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AM29LV320MH101FF

Description
2M X 16 FLASH 3V PROM, 100 ns, PDSO56
Categorystorage    storage   
File Size575KB,59 Pages
ManufacturerSPANSION
Websitehttp://www.spansion.com/
Environmental Compliance
Download Datasheet Parametric View All

AM29LV320MH101FF Overview

2M X 16 FLASH 3V PROM, 100 ns, PDSO56

AM29LV320MH101FF Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerSPANSION
Parts packaging codeTSOP1
package instructionREVERSE, MO-142EC, TSOP-56
Contacts56
Reach Compliance Codecompli
ECCN code3A991.B.1.A
Maximum access time100 ns
Spare memory width8
startup blockBOTTOM/TOP
JESD-30 codeR-PDSO-G56
JESD-609 codee3
length18.4 mm
memory density33554432 bi
Memory IC TypeFLASH
memory width16
Humidity sensitivity level3
Number of functions1
Number of terminals56
word count2097152 words
character code2000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize2MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)250
Programming voltage3 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMATTE TIN
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
typeNOR TYPE
width14 mm
Am29LV320MH/L
Data Sheet
RETIRED
PRODUCT
This product has been retired and is not available for designs. For new and current designs,
S29GL032A supersedes Am29LV320M H/L and is the factory-recommended migration path. Please
refer to the S29GL032A datasheet for specifications and ordering information. Availability of this
document is retained for reference and historical purposes only.
April 2005
The following document specifies Spansion memory products that are now offered by both Advanced
Micro Devices and Fujitsu. Although the document is marked with the name of the company that
originally developed the specification, these products will be offered to customers of both AMD and
Fujitsu.
Continuity of Specifications
There is no change to this datasheet as a result of offering the device as a Spansion product. Any
changes that have been made are the result of normal datasheet improvement and are noted in the
document revision summary, where supported. Future routine revisions will occur when appro-
priate, and changes will be noted in a revision summary.
For More Information
Please contact your local AMD or Fujitsu sales office for additional information about Spansion
memory solutions.
Publication Number
26517
Revision
B
Amendment
+3
Issue Date
December 14, 2005
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