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MAX2370ETM

Description
SPECIALTY TELECOM CIRCUIT, QCC48, 7 X 7 MM, 0.80 MM HEIGHT, MO220, TQFN-48
CategoryTelecom circuit   
File Size1MB,20 Pages
ManufacturerRochester Electronics
Websitehttps://www.rocelec.com/
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MAX2370ETM Overview

SPECIALTY TELECOM CIRCUIT, QCC48, 7 X 7 MM, 0.80 MM HEIGHT, MO220, TQFN-48

MAX2370ETM Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
MakerRochester Electronics
Parts packaging codeQFN
package instruction7 X 7 MM, 0.80 MM HEIGHT, MO220, TQFN-48
Contacts48
Reach Compliance Codeunknown
Is SamacsysN
JESD-30 codeS-XQCC-N48
JESD-609 codee0
length7 mm
Humidity sensitivity level1
Number of functions1
Number of terminals48
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialUNSPECIFIED
encapsulated codeHVQCCN
Package shapeSQUARE
Package formCHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)240
Certification statusCOMMERCIAL
Maximum seat height0.8 mm
Nominal supply voltage3 V
surface mountYES
technologyBICMOS
Telecom integrated circuit typesTELECOM CIRCUIT
Temperature levelINDUSTRIAL
Terminal surfaceTIN LEAD
Terminal formNO LEAD
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperature20
width7 mm
Base Number Matches1
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MAX2370ETM Related Products

MAX2370ETM MAX2370ETM+
Description SPECIALTY TELECOM CIRCUIT, QCC48, 7 X 7 MM, 0.80 MM HEIGHT, MO220, TQFN-48 SPECIALTY TELECOM CIRCUIT, QCC48, 7 X 7 MM, 0.80 MM HEIGHT, LEAD FREE, MO220, TQFN-48
Is it lead-free? Contains lead Contains lead
Maker Rochester Electronics Rochester Electronics
Parts packaging code QFN QFN
package instruction 7 X 7 MM, 0.80 MM HEIGHT, MO220, TQFN-48 7 X 7 MM, 0.80 MM HEIGHT, LEAD FREE, MO220, TQFN-48
Contacts 48 48
Reach Compliance Code unknown unknown
Is Samacsys N N
JESD-30 code S-XQCC-N48 S-XQCC-N48
JESD-609 code e0 e3
length 7 mm 7 mm
Humidity sensitivity level 1 1
Number of functions 1 1
Number of terminals 48 48
Maximum operating temperature 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C
Package body material UNSPECIFIED UNSPECIFIED
encapsulated code HVQCCN HVQCCN
Package shape SQUARE SQUARE
Package form CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius) 240 260
Certification status COMMERCIAL COMMERCIAL
Maximum seat height 0.8 mm 0.8 mm
Nominal supply voltage 3 V 3 V
surface mount YES YES
technology BICMOS BICMOS
Telecom integrated circuit types TELECOM CIRCUIT TELECOM CIRCUIT
Temperature level INDUSTRIAL INDUSTRIAL
Terminal surface TIN LEAD TIN
Terminal form NO LEAD NO LEAD
Terminal pitch 0.5 mm 0.5 mm
Terminal location QUAD QUAD
Maximum time at peak reflow temperature 20 30
width 7 mm 7 mm
Base Number Matches 1 1

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