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AT24C512BC1-10CU-1.8

Description
64K X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8
Categorystorage    storage   
File Size337KB,18 Pages
ManufacturerAtmel (Microchip)
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AT24C512BC1-10CU-1.8 Overview

64K X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8

AT24C512BC1-10CU-1.8 Parametric

Parameter NameAttribute value
MakerAtmel (Microchip)
Parts packaging codeSOIC
package instructionSON,
Contacts8
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum clock frequency (fCLK)1 MHz
JESD-30 codeR-XDSO-N8
length8 mm
memory density524288 bit
Memory IC TypeEEPROM
memory width8
Number of functions1
Number of terminals8
word count65536 words
character code64000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize64KX8
Package body materialUNSPECIFIED
encapsulated codeSON
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Parallel/SerialSERIAL
Certification statusNot Qualified
Maximum seat height1.14 mm
Serial bus typeI2C
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)1.8 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationDUAL
width5 mm
Maximum write cycle time (tWC)5 ms
Base Number Matches1
Features
Low-voltage and Standard-voltage Operation
– 1.8 (V
CC
= 1.8V to 3.6V)
Internally Organized 65,536 x 8
Two-wire Serial Interface
Schmitt Triggers, Filtered Inputs for Noise Suppression
Bidirectional Data Transfer Protocol
1 MHz (3.6V), 400 kHz (1.8V) Compatibility
Write Protect Pin for Hardware and Software Data Protection
128-byte Page Write Mode (Partial Page Writes Allowed)
Self-timed Write Cycle (5 ms Max)
High Reliability
– Endurance: 1,000,000 Write Cycles
– Data Retention: 40 Years
Lead-free/Halogen-free Devices Available
8-lead PDIP, 8-lead JEDEC SOIC, 8-lead TSSOP,
8-lead LAP and 8-lead SAP Packages
Die Sales: Wafer Form, Waffle Pack and Bumped Die
Two-wire Serial
EEPROM
512K (65,536 x 8)
Description
The AT24C512B provides 524,288 bits of serial electrically erasable and programma-
ble read only memory (EEPROM) organized as 65,536 words of 8 bits each. The
device’s cascadable feature allows up to four devices to share a common two-wire
bus. The device is optimized for use in many industrial and commercial applications
where low-power and low-voltage operation are essential. The devices are available in
space-saving 8-pin PDIP, 8-lead JEDEC SOIC, 8-lead TSSOP, 8-lead Leadless Array
(LAP), and 8-lead SAP packages. In addition, the entire family is available in a 1.8V
(1.8V to 3.6V) version.
AT24C512B
with Three Device
Address Inputs
Preliminary
Table 1.
Pin Configurations
Pin Name
A0–A2
SDA
SCL
WP
NC
Function
Address Inputs
Serial Data
Serial Clock Input
Write Protect
No Connect
A0
A1
A2
GND
8-lead TSSOP
1
2
3
4
8
7
6
5
VCC
WP
SCL
SDA
A0
A1
A2
GND
8-lead PDIP
1
2
3
4
8
7
6
5
VCC
WP
SCL
SDA
8-lead SOIC
A0
A1
A2
GND
1
2
3
4
8
7
6
5
VCC
WP
SCL
SDA
8-lead Leadless Array
VCC
WP
SCL
SDA
8
7
6
5
1
2
3
4
A0
A1
A2
GND
VCC
WP
SCL
SDA
8-lead SAP
8
7
6
5
1
2
3
4
A0
A1
A2
GND
Bottom View
Bottom View
Rev. 5112A–SEEPR–8/05
1

AT24C512BC1-10CU-1.8 Related Products

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Description 64K X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8 64K X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8 64K X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8 64K X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8 64K X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8 64K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8
Maker Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) Atmel (Microchip)
Parts packaging code SOIC DIP SOIC SOIC DIE TSSOP
package instruction SON, 0.300 INCH, GREEN, PLASTIC, MS-001BA, DIP-8 SOP, HVSON, DIE, 4.40 MM, GREEN, PLASTIC, MO-153AA, TSSOP-8
Reach Compliance Code unknown compliant unknown unknown unknown compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum clock frequency (fCLK) 1 MHz 1 MHz 1 MHz 1 MHz 1 MHz 1 MHz
JESD-30 code R-XDSO-N8 R-PDIP-T8 R-PDSO-G8 R-XDSO-N8 X-XUUC-N R-PDSO-G8
memory density 524288 bit 524288 bit 524288 bit 524288 bit 524288 bit 524288 bit
Memory IC Type EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM
memory width 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1
word count 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words
character code 64000 64000 64000 64000 64000 64000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
organize 64KX8 64KX8 64KX8 64KX8 64KX8 64KX8
Package body material UNSPECIFIED PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED UNSPECIFIED PLASTIC/EPOXY
encapsulated code SON DIP SOP HVSON DIE TSSOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR UNSPECIFIED RECTANGULAR
Package form SMALL OUTLINE IN-LINE SMALL OUTLINE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE UNCASED CHIP SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Serial bus type I2C I2C I2C I2C I2C I2C
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
Nominal supply voltage (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
surface mount YES NO YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form NO LEAD THROUGH-HOLE GULL WING NO LEAD NO LEAD GULL WING
Terminal location DUAL DUAL DUAL DUAL UPPER DUAL
Maximum write cycle time (tWC) 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms
Base Number Matches 1 1 1 1 1 1
Contacts 8 8 8 8 - 8
length 8 mm 9.271 mm 4.9 mm 6 mm - 4.4 mm
Number of terminals 8 8 8 8 - 8
Maximum seat height 1.14 mm 5.334 mm 1.75 mm 0.9 mm - 1.2 mm
Terminal pitch 1.27 mm 2.54 mm 1.27 mm 1.27 mm - 0.65 mm
width 5 mm 7.62 mm 3.9 mm 4.9 mm - 3 mm
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