to minimize resistive DC losses. Long-term hermeticity
is assured through use of parallel seam welded lid
attachment along with International Rectifier’s rugged
ceramic pin-to-package seal. Axial orientation of the
leads facilitates preferred bulkhead mounting to the
principal heat-dissipating surface.
Manufactured in a facility fully qualified to MIL-PRF-38534,
class K, these converters are fabricated utilizing DSCC
qualified processes and are fully compliant to Class K.
The complete suite of PI tests has been completed
including Group C life test. Variations in electrical,
mechanical and screening specifications can be
accommodated. Contact IR Santa Clara for special
requirements.
28V Input, Triple Output
ART
Features
n
n
n
n
n
n
n
n
n
n
n
n
n
n
n
Total Dose > 100 krad (Si), 2:1margin
No SEE to LET > 83 Mev
.
cm
2
/mg
Derated per MIL-STD-975 & MIL-STD-1547
Output Power Range 3 to 30 Watts
19 to 50 Volt Input Range
Input Undervoltage Lockout
High Electrical Efficiency > 83%
Full Performance from -55°C to +125°C
Continuous Short Circuit and Overload
Protection
12.8 W/in
3
Output Power Density
True Hermetic Package
External Inhibit Port
Externally Synchronizable
Fault Tolerant Design
5V,
±
12V or
±
15 V Outputs Available
www.irf.com
1
08/12/04
ART28XXT Series
SPECIFICATIONS
Absolute Maximum/Minimum Ratings
Note1
Recommended Operating Conditions
Note 2
Input Voltage
Minimum Output Current
Soldering Temperature
Storage Temperature
-0.5V to 80V
5% maximum rated
current, any output
300°C for 10 seconds
-65°C to +135°C
19V to 60V
19V to 50V for full derating
to MIL-STD-975
Output Power Range
3W to 30 W
Operating Temperature -55°C to +125°C
-55°C to +85°C for full
derating to MIL-STD-975
Input Voltage Range
Electrical Performance
-55°C < T
CASE
< +125°C, V
IN
=28V, C
L
=0
unless otherwise specified.
Parameter
Output voltage accuracy
Symbol
V
OUT
Conditions
I
OUT
= 1.5Adc, T
C
= +25°C
(main)
Min
4.95
±11.50
±14.50
3.0
(main)
(dual)
(main)
(dual)
(main)
(dual)
(main)
150
75
-15
-60
-180
-300
-10
-500
4.8
±11.1
±13.9
Max
5.05
Units
Vdc
I
OUT
= ±250mAdc, T
C
= +25°C ART2812(dual)
I
OUT
= ±250mAdc, T
C
= +25°C ART2815(dual)
Output power
Note 5
Output current
Note 5
P
OUT
I
OUT
19 Vdc< V
IN
< 50Vdc
19 Vdc< V
IN
< 50Vdc
150 mAdc < I
OUT
< 3000 mAdc
Line regulation
Note 3
VR
LINE
19 Vdc< V
IN
< 50Vdc
±75 mAdc < I
OUT
< ±750 mAdc
150 mAdc < I
OUT
< 3000 mAdc
Load regulation
Note 4
VR
LOAD
19 Vdc< V
IN
< 50Vdc
±75 mAdc < I
OUT
< ±750 mAdc
Cross regulation
Note 8
VR
CROSS
19 Vdc< V
IN
< 50Vdc
(dual)
Total regulation
VR
All conditions of Line, Load,
(main)
Cross Regulation, Aging,
Temperature and Radiation ART2812(dual)
ART2815(dual)
I
OUT
= minimum rated, Pin 3 open
Pin 3 shorted to pin 2 (disabled)
19 Vdc< V
IN
< 50Vdc
I
OUT
= 3000 mAdc (main), ±500 mAdc (dual)
19 Vdc< V
IN
< 50Vdc
I
OUT
= 3000 mAdc (main), ±500 mAdc (dual)
Sychronization input open. (pin 6)
I
OUT
= 3000 mAdc (main), ±500 mAdc (dual)
±12.50
±15.15
30
3000
750
+15
mV
+60
+180
mV
+300
+10
mV
+500
5.2
V
±12.9
±16.0
250
8.0
70
100
mA
mV
p.p
mA
p.p
kHz
%
W
mAdc
Input current
Output ripple voltage
Note 6
Input ripple current
Note 6
Switching frequency
Efficiency
I
IN
V
RIP
I
RIP
F
S
Eff
225
83
275
For Notes to SPECIFICATIONS, refer to page 3
2
www.irf.com
ART28XXT Series
Electrical Performance
(Continued)
Parameter
Enable Input
open circuit voltage
drive current (sink)
voltage range
Synchronization Input
frequency range
pulse high level
pulse low level
pulse rise time
pulse duty cycle
Synchronization Output
pulse high level
pulse low level
Power dissipation, load fault
Output response to step load
changes
Notes 7, 11
Recovery time from step load
changes
Notes 11, 12
Output response to step line
changes
Notes 10, 11
Recovery time from step line
changes
Notes 10, 11,13
Turn on overshoot
V
OS
Turn on delay
Note 14
Capacitive load
Notes 9, 10
Isolation
T
DLY
CL
ISO
I
OUT
= minimum and full rated
I
OUT
= minimum and full rated
No effect on DC performance
(main)
(dual)
100
P
D
V
TLD
T
TLD
V
TLN
External clock signal on Sync. input (pin 4)
Symbol
Conditions
MIN
3.0
0.1
-0.5
225
4.5
-0.5
40
20
3.7
0.0
MAX
5.0
50.0
310
10.0
0.25
80
4.3
0.25
16
Units
V
mA
V
Khz
