IC,SHIFT REGISTER,CMOS,DIP,14PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | NXP |
| package instruction | DIP, DIP14,.3 |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| JESD-30 code | R-XDIP-T14 |
| JESD-609 code | e0 |
| Number of digits | 5 |
| Number of functions | 1 |
| Number of terminals | 14 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP14,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5/15 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| MC14006BCLDS | MC14006BALDS | MC14006BCLD | MC14006BCPDS | MC14006BCPD | |
|---|---|---|---|---|---|
| Description | IC,SHIFT REGISTER,CMOS,DIP,14PIN,CERAMIC | IC,SHIFT REGISTER,CMOS,DIP,14PIN,CERAMIC | IC,SHIFT REGISTER,CMOS,DIP,14PIN,CERAMIC | IC,SHIFT REGISTER,CMOS,DIP,14PIN,PLASTIC | IC,SHIFT REGISTER,CMOS,DIP,14PIN,PLASTIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | NXP | NXP | NXP | NXP | NXP |
| package instruction | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| JESD-30 code | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-PDIP-T14 | R-PDIP-T14 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 |
| Number of digits | 5 | 5 | 5 | 5 | 5 |
| Number of functions | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 14 | 14 | 14 | 14 | 14 |
| Maximum operating temperature | 85 °C | 125 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -55 °C | -40 °C | -40 °C | -40 °C |
| Package body material | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| power supply | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V |
| surface mount | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
| Is Samacsys | N | N | N | - | - |
| Base Number Matches | 1 | 1 | 1 | - | - |
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