Tflex UT20000 Series
Ultra-Thin Thermal Gap Filler
Product Description
Tflex™ UT20000 is a specially formulated ultra-thin gap filler thermal interface material designed
for thin interfaces that offers excellent thermal performance and high compliancy. It is designed
without embedded reinforcing fiberglass to minimize contact resistance, yet still allows easy
material handling and durability during assembly.
Tflex™ UT20000 provides excellent interfacing and its ability to wet out mating surfaces allows for
efficient transfer of heat away from components. It is an ideal choice for low-pressure
applications and optimum solution in handheld devices with thin interface gap and limited space
requirements.
Tflex™ UT20000 is electrically non-conductive, stable from -50°C thru 200°C and offered in
thicknesses that range from 0.008” (200
µm)
up to 0.040” (1000
µm).
FEATURES AND BENEFITS
•
•
•
•
•
Thermal Conductivity of 3.0 W/mK
No fiberglass carrier to minimize thermal resistance, yet still easy to handle
Excellent surface wetting for low contact resistance
Unique formulation minimizes thermal resistance at low mounting forces
Environmentally friendly solution that meets regulatory requirements including RoHS
and REACH
SPECIFICATIONS
TYPICAL PROPERTIES
Construction & Composition
Color
Thickness Range
Thermal Conductivity (W/mK)
Density (g/cc)
Hardness (Shore 00)
Outgassing TML (weight %)
Outgassing CVCM (weight %)
Temperature Range
Rth@ 200 µm, 10 psi, 50
0
C
Dielectric Constant @ 1MHz
UL Flammability Rating
Volume Resistivity
VALUE
Ceramic filled silicone sheet
Grey
200 µm (0.008”)- 1000 µm (0.040”)
3.0
3.2
83.3 (200-375) µm
56.4 (400-1000) µm
0.34%
0.09%
-50°C to 200°C
0.25°C–in2/W
5.87
V-0
2.2 x 10
^15
ohm-cm
TEST METHOD
N/A
Visual
N/A
Hot Disk
Helium Pyncometer
ASTM D2240
ASTM E595
ASTM E595
Laird Test Method
ASTM D5470
ASTM D150
UL 94
ASTM D257
Americas: +1.866.928.8181
Europe: +49.(0).8031.2460.0
Asia: +86.755.2714.1166
www.lairdtech.com
Tflex UT20000 Series
Ultra-Thin Thermal Gap Filler
Tflex UT20000 Thermal Resistance vs Pressure
0.600 C-in2/W
0.500 C-in2/W
0.400 C-in2/W
0.300 C-in2/W
0.200 C-in2/W
0.100 C-in2/W
0.000 C-in2/W
10 psi 20 psi 30 psi 40 psi 50 psi 60 psi 70 psi 80 psi 90 psi 100 psi
8mils
10mils
16mils
20mils
30mils
40mils
AVAILABILITY
STANDARD THICKNESSES
•
0.008” (200 µm) up to 0.040” (1000 µm) thick material available in 25 µm increments
•
Available in standard sheet sizes of 18” x 18” and 9” x 9” or custom die cut parts. Custom die cut parts on a roll available for 200 µm
(0.008”) thru 375 µm (0.015”)
PART NUMBER SYSTEM
Tflex™ indicates Laird elastomeric thermal gap filler product line. UT20000 indicates Tflex UT20000 product line with thickness in microns
T f l e x UT2
Product code
0500
Pad thickness
µm
0250 => 250µm
0325 => 325µm
0500 => 500µm
1000 => 1000µm
EXAMPLES:
•
Tflex™ UT20200= 200 µm (0.008”) thick Tflex™ UT20000 material
•
Tflex™ UT20500= 500 µm (0.020”) thick Tflex™ UT20000 material
A17759-00 Tflex UT20000 DS 082417
Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end
user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non- infringement of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or
consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2013 Laird Technologies,
Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third
parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.
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