ZWIR4512AC1WI datasheet, PDF - EEWORLD Datasheet

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ZWIR4512AC1WI: DescriptionRF Modules Custom SMD / 30 / 17x28mm# - T&R - 7"; CategoryModule/solution; File Size390KB，27 Pages; ManufacturerIDT (Integrated Device Technology)

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ZWIR4512AC1WI Overview

RF Modules Custom SMD / 30 / 17x28mm# - T&R - 7"

ZWIR4512AC1WI Parametric

Parameter Name	Attribute value
Product Attribute	Attribute Value
Manufacturer	IDT (Integrated Device Technology)
Product Category	RF Modules
Product	RF Modules
Frequency	868 MHz, 915 MHz
Output Power	10 dBm
Interface Type	CAN, I2C, SPI, UART, USB
Operating Supply Voltage	2 V to 3.6 V
Supply Current Transmitting	16 mA
Supply Current Receiving	10.5 mA
Maximum Operating Temperature	+ 85 C
Dimensions	27.94 mm x 16.51 mm x 3.8 mm
Packaging	Reel
Antenna Connector Type	U.FL
Minimum Operating Temperature	- 40 C
Factory Pack Quantity	100

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Secure Low-Power

Wireless IPv6 Module

ZWIR4512

Datasheet

Brief Description

The ZWIR4512 enables secure low-power wireless

IPv6 communication for sensors and small devices.

IDT provides a user-programmable, royalty-free

6LoWPAN stack with mesh routing capability with

the ZWIR4512. 6LoWPAN is an Internet Engineer-

ing Task Force (IETF) standard for building wireless,

low-power IP-based sensor and device networks.

These networks can easily be integrated into exist-

ing IT infrastructure or operate autonomously.

Secure communication is provided by standard-

compliant implementations of the Internet Protocol

Security (IPSec) protocol suite and the Internet Key

Exchange Protocol version 2 (IKEv2), which enable

highly secure end-to-end communication, including

over unsecure network nodes.

The module is powered by an ARM Cortex™-M3

(ARM, Ltd. trademark) microcontroller and provides

a rich set of GPIO and peripheral interfaces. Up to

192kB of flash and 32kB of RAM are available for

applications. Different low power modes are pro-

vided to save energy in battery-operated devices.

The modules provide superior radio properties with-

out the need for complicated external RF design.

Hardware Features

•

License-free 868/915 MHz frequency bands

ARM Cortex™-M3 32-bit microcontroller

≤192kB

flash and 32kB RAM for user applications

Unique EUI64 address

4 channels in EU mode; 10 channels in US mode

19 (ZWIR4512AC1) or 21 (ZWIR4512AC2)

GPIOs with multiplexed peripheral functions:



2 x UART, SPI, 3 x ADC, 2 x DAC, 11 x PWM,

USB, CAN, I C™

(NXP trademark)

, 8 x timer



Several 5V tolerant I/Os available

•

Low current consumption: 3.5 µA in Standby

Mode; 10.5 mA in Receive Mode; 16.0 mA in

Transmit Mode @ 0 dBm

Modulation schemes



BPSK (20 kBps EU, 40 kBps US)



O-QPSK (100 kBps EU, 250 kBps US)

Receiver sensitivity: up to -110 dBm

TX output power: up to 10 dBm (US Mode)

Firmware Features

•

Benefits

•

Uniquely simple programmability

Standard-compliant security solution

No need for external microcontroller

Plug-and-play integration into local and wide-

area networks

No RF design required

2D barcode label containing MAC address

Superior radio propagation

ETSI/FCC certified

Serial command interface with built-in security

and over-the-air update (OTAU) functionality

Royalty-free library bundle for custom firmware:

6LoWPAN communication library with mesh

routing capability; IPSec and IKEv2 security

libraries; over-the-air update library; several

peripheral libraries

Available Support

•

Typical ZWIR4512 Application Setup

LAN

Specific Devices:

ZWIR45xx

Device

ZWIR45xx

Gateway

Off-the-Shelf

Components:

