCUIT, PDIP28
Number of functions 1 1 1 1 1 1
Number of terminals 28 28 28 28 28 28
Maximum operating temperature 70 Cel 70 °C 70 °C 70 °C 70 °C 70 °C
Terminal form THROUGH-hole GULL WING GULL WING THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal location pair DUAL DUAL DUAL DUAL DUAL
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Is it Rohs certified? - incompatible incompatible incompatible incompatible incompatible
Maker - Zilog, Inc. Zilog, Inc. Zilog, Inc. Zilog, Inc. Zilog, Inc.
Parts packaging code - SOIC SOIC DIP DIP DIP
package instruction - SOP, SOP28,.4 SOP, SOP28,.4 DIP, DIP28,.6 DIP, DIP28,.6 DIP, DIP28,.6
Contacts - 28 28 28 28 28
Reach Compliance Code - unknown unknown unknown unknown unknown
Other features - DATA RATE MIN:75BPS DATA RATE MIN:75BPS DATA RATE MIN:75BPS DATA RATE MIN:75BPS DATA RATE MIN:75BPS
data rate - 1.2 Mbps 1.2 Mbps 1.2 Mbps 1.2 Mbps 1.2 Mbps
JESD-30 code - R-PDSO-G28 R-PDSO-G28 R-PDIP-T28 R-PDIP-T28 R-PDIP-T28
JESD-609 code - e0 e0 e0 e0 e0
length - 17.9 mm 17.9 mm 36.96 mm 36.96 mm 36.96 mm
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - SOP SOP DIP DIP DIP
Encapsulate equivalent code - SOP28,.4 SOP28,.4 DIP28,.6 DIP28,.6 DIP28,.6
Package shape - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form - SMALL OUTLINE SMALL OUTLINE IN-LINE IN-LINE IN-LINE
Peak Reflow Temperature (Celsius) - 225 225 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply - 5 V 5 V 5 V 5 V 5 V
Certification status - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height - 2.65 mm 2.65 mm 4.96 mm 4.96 mm 4.96 mm
Maximum slew rate - 0.025 mA 0.025 mA 0.025 mA 0.025 mA 0.025 mA
Nominal supply voltage - 5 V 5 V 5 V 5 V 5 V
surface mount - YES YES NO NO NO
technology - CMOS CMOS CMOS CMOS CMOS
Telecom integrated circuit types - MODEM-SUPPORT CIRCUIT MODEM-SUPPORT CIRCUIT MODEM-SUPPORT CIRCUIT MODEM-SUPPORT CIRCUIT MODEM-SUPPORT CIRCUIT
Terminal surface - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal pitch - 1.27 mm 1.27 mm 2.54 mm 2.54 mm 2.54 mm
Maximum time at peak reflow temperature - 30 30 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width - 7.5 mm 7.5 mm 15.24 mm 15.24 mm 15.24 mm
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