935341518557 datasheet, PDF - EEWORLD Datasheet

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935341518557: DescriptionRISC Microcontroller; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，87 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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935341518557 Overview

RISC Microcontroller

935341518557 Parametric

Parameter Name	Attribute value
Maker	NXP
package instruction	,
Reach Compliance Code	unknown
Is Samacsys	N
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC
Base Number Matches	1

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NXP Semiconductors

Data Sheet: Technical Data

K28P210M150SF5

Rev. 4, 03/2017

Kinetis K28F MCU Sub-Family

High performance ARM® Cortex®-M4 MCU with 2 MB Flash,

1 MB SRAM, 2 USB Controllers (High-Speed and Full-

Speed), SDRAM controller, QuadSPI interface and Power

Management Controller with Core Voltage Bypass.

K28F extends the Kinetis Micontroller portfolio with large

embedded memory, advanced external memory interfaces,

performance, and peripheral integration while maintaining a high

level of software compatibility with previous Kinetis devices:

• The extended memory resources include a total of 2 MB of

programmable flash and 1 MB of embedded SRAM which

169 MAPBGA (MI)

210 WLCSP (AU)

can be used to support application needs for data logging

9 x 9 x 1.28 mm Pitch 6.9 mm x 6.9 x 0.6 mm

and rich human to machine interfaces with displays

0.65 mm

Pitch 0.4 mm

• The Power Management Controller with Core Voltage

Bypass enables the use of an external PMIC to maximize

the power efficiency of the system

• K28F enables memory expansion leveraging the SDRAM

controller and QuadSPI interface for eXecution-In-Place (XIP) from an external Serial NOR flash

• Both the USB High-Speed and Crystal-less Full-Speed Controllers integrate a PHY to reduce BOM cost

• The integrated smart peripherals such as Low-power UARTs and Timers operate in very low-power

modes to optimize battery life of the system

MK28FN2M0CAU15R

MK28FN2M0VMI15

Performance

Human-machine interface

• Up to 150 MHz ARM Cortex-M4 based core with DSP

• Up to 120 General-purpose input/output (GPIOs)

instructions and Single Precision Floating Point unit

Analog modules

(FPU)

• Power Management Control (PMC) with Core Voltage

Memories and memory expansion

Bypass

• 2 MB dual bank program flash and 1 MB SRAM

• One 16-bit SAR ADCs, two 6-bit DAC and one 12-bit

• 8 KB I/D + 8 KB System cache

DAC

• 32-bit external bus interface (FlexBus)

• Two analog comparators (CMP) containing a 6-bit

• 32-bit SDRAM controller

DAC and programmable reference input

• Dual QuadSPI interface with eXecution-In-Place (XIP)

• 1.2 V Voltage reference

• supports SDR and DDR serial flash and octal

Timers

configurations

• One 4-ch 32-bit Periodic interrupt timer

• 32 KB Boot ROM with built-in bootloader

• Two 16-bit low-power timer PWM modules

System and Clocks

• Two 8-ch motor control/general purpose/PWM timers

• 32-ch Asynchronous DMA

• Two 2-ch quadrature decoder/general purpose timers

• Multiple low-power modes

• Real-time clock with independent 3.6 V power domain

• Memory protection unit with multi-master protection

• Programmable delay block

• 3 to 32 MHz main crystal oscillator

Operating Characteristics

• 32 kHz low power crystal oscillator

• Temperature range (ambient): -40 to 105°C (BGA)

• 48 MHz internal reference

Temperature range (ambient):-40 to 85°C (WLCSP)

• Hardware and Software Watchdogs

NXP reserves the right to change the production detail specifications as may be

required to permit improvements in the design of its products.

Table of Contents

1 Ratings.................................................................................... 5

1.1 Thermal handling ratings................................................. 5

1.2 Moisture handling ratings................................................ 5

1.3 ESD handling ratings....................................................... 5

1.4 Voltage and current maximum ratings............................. 5

Recommended Power-On-Reset (POR)

