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LMM456SC25

Description
SRAM Module, 64KX4, 25ns, CMOS
Categorystorage   
File Size339KB,6 Pages
ManufacturerLOGIC Devices
Websitehttp://www.logicdevices.com/
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LMM456SC25 Overview

SRAM Module, 64KX4, 25ns, CMOS

LMM456SC25 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerLOGIC Devices
package instruction, SIP28,.1
Reach Compliance Codeunknown
ECCN codeEAR99
Is SamacsysN
Maximum access time25 ns
I/O typeSEPARATE
JESD-30 codeR-XSMA-T28
JESD-609 codee0
memory density262144 bit
Memory IC TypeSRAM MODULE
memory width4
Humidity sensitivity level3
Number of functions1
Number of ports1
Number of terminals28
word count65536 words
character code64000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize64KX4
Output characteristics3-STATE
ExportableYES
Package body materialUNSPECIFIED
Encapsulate equivalent codeSIP28,.1
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)225
power supply5 V
Certification statusNot Qualified
Maximum standby current0.00006 A
Minimum standby current4.5 V
Maximum slew rate0.165 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationSINGLE
Maximum time at peak reflow temperatureNOT SPECIFIED
Base Number Matches1
This Material Copyrighted By Its Respective Manufacturer

LMM456SC25 Related Products

LMM456SC25 LMM456SC15 LMM456SC20 LMM456SC45 LMM456SC35
Description SRAM Module, 64KX4, 25ns, CMOS SRAM Module, 64KX4, 15ns, CMOS SRAM Module, 64KX4, 20ns, CMOS SRAM Module, 64KX4, 45ns, CMOS SRAM Module, 64KX4, 35ns, CMOS
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible
Maker LOGIC Devices LOGIC Devices LOGIC Devices LOGIC Devices LOGIC Devices
package instruction , SIP28,.1 , SIP28,.1 , SIP28,.1 , SIP28,.1 , SIP28,.1
Reach Compliance Code unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 25 ns 15 ns 20 ns 45 ns 35 ns
I/O type SEPARATE SEPARATE SEPARATE SEPARATE SEPARATE
JESD-30 code R-XSMA-T28 R-XSMA-T28 R-XSMA-T28 R-XSMA-T28 R-XSMA-T28
JESD-609 code e0 e0 e0 e0 e0
memory density 262144 bit 262144 bit 262144 bit 262144 bit 262144 bit
Memory IC Type SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE
memory width 4 4 4 4 4
Humidity sensitivity level 3 3 3 3 3
Number of functions 1 1 1 1 1
Number of ports 1 1 1 1 1
Number of terminals 28 28 28 28 28
word count 65536 words 65536 words 65536 words 65536 words 65536 words
character code 64000 64000 64000 64000 64000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C
organize 64KX4 64KX4 64KX4 64KX4 64KX4
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Exportable YES YES YES YES YES
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
Encapsulate equivalent code SIP28,.1 SIP28,.1 SIP28,.1 SIP28,.1 SIP28,.1
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 225 225 225 225 225
power supply 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum standby current 0.00006 A 0.00006 A 0.00006 A 0.00006 A 0.00006 A
Minimum standby current 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Maximum slew rate 0.165 mA 0.165 mA 0.165 mA 0.165 mA 0.165 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V
surface mount NO NO NO NO NO
technology CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location SINGLE SINGLE SINGLE SINGLE SINGLE
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Is Samacsys N N N - -
Base Number Matches 1 1 1 1 -
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