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AT24C02BN-10SU-1.8

Description
256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8
Categorystorage    storage   
File Size403KB,20 Pages
ManufacturerAtmel (Microchip)
Environmental Compliance
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AT24C02BN-10SU-1.8 Overview

256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8

AT24C02BN-10SU-1.8 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerAtmel (Microchip)
Parts packaging codeSOIC
package instruction0.150 INCH, GREEN, PLASTIC, MS-012AA, SOIC-8
Contacts8
Reach Compliance Codeunknow
ECCN codeEAR99
Maximum clock frequency (fCLK)1 MHz
Data retention time - minimum100
Durability1000000 Write/Erase Cycles
I2C control byte1010DDDR
JESD-30 codeR-PDSO-G8
JESD-609 codee3
length4.9 mm
memory density2048 bi
Memory IC TypeEEPROM
memory width8
Humidity sensitivity level1
Number of functions1
Number of terminals8
word count256 words
character code256
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize256X8
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP8,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Parallel/SerialSERIAL
Peak Reflow Temperature (Celsius)260
power supply2/5 V
Certification statusNot Qualified
Maximum seat height1.75 mm
Serial bus typeI2C
Maximum standby current0.000003 A
Maximum slew rate0.003 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)1.8 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperature40
width3.9 mm
Maximum write cycle time (tWC)5 ms
write protectHARDWARE
Base Number Matches1
Features
Low-voltage and Standard-voltage Operation
– 1.8 (V
CC
= 1.8V to 5.5V)
Internally Organized 256 x 8 (2K)
Two-wire Serial Interface
Schmitt Trigger, Filtered Inputs for Noise Suppression
Bidirectional Data Transfer Protocol
1 MHz (5V), 400 kHz (1.8V, 2.5V, 2.7V) Compatibility
Write Protect Pin for Hardware Data Protection
8-byte Page (2K) Write Modes
Partial Page Writes Allowed
Self-timed Write Cycle (5 ms max)
High-reliability
– Endurance: 1 Million Write Cycles
– Data Retention: 100 Years
8-lead PDIP, 8-lead JEDEC SOIC, 8-lead Mini-MAP (MLP 2x3), 5-lead SOT23,
8-lead TSSOP and 8-ball dBGA2 Packages
Lead-free/Halogen-free
Die Sales: Wafer Form, Waffle Pack and Bumped Wafers
Two-wire
Serial EEPROM
2K (256 x 8)
Description
The AT24C02B provides 2048
bits
of serial electrically erasable
and
programmable
read-only memory (EEPROM) organized
as
256 words of
8 bits
each. The device is
optimized for use in many industrial
and
commercial
applications
where low-power
and
low-voltage operation
are
essential. The AT24C02B is
available
in space-saving
8-lead
PDIP,
8-lead
JEDEC
SOIC, 8-lead
Mini-MAP (MLP 2x3)
,
5-lead
SOT23, 8-lead
TSSOP,
and 8-ball
dBGA2 packages
and
is
accessed
via
a
Two-wire serial interface.
In
addition,
the AT24C02B is
available
in 1.8V (1.8V to 5.5V) version.
AT24C02B
Table 1.
Pin Configuration
Pin Name
A0 - A2
SDA
SCL
WP
NC
GND
VCC
Function
Address Inputs
Serial
Data
Serial
Clock Input
Write Protect
No Connect
Ground
Power
Supply
8-lead Mini-MAP (MLP 2x3)
VCC
WP
SCL
SDA
8
7
6
5
1
2
3
4
A0
A1
A2
GND
8-ball dBGA2
VCC
WP
SCL
SDA
8
7
6
5
1
A0
2
A1
3
A2
4
GND
Bottom View
8-lead TSSOP
A0
A1
A2
GND
1
2
3
4
8
7
6
5
VCC
WP
SCL
SDA
A0
A1
A2
GND
Bottom View
8-lead SOIC
1
2
3
4
8
7
6
5
VCC
WP
SCL
SDA
5-lead SOT23
SCL
GND
SDA
1
2
3
4
VCC
5
WP
A0
A1
A2
GND
8-lead PDIP
1
2
3
4
8
7
6
5
VCC
WP
SCL
SDA
5126B–SEEPR–10/05
1