Sequencing .........................................................6

2 General................................................................................... 7

2.1 AC electrical characteristics.............................................7

2.2 Nonswitching electrical specifications..............................7

2.2.1 Voltage and current operating requirements....... 7

2.2.2 HVD, LVD and POR operating requirements...... 8

2.2.3 Voltage and current operating behaviors.............9

2.2.4 Power mode transition operating behaviors........ 11

2.2.5 Power consumption operating behaviors............ 12

2.2.6 Electromagnetic Compatibility (EMC)

specifications....................................................... 23

2.2.7 Designing with radiated emissions in mind..........23

2.2.8 Capacitance attributes.........................................23

2.3 Switching specifications...................................................23

2.3.1 Device clock specifications..................................23

2.3.2 General switching specifications......................... 24

2.4 Thermal specifications..................................................... 25

2.4.1 Thermal operating requirements......................... 25

2.4.2 Thermal attributes................................................26

3 Peripheral operating requirements and behaviors.................. 27

3.1 Core modules.................................................................. 27

3.1.1 Debug trace timing specifications........................27

3.1.2 JTAG electricals.................................................. 28

3.2 Clock modules................................................................. 31

3.2.1 MCG specifications..............................................31

3.2.2 IRC48M specifications.........................................34

3.2.3 Oscillator electrical specifications........................35

3.2.4 32 kHz oscillator electrical characteristics........... 37

3.3 Memories and memory interfaces................................... 37

3.3.1 QuadSPI AC specifications................................. 37

3.3.2 Flash electrical specifications.............................. 43

3.3.3 Flexbus switching specifications..........................45

3.3.4 SDRAM controller specifications......................... 47

3.4 Analog............................................................................. 50

1.4.1

3.4.1

3.4.2

ADC electrical specifications............................... 50

CMP and 6-bit DAC electrical specifications....... 54

3.4.3 12-bit DAC electrical characteristics....................56

3.4.4 Voltage reference electrical specifications.......... 59

3.5 Timers..............................................................................60

3.6 Communication interfaces............................................... 60

3.6.1 USB Voltage Regulator electrical specifications..61

3.6.2 USB Full Speed Transceiver and High Speed

PHY specifications...............................................62

3.6.3 USB DCD electrical specifications.......................62

3.6.4 DSPI switching specifications (limited voltage

range).................................................................. 63

3.6.5 DSPI switching specifications (full voltage

range).................................................................. 66

3.6.6 Inter-Integrated Circuit Interface (I2C) timing...... 68

3.6.7 LPUART switching specifications........................ 70

3.6.8 SDHC specifications............................................70

3.6.9 I2S switching specifications.................................72

4 Dimensions............................................................................. 78

4.1 Obtaining package dimensions....................................... 78

5 Pinout...................................................................................... 78

5.1 K28F Signal Multiplexing and Pin Assignments.............. 78

5.2 Recommended connection for unused analog and

digital pins........................................................................79

5.3 K28F Pinouts................................................................... 80

6 Ordering parts......................................................................... 80

6.1 Determining valid orderable parts....................................80

7 Part identification.....................................................................81

7.1 Description.......................................................................81

7.2 Format............................................................................. 81

7.3 Fields............................................................................... 81

7.4 Example...........................................................................82

8 Terminology and guidelines.................................................... 82

8.1 Definitions........................................................................ 82

8.2 Examples......................................................................... 83

8.3 Typical-value conditions.................................................. 83

8.4 Relationship between ratings and operating

requirements....................................................................84

8.5 Guidelines for ratings and operating requirements..........84

9 Revision History...................................................................... 85

NXP Semiconductors

Kinetis K28F MCU Sub-Family, Rev. 4, 03/2017

935341518557 Related Products

	935341518557	MK28FN2M0AVMI15	MK28FN2M0ACAU15R
Description	RISC Microcontroller	150MHZ ARM CORTEX 1.3	150MHZ ARM CORTEX-M4F
core processor	-	ARM® Cortex®-M4	ARM® Cortex®-M4
core size	-	32-bit	32-bit
speed	-	150MHz	150MHz
Connectivity	-	EBI/EMI, I²C, QSPI, SDHC, SPI, UART/USART, USB	EBI/EMI, I²C, QSPI, SDHC, SPI, UART/USART, USB
Peripheral	-	DMA，I²S，PWM，WDT	DMA，I²S，PWM，WDT
Number of I/Os	-	120	120
Program storage capacity	-	2MB（2M x 8）	2MB（2M x 8）
Program memory type	-	flash memory	flash memory
RAM capacity	-	1M x 8	1M x 8
Voltage - Power Supply (Vcc/Vdd)	-	1.71 V ~ 3.6 V	1.71 V ~ 3.6 V
data converter	-	A/D 16b SAR, D/A 2x6b, 1x12b	A/D 16b SAR, D/A 2x6b, 1x12b
Oscillator type	-	inside/outside	inside/outside
Operating temperature	-	-40°C ~ 105°C（TA）	-40°C ~ 85°C（TA）

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