Cloud /

Internet

LAN

Router

Handheld

Device

•

Development Kit

Programming guide and application notes

Ethernet, USB and UART gateways

Free packet sniffer and example programs

demonstrating C-API usage

Windows® (Microsoft Corp. trademark) and

Linux® (Linus Torvalds trademark) support tools

Physical Characteristics

•

Supply voltage: 2.0 V to 3.6 V

Operating temperature: -40 °C to +85 °C

30-pin edge-board contact package or

32-pin land grid array package

PAN

WAN

Computer

January 27, 2016

ZWIR4512 Datasheet

Contents

Module Characteristics ........................................................................................................................................ 5

1.1. Absolute Maximum Ratings .......................................................................................................................... 5

1.1.1. Voltage Characteristics .......................................................................................................................... 5

1.1.2. Current Characteristics .......................................................................................................................... 5

1.1.3. Thermal Characteristics ......................................................................................................................... 5

1.2. Operating Conditions .................................................................................................................................... 5

1.2.1. General Operating Conditions ............................................................................................................... 5

1.2.2. Current Consumption per Operating Mode ............................................................................................ 7

Module Description .............................................................................................................................................. 7

2.1. Radio Transceiver ........................................................................................................................................ 8

2.2. Microcontroller .............................................................................................................................................. 8

2.2.1. MCU Core .............................................................................................................................................. 8

2.2.2. Peripherals and Interfaces ..................................................................................................................... 8

2.2.3. Programming and Debugging ................................................................................................................ 8

2.3. Firmware ....................................................................................................................................................... 9

2.3.1. Serial Command Interface (SCI) Firmware ............................................................................................ 9

2.3.2. C Application Programming Interface (C-API) ....................................................................................... 9

2.4. Power Modes ................................................................................................................................................ 9

2.4.1. Run Mode............................................................................................................................................. 10

2.4.2. Sleep Mode .......................................................................................................................................... 10

2.4.3. Stop Mode ............................................................................................................................................ 10

2.4.4. Standby Mode ...................................................................................................................................... 10

Application Circuits ............................................................................................................................................ 11

3.1. Power Supply.............................................................................................................................................. 11

3.2. Reset and Boot Select ................................................................................................................................ 12

3.3. Debug Access............................................................................................................................................. 12

3.4. Antenna ...................................................................................................................................................... 13

Pinout ................................................................................................................................................................ 14

Package Dimensions and PCB Footprints ........................................................................................................ 21

5.1. ZWIR4512AC1............................................................................................................................................ 21

5.2. ZWIR4512AC2............................................................................................................................................ 22

Soldering Information ........................................................................................................................................ 23

Customization .................................................................................................................................................... 24

Certification........................................................................................................................................................ 24

8.1. European R&TTE Directive Statements ..................................................................................................... 24

8.2. Federal Communication Commission Certification Statements ................................................................. 24

8.2.1. Statements ........................................................................................................................................... 24

January 27, 2016

ZWIR4512 Datasheet

8.2.2. Requirements ....................................................................................................................................... 25

8.3. Supported Antennas ................................................................................................................................... 25

9 Ordering Information ......................................................................................................................................... 25

10 Related Documents ........................................................................................................................................... 26

10.1. Documents Available from IDT ................................................................................................................... 26

10.2. Third-Party Documents ............................................................................................................................... 26

11 Glossary ............................................................................................................................................................ 26

12 Document Revision History ............................................................................................................................... 27

List of Figures

Figure 3.1

Figure 3.2

Figure 3.3

Figure 4.1

Figure 5.1

Figure 5.2

Figure 5.3

Figure 5.4

Figure 6.1

Figure 8.1

Power Supply Schemes ....................................................................................................................... 11

External Circuitry for /RESET and BSEL ............................................................................................. 12

JTAG / SWD Connection for Programming and Debugging ............................................................... 13

ZWIR4512ACx Pinout .......................................................................................................................... 14

ZWIR4512AC1 Package Drawing (top, side, and bottom view) .......................................................... 21

ZWIR4512AC1 Recommended PCB Footprint (in millimeters) ........................................................... 21