V
V
V/µS
%
V
W
mV
PK
µS
mV
PK
Signal compatible with synchronization input
Short circuit, any output
10% Load to/from 50% load
50% Load to/from 100% load
10% Load to/from 50% load
50% Load to/from 100% load
I
OUT
= 3000 mAdc
V
IN
= 19 V to/from 50 V
I
OUT
= ±500 mAdc
I
OUT
= 3000 mAdc
V
IN
= 19 V to/from 50 V
I
OUT
= ±500 mAdc
(main)
(dual)
(main)
(dual)
(main)
(dual)
5.0
-350
-1050
-200
-200
200
200
200
200
350
1050
500
500
100
500
20
500
100
T
TLN
µS
mV
mS
µF
MΩ
500VDC Input to Output or any pin to case
(except pin 12)
Notes to SPECIFICATIONS
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
Operation outside absolute maximum/minimum limits may cause permanent damage to the device. Extended operation at the limits may permanently
degrade performance and affect reliability.
Device performance specified in Electrical Performance table is guaranteed when operated within recommended limits. Operation outside
recommended limits is not specified.
Parameter measured from 28V to 19 V or to 50V while loads remain fixed.
Parameter measured from nominal to minimum or maximum load conditions while line remains fixed.
Up to 750 mA is available from the dual outputs provided the total output power does not exceed 30W.
Guaranteed for a bandwidth of DC to 20MHz. Tested using a 20KHz to 2MHz bandwidth.
Load current is stepped for output under test while other outputs are fixed at half rated load.
Load current is fixed for output under test while other output loads are varied for any combination of minimum to maximum.
A capacitive load of any value from 0 to the specified maximum is permitted without comprise to DC performance. A capacitive load in excess of the
maximum limit may interfere with the proper operation of the converter’s short circuit protection, causing erratic behavior during turn on.
Parameter is tested as part of design characterization or after design or process changes. Thereafter, parameters shall be guaranteed to the limits
specified in the table.
Load transient rate of change, di/dt
≤
2 A/µSec.
Recovery time is measured from the initiation of the transient to where V
OUT
has returned to within ±1% of its steady state value.
Line transient rate of change, dv/dt
≤
50 V/µSec.
Turn on delay time is for either a step application of input power or a logical low to high transition on the enable pin (pin 3) while power is present at the
input.
www.irf.com
3
ART28XXT Series
Group A Tests
V
IN
= 28Volts, C
L
=0
unless otherwise specified.
Test
Output voltage accuracy
Symbol
V
OUT
Conditions unless otherwise specified
I
OUT
= 1.5 Adc
I
OUT
= ±250mAdc
I
OUT
= ±250mAdc
V
IN
= 19 V, 28V, 50 V
(main)
V
IN
19 V, 28V, 50 V
I
OUT
= 150, 1500, 3000mAdc
V
IN
= 19 V, 28V, 50 V
I
OUT
= ±75, ±310, ±625mAdc
I
OUT
= ±75, ±250, ±500mAdc
(main)
ART2812(dual)
ART2815(dual)
Group A
Subgroups
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
4, 5, 6
1
2, 3
1, 2, 3
4, 5, 6
4, 5, 6
4, 5, 6
4, 5, 6
MIN
4.95
±11.70
±14.50
3.0
150
75
4.8
±11.1
±14.0
MAX
5.05
±12.30
±15.15
30
3000
500
5.2
±12.9
±15.8
250
8.0
70
100
Units
V
Output power
Note 1
Output current
Note 1
Output regulation
Note 4
P
OUT
I
OUT
W
mA
(dual)
(main)
2812(dual)
2815(dual)
VR
V
Input current
Output ripple
Note 2
Input ripple
Note 2
Switching frequency
Efficiency
Power dissipation,
load fault
Output response to step
load changes
Notes 3, 5
Recovery time from step
load changes
Notes 5, 6
I
IN
V
RIP
I
RIP
F
S
Eff
P
D
I
OUT
= minimum rated, Pin 3 open
Pin 3 shorted to pin 2 (disabled)
V
IN
= 19 V, 28V, 50 V
I
OUT
= 3000mA main, ±500mA dual
V
IN
= 19 V, 28V, 50 V
I
OUT
= 3000mA main, ±500mA dual
Synchronization pin (pin 6) open
I
OUT
= 3000mA main, ±500mA dual
Short circuit, any output
10% Load to/from 50% load
50% Load to/from 100% load
10% Load to/from 50% load
mA
mV
P-P
mA
P-P
KHz
%
225
83
81
275
16
-200
-200
200
200
200
200
100
500
5.0
100
20
W
V
TL
mV
PK
T
TL
50% Load to/from 100% load
(main)
I
OUT
= minimum and full rated
I
OUT
= minimum and full rated
500VDC Input to output or any pin to case
(except pin 12)
µS
4, 5, 6
4, 5, 6
4, 5, 6
1
Turn on overshoot
Turn on delay
Note 7
Isolation
V
OS
T
DLY
ISO
(dual)
mV
mS
MΩ
Notes to Group A Test Table
1.
