BAS19 / BAS20
Taiwan Semiconductor
Small Signal Product
Surface Mount Fast Switching Diode
FEATURES
- Fast switching speed
- Surface mount device type
- High conductance
- For general purpose switching applications
- Packing code with suffix "G" means
green compound (halogen-free)
SOT-23
MECHANICAL DATA
- Case: SOT-23 small outline plastic package
- Terminal: Matte tin plated, lead free., solderable
per MIL-STD-202, Method 208 guaranteed
- High temperature soldering guaranteed : 260°C/10s
- Weight: 8 ± 0.5 mg
- BAS19 Marking Code: JP
- BAS20 Marking Code: JR
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
(T
A
=25°C unless otherwise noted)
PARAMETER
Working Peak Reverse Voltage DC Blocking Voltage
Average Rectifier Output Current
Power Dissipation
Thermal Resistance Junction to Ambient Air
Operating and Storage Temperature Range
Electrical Characteristics
PARAMETER
Reverse Breakdown Voltage
Peak Reverse Current
Forward Voltage
Junction Capacitance
Reverse Recovery Time
BAS19 I
R
= 100
μA
BAS20 I
R
= 100
μA
BAS19 V
R
= 100 V
BAS20 V
R
= 150 V
I
F
= 100 mA
I
F
= 200 mA
V
R
= 0 V , f = 1.0 MHz
I
F
= I
R
= 30 mA , I
RR
= 0.1 × I
R
SYMBOL
V
R(BR)
I
R
V
F
C
J
t
rr
MIN
100
150
-
-
-
-
MAX
-
0.1
1.0
1.25
5
50.0
UNIT
V
μA
V
pF
ns
SYMBOL
V
RM
I
O
P
D
R
θJA
T
J
, T
STG
BAS19
100
200
250
500
-65 to +150
o
BAS20
150
UNIT
V
mA
mW
C/W
o
C
Document Number: DS_S1412038
Version: B14
BAS19 / BAS20
Taiwan Semiconductor
Small Signal Product
RATINGS AND CHARACTERISTICS CURVES
(T
A
=25°C unless otherwise noted)
Fig. 1 Forward Characteristics
1000
I
F
, Instantaneous Forward Current (mA)
100
10
1
0.1
0.01
0
1
V
F
, Instantaneous Forward Voltage (V)
2
0.01
0
I
R
, Leakage Current (μA)
100
Fig. 2 Leakage Current VS. Junction temperature
10
1
0.1
100
T
j
, Junction Temperature (
o
C)
200
Document Number: DS_S1412038
Version: B14
BAS19 / BAS20
Taiwan Semiconductor
Small Signal Product
ORDERING INFORMATION
PART NO.
BASxx
(Note 1)
PART NO.
SUFFIX
(Note 2)
-xx
PACKING
CODE
RF
R5
PACKING CODE
SUFFIX
G
PACKAGE
SOT-23
PACKING
3K / 7" Reel
10K / 13" Reel
Note 1: "xx" is Device Code from "19" thru "20".
Note 2: Part No. Suffix „-xx “ would be used for special requirement
EXAMPLE
PREFERRED P/N PART NO.
BAS19 RF
BAS19
PART NO.
SUFFIX
PACKING CODE
RF
PACKING CODE
SUFFIX
DESCRIPTION
Multiple manufacture
source
G
Multiple manufacture
source
Green compound
Defined manufacture
source
Green compound
BAS19 RFG
BAS19
RF
BAS19-B0 RFG
BAS19
-B0
RF
G
PACKAGE OUTLINE DIMENSIONS
Unit (mm)
Min
2.70
1.10
0.30
1.78
2.10
0.89
Max
3.10
1.50
0.51
2.04
2.64
1.30
Unit (inch)
Min
0.106
0.043
0.012
0.070
0.083
0.035
Max
0.122
0.059
0.020
0.080
0.104
0.051
DIM.
A
B
C
D
E
F
G
H
0.55 REF
0.10 REF
0.022 REF
0.004 REF
SUGGEST PAD LAYOUT
DIM.
Z
X
Y
C
E
Unit (mm)
Typ.
2.8
0.7
0.9
1.9
1.0
Unit (inch)
Typ.
0.110
0.028
0.035
0.075
0.039
Document Number: DS_S1412038
Version: B14
BAS19 / BAS20
Taiwan Semiconductor
Small Signal Product
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_S1412038
Version: B14
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