5962-8873603LX datasheet, PDF - EEWORLD Datasheet

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5962-8873603LX: DescriptionPipeline Register, 8-Bit, CMOS, 0.300 INCH, CERDIP-24; CategoryThe embedded processor and controller Microcontrollers and processors; File Size156KB，6 Pages; ManufacturerIDT (Integrated Device Technology)

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5962-8873603LX Overview

Pipeline Register, 8-Bit, CMOS, 0.300 INCH, CERDIP-24

5962-8873603LX Parametric

Parameter Name	Attribute value
Parts packaging code	DIP
package instruction	DIP,
Contacts	24
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Other features	MULTIPLEXED OUTPUT; ICC SPECIFIED @ 5MHZ
boundary scan	NO
External data bus width	8
JESD-609 code	e0
length	32.004 mm
low power mode	NO
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Output data bus width	8
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Package form	IN-LINE
Certification status	Not Qualified
Maximum seat height	5.08 mm
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	TIN LEAD
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	7.62 mm
uPs/uCs/peripheral integrated circuit type	DSP PERIPHERAL, PIPELINE REGISTER
Base Number Matches	1

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5962-8873603LX Related Products

	5962-8873603LX	5962-8873603KX	5962-88736033X	5962-8873601LX	5962-8873601KX	5962-88736013X
Description	Pipeline Register, 8-Bit, CMOS, 0.300 INCH, CERDIP-24	Pipeline Register, 8-Bit, CMOS, CERPACK-24	Pipeline Register, 8-Bit, CMOS, LCC-28	Pipeline Register, 8-Bit, CMOS, CDIP24, 0.300 INCH, CERDIP-24	Pipeline Register, 8-Bit, CMOS, CERPACK-24	Pipeline Register, 8-Bit, CMOS, LCC-28
Parts packaging code	DIP	DFP	QLCC	DIP	DFP	QLCC
package instruction	DIP,	DFP,	QCCN,	DIP,	DFP,	QCCN,
Contacts	24	24	28	24	24	28
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C
Other features	MULTIPLEXED OUTPUT; ICC SPECIFIED @ 5MHZ	MULTIPLEXED OUTPUT; ICC SPECIFIED @ 5MHZ	MULTIPLEXED OUTPUT; ICC SPECIFIED @ 5MHZ	MULTIPLEXED OUTPUT; ICC SPECIFIED @ 5MHZ	MULTIPLEXED OUTPUT; ICC SPECIFIED @ 5MHZ	MULTIPLEXED OUTPUT; ICC SPECIFIED @ 5MHZ
boundary scan	NO	NO	NO	NO	NO	NO
External data bus width	8	8	8	8	8	8
JESD-609 code	e0	e0	e0	e0	e0	e0
low power mode	NO	NO	NO	NO	NO	NO
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
Output data bus width	8	8	8	8	8	8
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP	DFP	QCCN	DIP	DFP	QCCN
Package form	IN-LINE	FLATPACK	CHIP CARRIER	IN-LINE	FLATPACK	CHIP CARRIER
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.08 mm	2.286 mm	2.54 mm	5.08 mm	2.286 mm	2.54 mm
Maximum supply voltage	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	YES	NO	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD
Terminal form	THROUGH-HOLE	FLAT	NO LEAD	THROUGH-HOLE	FLAT	NO LEAD
Terminal pitch	2.54 mm	1.27 mm	1.27 mm	2.54 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	QUAD	DUAL	DUAL	QUAD
width	7.62 mm	9.144 mm	11.4554 mm	7.62 mm	9.144 mm	11.4554 mm
uPs/uCs/peripheral integrated circuit type	DSP PERIPHERAL, PIPELINE REGISTER	DSP PERIPHERAL, PIPELINE REGISTER	DSP PERIPHERAL, PIPELINE REGISTER	DSP PERIPHERAL, PIPELINE REGISTER	DSP PERIPHERAL, PIPELINE REGISTER	DSP PERIPHERAL, PIPELINE REGISTER
Base Number Matches	1	1	1	1	1	1
length	32.004 mm	-	11.4554 mm	32.004 mm	-	11.4554 mm

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