AT24C02B-W1.8-11 datasheet, PDF

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AT24C02B-W1.8-11: Description256 X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8; Categorystorage storage; File Size403KB，20 Pages; ManufacturerAtmel (Microchip)

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AT24C02B-W1.8-11 Overview

256 X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8

AT24C02B-W1.8-11 Parametric

Parameter Name	Attribute value
Parts packaging code	DIE
package instruction	DIE,
Reach Compliance Code	unknow
ECCN code	EAR99
Maximum clock frequency (fCLK)	1 MHz
JESD-30 code	X-XUUC-N
memory density	2048 bi
Memory IC Type	EEPROM
memory width	8
Number of functions	1
word count	256 words
character code	256
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	256X8
Package body material	UNSPECIFIED
encapsulated code	DIE
Package shape	UNSPECIFIED
Package form	UNCASED CHIP
Parallel/Serial	SERIAL
Certification status	Not Qualified
Serial bus type	I2C
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	1.8 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	NO LEAD
Terminal location	UPPER
Maximum write cycle time (tWC)	5 ms
Base Number Matches	1

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Features

•

Low-voltage and Standard-voltage Operation

– 1.8 (V

= 1.8V to 5.5V)

Internally Organized 256 x 8 (2K)

Two-wire Serial Interface

Schmitt Trigger, Filtered Inputs for Noise Suppression

Bidirectional Data Transfer Protocol

1 MHz (5V), 400 kHz (1.8V, 2.5V, 2.7V) Compatibility

Write Protect Pin for Hardware Data Protection

8-byte Page (2K) Write Modes

Partial Page Writes Allowed

Self-timed Write Cycle (5 ms max)

High-reliability

– Endurance: 1 Million Write Cycles

– Data Retention: 100 Years

•

8-lead PDIP, 8-lead JEDEC SOIC, 8-lead Mini-MAP (MLP 2x3), 5-lead SOT23,

8-lead TSSOP and 8-ball dBGA2 Packages

•

Lead-free/Halogen-free

•

Die Sales: Wafer Form, Waffle Pack and Bumped Wafers

•

Two-wire

Serial EEPROM

2K (256 x 8)

Description

The AT24C02B provides 2048

bits

of serial electrically erasable

and

programmable

read-only memory (EEPROM) organized

256 words of

8 bits

each. The device is

optimized for use in many industrial

and

commercial

applications

where low-power

and

low-voltage operation

are

essential. The AT24C02B is

available

in space-saving

8-lead

PDIP,

8-lead

JEDEC

SOIC, 8-lead

Mini-MAP (MLP 2x3)

5-lead

SOT23, 8-lead

TSSOP,

and 8-ball

dBGA2 packages

and

accessed

via

Two-wire serial interface.

addition,

the AT24C02B is

available

in 1.8V (1.8V to 5.5V) version.

AT24C02B

Table 1.

Pin Configuration

Pin Name

A0 - A2

SDA

SCL

GND

VCC

Function

Address Inputs

Serial

Data

Serial

Clock Input

Write Protect

No Connect

Ground

Power

Supply

8-lead Mini-MAP (MLP 2x3)

