5962-88736013X datasheet, PDF - EEWORLD Datasheet

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5962-88736013X: DescriptionPipeline Register, 8-Bit, CMOS, LCC-28; CategoryMicrocontrollers and processors; File Size156KB，6 Pages; ManufacturerIDT (Integrated Device Technology)

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Pipeline Register, 8-Bit, CMOS, LCC-28

5962-88736013X Parametric

Parameter Name	Attribute value
Maker	IDT (Integrated Device Technology)
Parts packaging code	QLCC
package instruction	QCCN,
Contacts	28
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Other features	MULTIPLEXED OUTPUT; ICC SPECIFIED @ 5MHZ
boundary scan	NO
External data bus width	8
JESD-609 code	e0
length	11.4554 mm
low power mode	NO
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Output data bus width	8
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN
Package form	CHIP CARRIER
Certification status	Not Qualified
Maximum seat height	2.54 mm
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	TIN LEAD
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
width	11.4554 mm
uPs/uCs/peripheral integrated circuit type	DSP PERIPHERAL, PIPELINE REGISTER
Base Number Matches	1

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5962-88736013X Related Products

	5962-88736013X	5962-8873603LX	5962-8873603KX	5962-88736033X	5962-8873601LX	5962-8873601KX
Description	Pipeline Register, 8-Bit, CMOS, LCC-28	Pipeline Register, 8-Bit, CMOS, 0.300 INCH, CERDIP-24	Pipeline Register, 8-Bit, CMOS, CERPACK-24	Pipeline Register, 8-Bit, CMOS, LCC-28	Pipeline Register, 8-Bit, CMOS, CDIP24, 0.300 INCH, CERDIP-24	Pipeline Register, 8-Bit, CMOS, CERPACK-24
Parts packaging code	QLCC	DIP	DFP	QLCC	DIP	DFP
package instruction	QCCN,	DIP,	DFP,	QCCN,	DIP,	DFP,
Contacts	28	24	24	28	24	24
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C
Other features	MULTIPLEXED OUTPUT; ICC SPECIFIED @ 5MHZ	MULTIPLEXED OUTPUT; ICC SPECIFIED @ 5MHZ	MULTIPLEXED OUTPUT; ICC SPECIFIED @ 5MHZ	MULTIPLEXED OUTPUT; ICC SPECIFIED @ 5MHZ	MULTIPLEXED OUTPUT; ICC SPECIFIED @ 5MHZ	MULTIPLEXED OUTPUT; ICC SPECIFIED @ 5MHZ
boundary scan	NO	NO	NO	NO	NO	NO
External data bus width	8	8	8	8	8	8
JESD-609 code	e0	e0	e0	e0	e0	e0
low power mode	NO	NO	NO	NO	NO	NO
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
Output data bus width	8	8	8	8	8	8
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
encapsulated code	QCCN	DIP	DFP	QCCN	DIP	DFP
Package form	CHIP CARRIER	IN-LINE	FLATPACK	CHIP CARRIER	IN-LINE	FLATPACK
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.54 mm	5.08 mm	2.286 mm	2.54 mm	5.08 mm	2.286 mm
Maximum supply voltage	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	NO	YES	YES	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD
Terminal form	NO LEAD	THROUGH-HOLE	FLAT	NO LEAD	THROUGH-HOLE	FLAT
Terminal pitch	1.27 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm	1.27 mm
Terminal location	QUAD	DUAL	DUAL	QUAD	DUAL	DUAL
width	11.4554 mm	7.62 mm	9.144 mm	11.4554 mm	7.62 mm	9.144 mm
uPs/uCs/peripheral integrated circuit type	DSP PERIPHERAL, PIPELINE REGISTER	DSP PERIPHERAL, PIPELINE REGISTER	DSP PERIPHERAL, PIPELINE REGISTER	DSP PERIPHERAL, PIPELINE REGISTER	DSP PERIPHERAL, PIPELINE REGISTER	DSP PERIPHERAL, PIPELINE REGISTER
Base Number Matches	1	1	1	1	1	1
length	11.4554 mm	32.004 mm	-	11.4554 mm	32.004 mm	-

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