ISD2564PY datasheet, PDF - EEWORLD Datasheet

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ISD2564PY: DescriptionSpeech Synthesizer With RCDG, 64s, CMOS, PDIP28,; CategoryAnalog mixed-signal IC Consumption circuit; File Size360KB，41 Pages; ManufacturerNuvoton Technology Corporation; Websitehttp://www.nuvoton.com.cn/hq/; Environmental Compliance

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ISD2564PY Overview

Speech Synthesizer With RCDG, 64s, CMOS, PDIP28,

ISD2564PY Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Nuvoton Technology Corporation
package instruction	DIP, DIP28,.6
Reach Compliance Code	compliant
Is Samacsys	N
Commercial integrated circuit types	SPEECH SYNTHESIZER WITH RCDG
JESD-30 code	R-PDIP-T28
Number of terminals	28
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP28,.6
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
Maximum read time	64 s
Maximum slew rate	30 mA
surface mount	NO
technology	CMOS
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

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ISD2532/40/48/64

SINGLE-CHIP, MULTIPLE-MESSAGES,

VOICE RECORD/PLAYBACK DEVICE

32-, 40-, 48-, AND 64-SECOND DURATION

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Publication Release Date: April 24, 2006

Revision 1.2

ISD2532/40/48/64

4. TABLE OF CONTENTS

1. GENERAL DESCRIPTION.................................................................................................................. 2

2. FEATURES ......................................................................................................................................... 2

3. BLOCK DIAGRAM .............................................................................................................................. 3

4. TABLE OF CONTENTS ...................................................................................................................... 4

5. PIN CONFIGURATION ....................................................................................................................... 5

6. PIN DESCRIPTION ............................................................................................................................. 6

7. FUNCTIONAL DESCRIPTION.......................................................................................................... 10

7.1. Detailed Description.................................................................................................................... 10

7.2. Operational Modes ..................................................................................................................... 11

7.2.1. Operational Modes Description............................................................................................ 12

8. TIMING DIAGRAMS.......................................................................................................................... 16

9. ABSOLUTE MAXIMUM RATINGS.................................................................................................... 19

9.1 Operating Conditions ................................................................................................................... 20

10. ELECTRICAL CHARACTERISTICS ............................................................................................... 21

10.1. Parameters For Packaged Parts .............................................................................................. 21

10.1.1. Typical Parameter Variation with Voltage and Temperature - Packaged Parts ................ 24

10.2. Parameters For Die .................................................................................................................. 25

10.2.1. Typical Parameter Variation with Voltage and Temperature - Die .................................... 28

10.3. Parameters For Push-Button Mode.......................................................................................... 29

11. TYPICAL APPLICATION CIRCUIT ................................................................................................. 30

12. PACKAGE DRAWING AND DIMENSIONS .................................................................................... 35

12.1. 28-Lead 300-Mil Plastic Small Outline IC (SOIC)..................................................................... 35

12.2. 28-Lead 600-Mil Plastic Dual Inline Package (PDIP) ............................................................... 36

12.3. Die Bonding Physical Layout

[1]

................................................................................................ 37

13. ORDERING INFORMATION........................................................................................................... 39

14. VERSION HISTORY ....................................................................................................................... 40

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