VCC

SCL

SDA

GND

8-ball dBGA2

VCC

SCL

SDA

GND

Bottom View

8-lead TSSOP

GND

VCC

SCL

SDA

GND

Bottom View

8-lead SOIC

VCC

SCL

SDA

5-lead SOT23

SCL

GND

SDA

VCC

GND

8-lead PDIP

VCC

SCL

SDA

5126B–SEEPR–10/05

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Description	256 X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8	256 X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8	256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8	256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8	256 X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8	256 X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8	256 X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8
Parts packaging code	DIE	DIP	TSSOP	SOIC	SON	BGA	TSOT
package instruction	DIE,	0.300 INCH, GREEN, PLASTIC, MS-001BA, DIP-8	TSSOP, TSSOP8,.25	0.150 INCH, GREEN, PLASTIC, MS-012AA, SOIC-8	VSON, SOLCC8,.11,20	1.50 X 2 MM, 0.50 MM PITCH, GREEN, DBGA2-8	TSSOP, TSOP5/6,.11,37
Reach Compliance Code	unknow	unknow	unknow	unknow	compli	unknow	unknow
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum clock frequency (fCLK)	1 MHz	1 MHz	1 MHz	1 MHz	1 MHz	1 MHz	1 MHz
JESD-30 code	X-XUUC-N	R-PDIP-T8	R-PDSO-G8	R-PDSO-G8	R-XDSO-N8	R-PBGA-B8	R-PDSO-G5
memory density	2048 bi	2048 bi	2048 bi	2048 bi	2048 bi	2048 bi	2048 bi
Memory IC Type	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM
memory width	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1
word count	256 words	256 words	256 words	256 words	256 words	256 words	256 words
character code	256	256	256	256	256	256	256
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	256X8	256X8	256X8	256X8	256X8	256X8	256X8
Package body material	UNSPECIFIED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	UNSPECIFIED	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIE	DIP	TSSOP	SOP	VSON	VFBGA	TSSOP
Package shape	UNSPECIFIED	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	UNCASED CHIP	IN-LINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	SMALL OUTLINE, VERY THIN PROFILE	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Serial bus type	I2C	I2C	I2C	I2C	I2C	I2C	I2C
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
Nominal supply voltage (Vsup)	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
surface mount	YES	NO	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	NO LEAD	THROUGH-HOLE	GULL WING	GULL WING	NO LEAD	BALL	GULL WING
Terminal location	UPPER	DUAL	DUAL	DUAL	DUAL	BOTTOM	DUAL
Maximum write cycle time (tWC)	5 ms	5 ms	5 ms	5 ms	5 ms	5 ms	5 ms
Base Number Matches	1	1	-	1	1	-	1
Is it Rohs certified?	-	conform to	conform to	conform to	conform to	conform to	conform to
Maker	-	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)	-	Atmel (Microchip)	Atmel (Microchip)
Contacts	-	8	8	8	8	8	5
Data retention time - minimum	-	100	100	100	100	100	100
Durability	-	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles
I2C control byte	-	1010DDDR	1010DDDR	1010DDDR	1010DDDR	1010DDDR	1010DDDR
JESD-609 code	-	e3	e3	e3	e4	e1	e3
length	-	9.271 mm	4.4 mm	4.9 mm	3 mm	2 mm	2.9 mm
Humidity sensitivity level	-	1	1	1	-	1	1
Number of terminals	-	8	8	8	8	8	5
Encapsulate equivalent code	-	DIP8,.3	TSSOP8,.25	SOP8,.25	SOLCC8,.11,20	BGA8,2X4,40/20	TSOP5/6,.11,37
Peak Reflow Temperature (Celsius)	-	260	260	260	-	260	260
power supply	-	2/5 V	2/5 V	2/5 V	2/5 V	2/5 V	2/5 V
Maximum seat height	-	5.334 mm	1.2 mm	1.75 mm	0.6 mm	0.91 mm	1.1 mm
Maximum standby current	-	0.000003 A	0.000003 A	0.000003 A	0.000003 A	0.000003 A	0.000003 A
Maximum slew rate	-	0.003 mA	0.003 mA	0.003 mA	0.003 mA	0.003 mA	0.003 mA
Terminal surface	-	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Nickel/Palladium/Gold (Ni/Pd/Au)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Matte Tin (Sn)
Terminal pitch	-	2.54 mm	0.65 mm	1.27 mm	0.5 mm	0.5 mm	0.95 mm
Maximum time at peak reflow temperature	-	40	40	40	-	40	40
width	-	7.62 mm	3 mm	3.9 mm	2 mm	1.5 mm	1.6 mm
write protect	-	HARDWARE	HARDWARE	HARDWARE	HARDWARE	HARDWARE	HARDWARE

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