ZWIR4512AC2 Package Drawing (top, side and bottom view) ........................................................... 22

ZWIR4512AC2 Recommended PCB Footprint (in millimeters) ........................................................... 22

Recommended Temperature Profile for Reflow Soldering (according to J-STD-020D)...................... 23

FCC Compliance Statement to be Printed on Equipment Incorporating ZWIR4512 Devices ............. 25

List of Tables

Table 2.1

Table 3.1

Table 4.1

Table 4.2

Table 4.3

Table 5.1

Table 5.2

Table 6.1

Power Modes Overview ....................................................................................................................... 10

External Power Supply Components ................................................................................................... 11

ZWIR4512ACx Pin Description............................................................................................................ 15

ZWIR4512ACx GPIO Remapping ....................................................................................................... 18

ZWIR4512ACx GPIO Function Overview ............................................................................................ 19

ZWIR4512AC1 Physical Dimensions and Tolerances ........................................................................ 21

ZWIR4512AC2 Physical Dimensions and Tolerances ........................................................................ 22

Soldering Profile Parameters (according to J-STD-020D) .................................................................. 23

January 27, 2016

ZWIR4512AC1WI Related Products

	ZWIR4512AC1WI	ZWIR4512AC1RA	ZWIR4512AC2RA	ZWIR4512AC2RI	ZWIR4512AC2WI	ZWIR4512AC1RI
Description	RF Modules Custom SMD / 30 / 17x28mm# - T&R - 7"	RF Modules Custom SMD / 30 / 17x28mm# - T&R - 13"	RF Modules Custom SMD / 32 / 15,1x23,1mm# -T&R- 13"	RF Modules Custom SMD / 32 / 15,1x23,1mm# -T&R- 13"	RF Modules Custom SMD / 32 / 15,1x23,1mm# -T&R- 7"	RF Modules Custom SMD / 30 / 17x28mm# - T&R - 13"
Product Attribute	Attribute Value	Attribute Value	Attribute Value	Attribute Value	Attribute Value	Attribute Value
Manufacturer	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
Product Category	RF Modules	RF Modules	RF Modules	RF Modules	RF Modules	RF Modules
Product	RF Modules	RF Modules	RF Modules	RF Modules	RF Modules	RF Modules
Frequency	868 MHz, 915 MHz	868 MHz, 915 MHz	868 MHz, 915 MHz	868 MHz, 915 MHz	868 MHz, 915 MHz	868 MHz, 915 MHz
Output Power	10 dBm	10 dBm	10 dBm	10 dBm	10 dBm	10 dBm
Interface Type	CAN, I2C, SPI, UART, USB	CAN, I2C, SPI, UART, USB	CAN, I2C, SPI, UART, USB	CAN, I2C, SPI, UART, USB	CAN, I2C, SPI, UART, USB	CAN, I2C, SPI, UART, USB
Operating Supply Voltage	2 V to 3.6 V	2 V to 3.6 V	2 V to 3.6 V	2 V to 3.6 V	2 V to 3.6 V	2 V to 3.6 V
Supply Current Transmitting	16 mA	16 mA	16 mA	16 mA	16 mA	16 mA
Supply Current Receiving	10.5 mA	10.5 mA	10.5 mA	10.5 mA	10.5 mA	10.5 mA
Maximum Operating Temperature	+ 85 C	+ 85 C	+ 85 C	+ 85 C	+ 85 C	+ 85 C
Dimensions	27.94 mm x 16.51 mm x 3.8 mm	27.94 mm x 16.51 mm x 3.8 mm	23.1 mm x 15.1 mm x 3.8 mm	23.1 mm x 15.1 mm x 3.8 mm	23.1 mm x 15.1 mm x 3.8 mm	27.94 mm x 16.51 mm x 3.8 mm
Packaging	Reel	Reel	Reel	Reel	Reel	Reel
Antenna Connector Type	U.FL	U.FL	U.FL	U.FL	U.FL	U.FL
Minimum Operating Temperature	- 40 C	- 40 C	- 40 C	- 40 C	- 40 C	- 40 C
Factory Pack Quantity	100	500	500	500	100	500

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