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935278794115

Description
NAND Gate, AHC/VHC/H/U/V Series, 4-Func, 2-Input, CMOS, PQCC14
Categorylogic    logic   
File Size119KB,17 Pages
ManufacturerNexperia
Websitehttps://www.nexperia.com
Environmental Compliance
Download Datasheet Parametric Compare View All

935278794115 Overview

NAND Gate, AHC/VHC/H/U/V Series, 4-Func, 2-Input, CMOS, PQCC14

935278794115 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerNexperia
package instructionHVQCCN,
Reach Compliance Codecompliant
seriesAHC/VHC/H/U/V
JESD-30 codeR-PQCC-N14
JESD-609 codee4
length3 mm
Logic integrated circuit typeNAND GATE
Humidity sensitivity level1
Number of functions4
Number of entries2
Number of terminals14
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeHVQCCN
Package shapeRECTANGULAR
Package formCHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
propagation delay (tpd)19.5 ns
Maximum seat height1 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)2 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formNO LEAD
Terminal pitch0.5 mm
Terminal locationQUAD
width2.5 mm
Base Number Matches1
74AHC132; 74AHCT132
Quad 2-input NAND Schmitt trigger
Rev. 06 — 4 May 2009
Product data sheet
1. General description
The 74AHC132; 74AHCT132 is a high-speed Si-gate CMOS device and is pin compatible
with Low-power Schottky TTL (LSTTL). It is specified in compliance with JEDEC standard
No. 7-A.
The 74AHC132; 74AHCT132 contains four 2-input NAND gates which accept standard
input signals. They are capable of transforming slowly changing input signals into sharply
defined, jitter free output signals. The gate switches at different points for positive-going
and negative-going signals. The difference between the positive voltage V
T+
and the
negative V
T−
is defined as the hysteresis voltage V
H
.
2. Features
I
Balanced propagation delays
I
Inputs accept voltages higher than V
CC
I
Input levels:
N
For 74AHC132: CMOS level
N
For 74AHCT132: TTL level
I
ESD protection:
N
HBM EIA/JESD22-A114E exceeds 2000 V
N
MM EIA/JESD22-A115-A exceeds 200 V
N
CDM EIA/JESD22-C101C exceeds 1000 V
I
Multiple package options
I
Specified from
−40 °C
to +85
°C
and from
−40 °C
to +125
°C
3. Ordering information
Table 1.
Ordering information
Package
Temperature range Name
74AHC132
74AHC132D
74AHC132PW
74AHC132BQ
−40 °C
to +125
°C
−40 °C
to +125
°C
−40 °C
to +125
°C
SO14
TSSOP14
plastic small outline package; 14 leads;
body width 3.9 mm
plastic thin shrink small outline package; 14 leads;
body width 4.4 mm
SOT108-1
SOT402-1
SOT762-1
Description
Version
Type number
DHVQFN14 plastic dual in-line compatible thermal enhanced very
thin quad flat package; no leads; 14 terminals;
body 2.5
×
3
×
0.85 mm

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Description NAND Gate, AHC/VHC/H/U/V Series, 4-Func, 2-Input, CMOS, PQCC14 NAND Gate, AHC/VHC/H/U/V Series, 4-Func, 2-Input, CMOS, PDSO14 NAND Gate, AHC/VHC/H/U/V Series, 4-Func, 2-Input, CMOS, PDSO14 NAND Gate, AHC/VHC/H/U/V Series, 4-Func, 2-Input, CMOS, PDSO14 NAND Gate, AHC/VHC/H/U/V Series, 4-Func, 2-Input, CMOS, PQCC14
Is it Rohs certified? conform to conform to conform to conform to conform to
Maker Nexperia Nexperia Nexperia Nexperia Nexperia
package instruction HVQCCN, TSSOP, TSSOP, SOP, HVQCCN,
Reach Compliance Code compliant compliant compliant compliant compliant
series AHC/VHC/H/U/V AHC/VHC/H/U/V AHC/VHC/H/U/V AHC/VHC/H/U/V AHC/VHC/H/U/V
JESD-30 code R-PQCC-N14 R-PDSO-G14 R-PDSO-G14 R-PDSO-G14 R-PQCC-N14
JESD-609 code e4 e4 e4 e4 e4
length 3 mm 5 mm 5 mm 8.65 mm 3 mm
Logic integrated circuit type NAND GATE NAND GATE NAND GATE NAND GATE NAND GATE
Humidity sensitivity level 1 1 1 1 1
Number of functions 4 4 4 4 4
Number of entries 2 2 2 2 2
Number of terminals 14 14 14 14 14
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code HVQCCN TSSOP TSSOP SOP HVQCCN
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
propagation delay (tpd) 19.5 ns 19.5 ns 19.5 ns 19.5 ns 19.5 ns
Maximum seat height 1 mm 1.1 mm 1.1 mm 1.75 mm 1 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 2 V 2 V 2 V 2 V 2 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal surface Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form NO LEAD GULL WING GULL WING GULL WING NO LEAD
Terminal pitch 0.5 mm 0.65 mm 0.65 mm 1.27 mm 0.5 mm
Terminal location QUAD DUAL DUAL DUAL QUAD
width 2.5 mm 4.4 mm 4.4 mm 3.9 mm 2.5 mm
Base Number Matches 1 1 1 1 1
Peak Reflow Temperature (Celsius) - - 260 260 260
Certification status - - Not Qualified Not Qualified Not Qualified
Maximum time at peak reflow temperature - - 30 30 30
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