2.
3.
4.
5.
6.
7.
8.
Parameter verified during dynamic load regulation tests.
Guaranteed for DC to 20 MHz bandwidth. Test conducted using a 20KHz to 2MHz bandwidth.
Load current is stepped for output under test while other outputs are fixed at half rated load.
Each output is measured for all combinations of line and load. Only the minimum and maximum readings for each output are recorded.
Load step transition time
≥
10µS.
Recovery time is measured from the initiation of the transient to where V
OUT
has returned to within ±1% of its steady state value.
Turn on delay time is tested by application of a logical low to high transition on the enable pin (pin 3) with power present at the input.
Subgroups 1 and 4 are performed at +25ºC, subgroups 2 and 5 at -55ºC and subgroups 3 and 6 at +125ºC.
4
www.irf.com
ART28XXT Series
Radiation Performance
The radiation tolerance characteristics inherent in the
ART28XXT converter are the direct result of a carefully
planned ground-up design program with specific radiation
design goals. After identification of the general circuit
topology, a primary task of the design effort was selection
of appropriate elements from the list of devices for which
extensive radiation effects data was available. By imposing
sufficiently large margins on those electrical parameters
subject to the degrading effects of radiation, designers
were able to select appropriate elements for incorporation
into the circuit. Known radiation data was utilized for input
to PSPICE and RadSPICE in the generation of circuit
Please, can you give me a driverstudio? I downloaded several from the Internet, but they can't be used because the lib library is missing! My email is zhangyifeng.1986@163.com QQ 418641492...
Guangzhou Keying Automation Instrument Equipment Co., Ltd. is recruiting technical engineers, LED landscape lighting and energy-saving designers ! Technical Engineer Job Responsibilities: A. College d...
The process of making a phone call with AT commands. Is the next AT command sent only after the previous AT command returns OK? (Is the program controlling that the next AT command is sent only after ...
[size=4]Forum activity (ongoing): [url=https://bbs.eeworld.com.cn/thread-578778-1-1.html] [Reading check-in activity]: Open the book "RF Technology For Dummies Series" and talk about the RF world in t...
The TI classroom is very good; I like it very much; Teacher Li Wei’s “Basic Knowledge of DC-DC Power Supply” is very good!! I like it very much!! Can Teacher Li Wei talk about some detailed theoretica...
1. System Structure
This system is a simulation system of indoor air-conditioning temperature/humidity control system. The data acquisition and control center collects temperature/humidity...[Details]
1 Embedded Systems
Embedded System refers to a collection of computer hardware and software with specific functions or purposes, which is divided into embedded software system and embe...[Details]
Against the backdrop of global warming, energy conservation and emission reduction have become a global hotspot and focus, which has also sounded the clarion call for the take-off of the LED lighti...[Details]
1 Introduction
Washing machines are an indispensable household appliance in the home, and they are developing very fast. Fully automatic washing machines are favored by everyone because of their con...[Details]
As a type of iron battery, lithium iron phosphate battery (hereinafter referred to as lithium iron battery) has always been widely concerned by industry friends (some people say that lithium iron b...[Details]
In recent years, network technology has developed rapidly, especially the rapid development of peer-to-peer networks, which has become one of the focuses of the industry. Related applications based on...[Details]
illustrate]
This method has
the characteristics of small
ROM
occupation
and fast operation speed, with a range of
2000
ßà
2099
,
a total of
...[Details]
Tags: PMP Digital Signal Processing
Many observers and analysts agree that there will be only two hot technology topics in the field of electronic engineering and applications this year: o...[Details]
Electrolyte is one of the core materials that constitute the capacity of lithium secondary batteries and lithium primary batteries that are the energy sources of mobile phones, notebooks, video rec...[Details]
Power socket boxes are installed in different locations in each room of the home for various electrical appliances. The nominal capacity is 10A and 16A, and the appearance is shown in Figure 1 (Fig...[Details]
1 Introduction
Fieldbus technology is one of the hot spots in the development of automation today, and is an important technology for realizing industrial control networking. Many automation c...[Details]
At present, IIC and other serial output real-time clocks are mostly used, but most MCUs do not have hardware IIC
and
can only be simulated through IO. If the MCU is read once per second, it wil...[Details]
1. Introduction
2. Introduction to the measurement functions of Anritsu vector network analyzers
A vector network analyzer can measure all parameters b...[Details]
Embedded System
京公网安备 11010802033920号
EEWORLD
