EEWORLDEEWORLDEEWORLD

Part Number

Search

KSX421-210GGRTV

Description
IC Socket, PGA421, 421 Contact(s)
Categorysocket   
File Size129KB,1 Pages
ManufacturerAdvanced Interconnections Corp.
Download Datasheet Parametric View All

KSX421-210GGRTV Overview

IC Socket, PGA421, 421 Contact(s)

KSX421-210GGRTV Parametric

Parameter NameAttribute value
MakerAdvanced Interconnections Corp.
Reach Compliance Codeunknown
ECCN codeEAR99
Is SamacsysN
Contact completed and terminatedGOLD OVER NICKEL
Device slot typeIC SOCKET
Type of equipment usedPGA421
Shell materialPOLYIMIDE
JESD-609 codee4
Manufacturer's serial numberKSX
Number of contacts421
Base Number Matches1
.100" (2.54mm) Staggered
(Interstitial) PGA Sockets
5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com
.100" (2.54mm) Staggered (Interstitial) PGA Sockets
Standard Quick Turn Terminals
Type -210
Peel-A-Way
®
Only
Type -176
Peel-A-Way
®
Only
.058 Dia.
(1.47)
Type -234
Molded Only
.059 Dia.
(1.50)
.165
(4.19)
.058 Dia.
(1.47)
.015
(.38)
.155
(3.94)
.031
(.79)
.155
(3.95)
.180
(4.57)
Features:
• Available in high temperature molded or
Peel-A-Way
®
removable terminal carrier.
• .100” (2.54mm) centers pin to pin.
• Multiple finger contact for reliability.
• Tapered entry for ease of insertion.
• Closed end construction for 100% anti-
wicking of solder.
• Low insertion force socket.
• Available with solder preforms.
.034 Dia.
(.86)
.034 Dia.
(.86)
.018 Dia.
(.46)
Type -235
4 standoffs per socket
Type -234 used in remaining positions
Molded Only
.059 Dia.
(1.50)
Type -82
Molded Only
.059 Dia.
(1.50)
Patented Solder
Preform Terminal
Type -311
Molded Only
.059 Dia.
(1.50)
.209
(5.31)
.165
(4.19)
.136
(3.45)
.018 Dia.
(.46)
.125
(3.18)
.018 Dia.
(.46)
.165
(4.19)
Solder
Preform
.180
(4.57)
Terminals and Contacts:
Terminal: Brass - Copper Alloy (C36000)
ASTM-B-16
Contact: Beryllium Copper (C17200)
ASTM-B-194
.018 Dia.
(.46)
Quick turn delivery available on standard terminal types.
Additional terminal types available.
See terminal section for detailed terminal information.
Solder Preform:
63% Tin, 37% Lead
Plating:
Terminal: Gold over Nickel or
Tin-Lead over Nickel
Contact: Gold over Nickel or
Tin-Lead over Nickel
Gold per MIL-G-45204
Tin-Lead per MIL-P-81728
Nickel per QQ-N-290
1
Footprint Dash #
If Applicable*
Body Type
CSX - Standard Molded
KSX - Peel-A-Way
®
How To Order
CSX
503
-234
T
G
Contact Plating
G - Gold T - Tin-Lead
Terminal Plating
G - Gold
T - Tin-Lead
Terminal Type
Body Material:
CSX
- L.C.P. - Liquid
Crystal Polymer
-35˚C to 255˚C
(-31˚F to 491˚F)
KSX
- Polyimide Film
-269˚C to 400˚C
(-452˚F to 752˚F)
.100
(2.54)
Number of Pins
*See pages 67 - 73 for PGA footprints.
Molded
Body
Sealant Options
RTV
Seal
Type -235
Shown
.005 Typ.
(.13)
Type -210
Shown
RTV Sealed
To order: Add RTV to end of part #
Peel-A-Way
®
covered by patent rights issued and/or pending.
Tape Sealed
To order: Add 3M to end of part #
inch/(mm)
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
Page 66
Fluke's expert-level thermal imager is now on the market. Participate in the Q&A to win wonderful gifts!
[align=left][color=#000][size=3][font=微软雅黑][b]Event time: [/b]January 20th - March 22nd [/font][/size][/color][/align][align=left][color=#000][size=3][font=微软雅黑] [/font][/size][/color][/align][align=l...
EEWORLD社区 Test/Measurement
【Project Outsourcing】LPC3250 System Board
LPC3250 System BoardProject budget:¥ 2,000~5,000 Development cycle: 7 days Project Category: Embedded Bidding requirements:Project Tags:Six-layer PCB high-speed layout BGA packageProject Description: ...
CSTO项目交易 PCB Design
ICC compilation problem
During the compilation process, I pressed the compile button again, and this error occurred! The same error occurred when I compiled again!...
ena Microchip MCU
plc lesson plan 3
Contributed!...
wdxyx Industrial Control Electronics
Don’t forget to water your house during the weekend!
Without water, these flowers of the motherland will die of thirst!...
eeleader Talking about work
Instruments and devices used in the 2014 TI Cup Undergraduate Electronic Design Competition
[i=s]This post was last edited by paulhyde on 2014-9-15 02:54[/i] Instruments, devices and equipment used in the 2014 TI Cup Undergraduate Electronic Design Competition 1. Conventional instruments: a)...
C小狼 Electronics Design Contest

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 853  1736  155  1728  2040  18  35  4  42  13 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号