MC74HC133DDS datasheet, PDF - EEWORLD Datasheet

MC74HC133DDS: DescriptionIC,LOGIC GATE,13-INPUT NAND,HC-CMOS,SOP,16PIN,PLASTIC; Categorylogic; File Size206KB，3 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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MC74HC133DDS Overview

IC,LOGIC GATE,13-INPUT NAND,HC-CMOS,SOP,16PIN,PLASTIC

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	NXP
package instruction	SOP, SOP16,.25
Reach Compliance Code	unknown
JESD-30 code	R-PDSO-G16
JESD-609 code	e0
Logic integrated circuit type	NAND GATE
Number of terminals	16
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP16,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
power supply	2/6 V
Schmitt trigger	NO
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Base Number Matches	1

	MC74HC133DDS	MC74HC133ND	MC54HC133J	MC74HC133N	MC54HC133JDS
Description	IC,LOGIC GATE,13-INPUT NAND,HC-CMOS,SOP,16PIN,PLASTIC	IC,LOGIC GATE,13-INPUT NAND,HC-CMOS,DIP,16PIN,PLASTIC	IC,LOGIC GATE,13-INPUT NAND,HC-CMOS,DIP,16PIN,CERAMIC	IC,LOGIC GATE,13-INPUT NAND,HC-CMOS,DIP,16PIN,PLASTIC	IC,LOGIC GATE,13-INPUT NAND,HC-CMOS,DIP,16PIN,CERAMIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	NXP	NXP	NXP	NXP	NXP
package instruction	SOP, SOP16,.25	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-PDSO-G16	R-PDIP-T16	R-XDIP-T16	R-PDIP-T16	-
JESD-609 code	e0	e0	e0	e0	-
Logic integrated circuit type	NAND GATE	NAND GATE	NAND GATE	NAND GATE	-
Number of terminals	16	16	16	16	-
Maximum operating temperature	85 °C	85 °C	125 °C	125 °C	-
Minimum operating temperature	-40 °C	-40 °C	-55 °C	-55 °C	-
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY	-
encapsulated code	SOP	DIP	DIP	DIP	-
Encapsulate equivalent code	SOP16,.25	DIP16,.3	DIP16,.3	DIP16,.3	-
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-
Package form	SMALL OUTLINE	IN-LINE	IN-LINE	IN-LINE	-
power supply	2/6 V	2/6 V	2/6 V	2/6 V	-
Schmitt trigger	NO	NO	NO	NO	-
surface mount	YES	NO	NO	NO	-
technology	CMOS	CMOS	CMOS	CMOS	-
Temperature level	INDUSTRIAL	INDUSTRIAL	MILITARY	MILITARY	-
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-
Terminal form	GULL WING	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	-
Terminal pitch	1.27 mm	2.54 mm	2.54 mm	2.54 mm	-
Terminal location	DUAL	DUAL	DUAL	DUAL	-

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