CY7C266-20WI datasheet, PDF - EEWORLD Datasheet

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CY7C266-20WI: DescriptionUVPROM, 8KX8, 20ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28; Categorystorage storage; File Size203KB，7 Pages; ManufacturerCypress Semiconductor

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CY7C266-20WI Overview

UVPROM, 8KX8, 20ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28

CY7C266-20WI Parametric

Parameter Name	Attribute value
Maker	Cypress Semiconductor
Parts packaging code	DIP
package instruction	DIP,
Contacts	28
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	20 ns
Other features	POWER SWITCHED PROM
JESD-30 code	R-GDIP-T28
JESD-609 code	e0
memory density	65536 bit
Memory IC Type	UVPROM
memory width	8
Number of functions	1
Number of terminals	28
word count	8192 words
character code	8000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	8KX8
Output characteristics	3-STATE
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	TIN LEAD
Terminal form	THROUGH-HOLE
Terminal location	DUAL

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CY7C266-20WI Related Products

	CY7C266-20WI	CY7C266-25PI	CY7C266-45PI	CY7C266-35PI	CY7C266-45WI	CY7C266-25WI	CY7C266-35WI	CY7C266-20PI
Description	UVPROM, 8KX8, 20ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28	OTP ROM, 8KX8, 25ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28	OTP ROM, 8KX8, 45ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28	OTP ROM, 8KX8, 35ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28	UVPROM, 8KX8, 45ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28	UVPROM, 8KX8, 25ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28	UVPROM, 8KX8, 35ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28	OTP ROM, 8KX8, 20ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28
Parts packaging code	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
package instruction	DIP,	DIP,	DIP,	0.600 INCH, PLASTIC, DIP-28	DIP,	DIP,	DIP,	DIP,
Contacts	28	28	28	28	28	28	28	28
Reach Compliance Code	unknown	unknow	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	20 ns	25 ns	45 ns	35 ns	45 ns	25 ns	35 ns	20 ns
Other features	POWER SWITCHED PROM	POWER SWITCHED PROM	POWER SWITCHED PROM	POWER SWITCHED PROM	POWER SWITCHED PROM	POWER SWITCHED PROM	POWER SWITCHED PROM	POWER SWITCHED PROM
JESD-30 code	R-GDIP-T28	R-PDIP-T28	R-PDIP-T28	R-PDIP-T28	R-GDIP-T28	R-GDIP-T28	R-GDIP-T28	R-PDIP-T28
memory density	65536 bit	65536 bi	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit
Memory IC Type	UVPROM	OTP ROM	OTP ROM	OTP ROM	UVPROM	UVPROM	UVPROM	OTP ROM
memory width	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	28	28	28	28	28	28	28	28
word count	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words
character code	8000	8000	8000	8000	8000	8000	8000	8000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	8KX8	8KX8	8KX8	8KX8	8KX8	8KX8	8KX8	8KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maker	Cypress Semiconductor	-	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	-	-	Cypress Semiconductor
Base Number Matches	-	1	1	1	1	1	1	-

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