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AT24C512B-W1.8-11

Description
64K X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8
Categorystorage    storage   
File Size337KB,18 Pages
ManufacturerAtmel (Microchip)
Download Datasheet Parametric Compare View All

AT24C512B-W1.8-11 Overview

64K X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8

AT24C512B-W1.8-11 Parametric

Parameter NameAttribute value
MakerAtmel (Microchip)
Parts packaging codeDIE
package instructionDIE,
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum clock frequency (fCLK)1 MHz
JESD-30 codeX-XUUC-N
memory density524288 bit
Memory IC TypeEEPROM
memory width8
Number of functions1
word count65536 words
character code64000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize64KX8
Package body materialUNSPECIFIED
encapsulated codeDIE
Package shapeUNSPECIFIED
Package formUNCASED CHIP
Parallel/SerialSERIAL
Certification statusNot Qualified
Serial bus typeI2C
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)1.8 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formNO LEAD
Terminal locationUPPER
Maximum write cycle time (tWC)5 ms
Base Number Matches1
Features
Low-voltage and Standard-voltage Operation
– 1.8 (V
CC
= 1.8V to 3.6V)
Internally Organized 65,536 x 8
Two-wire Serial Interface
Schmitt Triggers, Filtered Inputs for Noise Suppression
Bidirectional Data Transfer Protocol
1 MHz (3.6V), 400 kHz (1.8V) Compatibility
Write Protect Pin for Hardware and Software Data Protection
128-byte Page Write Mode (Partial Page Writes Allowed)
Self-timed Write Cycle (5 ms Max)
High Reliability
– Endurance: 1,000,000 Write Cycles
– Data Retention: 40 Years
Lead-free/Halogen-free Devices Available
8-lead PDIP, 8-lead JEDEC SOIC, 8-lead TSSOP,
8-lead LAP and 8-lead SAP Packages
Die Sales: Wafer Form, Waffle Pack and Bumped Die
Two-wire Serial
EEPROM
512K (65,536 x 8)
Description
The AT24C512B provides 524,288 bits of serial electrically erasable and programma-
ble read only memory (EEPROM) organized as 65,536 words of 8 bits each. The
device’s cascadable feature allows up to four devices to share a common two-wire
bus. The device is optimized for use in many industrial and commercial applications
where low-power and low-voltage operation are essential. The devices are available in
space-saving 8-pin PDIP, 8-lead JEDEC SOIC, 8-lead TSSOP, 8-lead Leadless Array
(LAP), and 8-lead SAP packages. In addition, the entire family is available in a 1.8V
(1.8V to 3.6V) version.
AT24C512B
with Three Device
Address Inputs
Preliminary
Table 1.
Pin Configurations
Pin Name
A0–A2
SDA
SCL
WP
NC
Function
Address Inputs
Serial Data
Serial Clock Input
Write Protect
No Connect
A0
A1
A2
GND
8-lead TSSOP
1
2
3
4
8
7
6
5
VCC
WP
SCL
SDA
A0
A1
A2
GND
8-lead PDIP
1
2
3
4
8
7
6
5
VCC
WP
SCL
SDA
8-lead SOIC
A0
A1
A2
GND
1
2
3
4
8
7
6
5
VCC
WP
SCL
SDA
8-lead Leadless Array
VCC
WP
SCL
SDA
8
7
6
5
1
2
3
4
A0
A1
A2
GND
VCC
WP
SCL
SDA
8-lead SAP
8
7
6
5
1
2
3
4
A0
A1
A2
GND
Bottom View
Bottom View
Rev. 5112A–SEEPR–8/05
1

AT24C512B-W1.8-11 Related Products

AT24C512B-W1.8-11 AT24C512BC1-10CU-1.8 AT24C512B-10PU-1.8 AT24C512BN-10SU-1.8 AT24C512BY4-10YU-1.8 AT24C512B-10TU-1.8
Description 64K X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8 64K X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8 64K X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8 64K X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8 64K X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8 64K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8
Maker Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) Atmel (Microchip)
Parts packaging code DIE SOIC DIP SOIC SOIC TSSOP
package instruction DIE, SON, 0.300 INCH, GREEN, PLASTIC, MS-001BA, DIP-8 SOP, HVSON, 4.40 MM, GREEN, PLASTIC, MO-153AA, TSSOP-8
Reach Compliance Code unknown unknown compliant unknown unknown compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum clock frequency (fCLK) 1 MHz 1 MHz 1 MHz 1 MHz 1 MHz 1 MHz
JESD-30 code X-XUUC-N R-XDSO-N8 R-PDIP-T8 R-PDSO-G8 R-XDSO-N8 R-PDSO-G8
memory density 524288 bit 524288 bit 524288 bit 524288 bit 524288 bit 524288 bit
Memory IC Type EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM
memory width 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1
word count 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words
character code 64000 64000 64000 64000 64000 64000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
organize 64KX8 64KX8 64KX8 64KX8 64KX8 64KX8
Package body material UNSPECIFIED UNSPECIFIED PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED PLASTIC/EPOXY
encapsulated code DIE SON DIP SOP HVSON TSSOP
Package shape UNSPECIFIED RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form UNCASED CHIP SMALL OUTLINE IN-LINE SMALL OUTLINE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Serial bus type I2C I2C I2C I2C I2C I2C
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
Nominal supply voltage (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
surface mount YES YES NO YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form NO LEAD NO LEAD THROUGH-HOLE GULL WING NO LEAD GULL WING
Terminal location UPPER DUAL DUAL DUAL DUAL DUAL
Maximum write cycle time (tWC) 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms
Base Number Matches 1 1 1 1 1 1
Contacts - 8 8 8 8 8
length - 8 mm 9.271 mm 4.9 mm 6 mm 4.4 mm
Number of terminals - 8 8 8 8 8
Maximum seat height - 1.14 mm 5.334 mm 1.75 mm 0.9 mm 1.2 mm
Terminal pitch - 1.27 mm 2.54 mm 1.27 mm 1.27 mm 0.65 mm
width - 5 mm 7.62 mm 3.9 mm 4.9 mm 3 mm

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