AT24C02BN-10SU-1.8 Related Products

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Description 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8
Parts packaging code SOIC DIP TSSOP SON BGA DIE TSOT
package instruction 0.150 INCH, GREEN, PLASTIC, MS-012AA, SOIC-8 0.300 INCH, GREEN, PLASTIC, MS-001BA, DIP-8 TSSOP, TSSOP8,.25 VSON, SOLCC8,.11,20 1.50 X 2 MM, 0.50 MM PITCH, GREEN, DBGA2-8 DIE, TSSOP, TSOP5/6,.11,37
Reach Compliance Code unknow unknow unknow compli unknow unknow unknow
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum clock frequency (fCLK) 1 MHz 1 MHz 1 MHz 1 MHz 1 MHz 1 MHz 1 MHz
JESD-30 code R-PDSO-G8 R-PDIP-T8 R-PDSO-G8 R-XDSO-N8 R-PBGA-B8 X-XUUC-N R-PDSO-G5
memory density 2048 bi 2048 bi 2048 bi 2048 bi 2048 bi 2048 bi 2048 bi
Memory IC Type EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM
memory width 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1
word count 256 words 256 words 256 words 256 words 256 words 256 words 256 words
character code 256 256 256 256 256 256 256
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
organize 256X8 256X8 256X8 256X8 256X8 256X8 256X8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED PLASTIC/EPOXY UNSPECIFIED PLASTIC/EPOXY
encapsulated code SOP DIP TSSOP VSON VFBGA DIE TSSOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR UNSPECIFIED RECTANGULAR
Package form SMALL OUTLINE IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE GRID ARRAY, VERY THIN PROFILE, FINE PITCH UNCASED CHIP SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Serial bus type I2C I2C I2C I2C I2C I2C I2C
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
Nominal supply voltage (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
surface mount YES NO YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form GULL WING THROUGH-HOLE GULL WING NO LEAD BALL NO LEAD GULL WING
Terminal location DUAL DUAL DUAL DUAL BOTTOM UPPER DUAL
Maximum write cycle time (tWC) 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms
Is it Rohs certified? conform to conform to conform to conform to conform to - conform to
Maker Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) - Atmel (Microchip) - Atmel (Microchip)
Contacts 8 8 8 8 8 - 5
Data retention time - minimum 100 100 100 100 100 - 100
Durability 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles - 1000000 Write/Erase Cycles
I2C control byte 1010DDDR 1010DDDR 1010DDDR 1010DDDR 1010DDDR - 1010DDDR
JESD-609 code e3 e3 e3 e4 e1 - e3
length 4.9 mm 9.271 mm 4.4 mm 3 mm 2 mm - 2.9 mm
Humidity sensitivity level 1 1 1 - 1 - 1
Number of terminals 8 8 8 8 8 - 5
Encapsulate equivalent code SOP8,.25 DIP8,.3 TSSOP8,.25 SOLCC8,.11,20 BGA8,2X4,40/20 - TSOP5/6,.11,37
Peak Reflow Temperature (Celsius) 260 260 260 - 260 - 260
power supply 2/5 V 2/5 V 2/5 V 2/5 V 2/5 V - 2/5 V
Maximum seat height 1.75 mm 5.334 mm 1.2 mm 0.6 mm 0.91 mm - 1.1 mm
Maximum standby current 0.000003 A 0.000003 A 0.000003 A 0.000003 A 0.000003 A - 0.000003 A
Maximum slew rate 0.003 mA 0.003 mA 0.003 mA 0.003 mA 0.003 mA - 0.003 mA
Terminal surface Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) - Matte Tin (Sn)
Terminal pitch 1.27 mm 2.54 mm 0.65 mm 0.5 mm 0.5 mm - 0.95 mm
Maximum time at peak reflow temperature 40 40 40 - 40 - 40
width 3.9 mm 7.62 mm 3 mm 2 mm 1.5 mm - 1.6 mm
write protect HARDWARE HARDWARE HARDWARE HARDWARE HARDWARE - HARDWARE
Base Number Matches 1 1 - 1 - 1 1
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