OTP ROM, 8KX8, 45ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28
| Parameter Name | Attribute value |
| Maker | Cypress Semiconductor |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 28 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Is Samacsys | N |
| Maximum access time | 45 ns |
| Other features | POWER SWITCHED PROM |
| JESD-30 code | R-PDIP-T28 |
| memory density | 65536 bit |
| Memory IC Type | OTP ROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 28 |
| word count | 8192 words |
| character code | 8000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 8KX8 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Certification status | Not Qualified |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal form | THROUGH-HOLE |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| CY7C266-45PI | CY7C266-25PI | CY7C266-35PI | CY7C266-45WI | CY7C266-25WI | CY7C266-35WI | CY7C266-20WI | CY7C266-20PI | |
|---|---|---|---|---|---|---|---|---|
| Description | OTP ROM, 8KX8, 45ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | OTP ROM, 8KX8, 25ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | OTP ROM, 8KX8, 35ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | UVPROM, 8KX8, 45ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | UVPROM, 8KX8, 25ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | UVPROM, 8KX8, 35ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | UVPROM, 8KX8, 20ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | OTP ROM, 8KX8, 20ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 |
| Parts packaging code | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| package instruction | DIP, | DIP, | 0.600 INCH, PLASTIC, DIP-28 | DIP, | DIP, | DIP, | DIP, | DIP, |
| Contacts | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | unknown | unknow | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 45 ns | 25 ns | 35 ns | 45 ns | 25 ns | 35 ns | 20 ns | 20 ns |
| Other features | POWER SWITCHED PROM | POWER SWITCHED PROM | POWER SWITCHED PROM | POWER SWITCHED PROM | POWER SWITCHED PROM | POWER SWITCHED PROM | POWER SWITCHED PROM | POWER SWITCHED PROM |
| JESD-30 code | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 | R-GDIP-T28 | R-GDIP-T28 | R-GDIP-T28 | R-GDIP-T28 | R-PDIP-T28 |
| memory density | 65536 bit | 65536 bi | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit |
| Memory IC Type | OTP ROM | OTP ROM | OTP ROM | UVPROM | UVPROM | UVPROM | UVPROM | OTP ROM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| word count | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words |
| character code | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| organize | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maker | Cypress Semiconductor | - | Cypress Semiconductor | Cypress Semiconductor | - | - | Cypress Semiconductor | Cypress Semiconductor |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
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