MC54HC133J datasheet, PDF - EEWORLD Datasheet

MC54HC133J: DescriptionIC,LOGIC GATE,13-INPUT NAND,HC-CMOS,DIP,16PIN,CERAMIC; Categorylogic logic; File Size206KB，3 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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MC54HC133J Overview

IC,LOGIC GATE,13-INPUT NAND,HC-CMOS,DIP,16PIN,CERAMIC

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	NXP
package instruction	DIP, DIP16,.3
Reach Compliance Code	unknown
JESD-30 code	R-XDIP-T16
JESD-609 code	e0
Load capacitance (CL)	50 pF
Logic integrated circuit type	NAND GATE
MaximumI(ol)	0.004 A
Number of terminals	16
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	2/6 V
Prop。Delay @ Nom-Sup	53 ns
Certification status	Not Qualified
Schmitt trigger	NO
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

	MC54HC133J	MC74HC133DDS	MC74HC133ND	MC74HC133N	MC54HC133JDS
Description	IC,LOGIC GATE,13-INPUT NAND,HC-CMOS,DIP,16PIN,CERAMIC	IC,LOGIC GATE,13-INPUT NAND,HC-CMOS,SOP,16PIN,PLASTIC	IC,LOGIC GATE,13-INPUT NAND,HC-CMOS,DIP,16PIN,PLASTIC	IC,LOGIC GATE,13-INPUT NAND,HC-CMOS,DIP,16PIN,PLASTIC	IC,LOGIC GATE,13-INPUT NAND,HC-CMOS,DIP,16PIN,CERAMIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	NXP	NXP	NXP	NXP	NXP
package instruction	DIP, DIP16,.3	SOP, SOP16,.25	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-XDIP-T16	R-PDSO-G16	R-PDIP-T16	R-PDIP-T16	-
JESD-609 code	e0	e0	e0	e0	-
Logic integrated circuit type	NAND GATE	NAND GATE	NAND GATE	NAND GATE	-
Number of terminals	16	16	16	16	-
Maximum operating temperature	125 °C	85 °C	85 °C	125 °C	-
Minimum operating temperature	-55 °C	-40 °C	-40 °C	-55 °C	-
Package body material	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-
encapsulated code	DIP	SOP	DIP	DIP	-
Encapsulate equivalent code	DIP16,.3	SOP16,.25	DIP16,.3	DIP16,.3	-
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-
Package form	IN-LINE	SMALL OUTLINE	IN-LINE	IN-LINE	-
power supply	2/6 V	2/6 V	2/6 V	2/6 V	-
Schmitt trigger	NO	NO	NO	NO	-
surface mount	NO	YES	NO	NO	-
technology	CMOS	CMOS	CMOS	CMOS	-
Temperature level	MILITARY	INDUSTRIAL	INDUSTRIAL	MILITARY	-
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-
Terminal form	THROUGH-HOLE	GULL WING	THROUGH-HOLE	THROUGH-HOLE	-
Terminal pitch	2.54 mm	1.27 mm	2.54 mm	2.54 mm	-
Terminal location	DUAL	DUAL	DUAL	DUAL	-

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