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MAX2370ETM+

Description
SPECIALTY TELECOM CIRCUIT, QCC48, 7 X 7 MM, 0.80 MM HEIGHT, LEAD FREE, MO220, TQFN-48
CategoryTelecom circuit   
File Size1MB,20 Pages
ManufacturerRochester Electronics
Websitehttps://www.rocelec.com/
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MAX2370ETM+ Overview

SPECIALTY TELECOM CIRCUIT, QCC48, 7 X 7 MM, 0.80 MM HEIGHT, LEAD FREE, MO220, TQFN-48

MAX2370ETM+ Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
MakerRochester Electronics
Parts packaging codeQFN
package instruction7 X 7 MM, 0.80 MM HEIGHT, LEAD FREE, MO220, TQFN-48
Contacts48
Reach Compliance Codeunknown
Is SamacsysN
JESD-30 codeS-XQCC-N48
JESD-609 codee3
length7 mm
Humidity sensitivity level1
Number of functions1
Number of terminals48
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialUNSPECIFIED
encapsulated codeHVQCCN
Package shapeSQUARE
Package formCHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)260
Certification statusCOMMERCIAL
Maximum seat height0.8 mm
Nominal supply voltage3 V
surface mountYES
technologyBICMOS
Telecom integrated circuit typesTELECOM CIRCUIT
Temperature levelINDUSTRIAL
Terminal surfaceTIN
Terminal formNO LEAD
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperature30
width7 mm
Base Number Matches1
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MAX2370ETM+ Related Products

MAX2370ETM+ MAX2370ETM
Description SPECIALTY TELECOM CIRCUIT, QCC48, 7 X 7 MM, 0.80 MM HEIGHT, LEAD FREE, MO220, TQFN-48 SPECIALTY TELECOM CIRCUIT, QCC48, 7 X 7 MM, 0.80 MM HEIGHT, MO220, TQFN-48
Is it lead-free? Contains lead Contains lead
Maker Rochester Electronics Rochester Electronics
Parts packaging code QFN QFN
package instruction 7 X 7 MM, 0.80 MM HEIGHT, LEAD FREE, MO220, TQFN-48 7 X 7 MM, 0.80 MM HEIGHT, MO220, TQFN-48
Contacts 48 48
Reach Compliance Code unknown unknown
Is Samacsys N N
JESD-30 code S-XQCC-N48 S-XQCC-N48
JESD-609 code e3 e0
length 7 mm 7 mm
Humidity sensitivity level 1 1
Number of functions 1 1
Number of terminals 48 48
Maximum operating temperature 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C
Package body material UNSPECIFIED UNSPECIFIED
encapsulated code HVQCCN HVQCCN
Package shape SQUARE SQUARE
Package form CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius) 260 240
Certification status COMMERCIAL COMMERCIAL
Maximum seat height 0.8 mm 0.8 mm
Nominal supply voltage 3 V 3 V
surface mount YES YES
technology BICMOS BICMOS
Telecom integrated circuit types TELECOM CIRCUIT TELECOM CIRCUIT
Temperature level INDUSTRIAL INDUSTRIAL
Terminal surface TIN TIN LEAD
Terminal form NO LEAD NO LEAD
Terminal pitch 0.5 mm 0.5 mm
Terminal location QUAD QUAD
Maximum time at peak reflow temperature 30 20
width 7 mm 7 mm
Base Number Matches 1 1
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Index Files: 883  497  125  2829  2768  18  11  3  57  56 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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