BDL-106-T-F datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > The connector> The connector> BDL-106-T-F

BDL-106-T-F: DescriptionINTERCONNECT STRIPS; CategoryThe connector The connector; File Size220KB，1 Pages; ManufacturerSAMTEC; Websitehttp://www.samtec.com/; Environmental Compliance

Download Datasheet Parametric View All

BDL-106-T-F Online Shopping

Suppliers	Part Number	Price	MOQ	In stock
	BDL-106-T-F	-	-	View	Buy Now

BDL-106-T-F Overview

INTERCONNECT STRIPS

BDL-106-T-F Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	SAMTEC
package instruction	ROHS COMPLIANT
Reach Compliance Code	not_compliant
ECCN code	EAR99
Factory Lead Time	2 weeks
Other features	LOW PROFILE
body length	0.6 inch
Connector type	BOARD CONNECTOR
Contact to complete cooperation	TIN OVER NICKEL (50)
Contact completed and terminated	TIN OVER NICKEL (50)
Contact point gender	MALE
Contact material	BRASS/PHOSPHOR BRONZE
contact mode	RECTANGULAR
Contact style	RND PIN-SKT
DIN compliance	NO
Filter function	NO
IEC compliance	NO
Insulator color	BLACK
insulator material	NYLON
JESD-609 code	e3
MIL compliance	NO
Plug contact pitch	0.1 inch
Match contact row spacing	0.1 inch
Plug information	MULTIPLE MATING PARTS AVAILABLE
Mixed contacts	NO
Installation method	STRAIGHT
Installation type	BOARD
Number of connectors	ONE
PCB row number	2
Number of rows loaded	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Options	GENERAL PURPOSE
PCB contact pattern	RECTANGULAR
PCB contact row spacing	2.54 mm
Guideline	UL
reliability	COMMERCIAL
Terminal length	0.125 inch
Terminal pitch	2.54 mm
Termination type	SOLDER
Total number of contacts	12
Base Number Matches	1

Preview

Download Datasheet

View All

F-219 (Rev 02NOV18)

BDL–110–G–F

BBL–112–T–E

BBD–130–T–B

BHS–125–G–A

(2.54 mm) .100"

BBS–116–G–C

BBS, BBL, BHS, BBD, BDL SERIES

MACHINED BOARD STACKING STRIPS

Mates with:

SS, SD, HSS, SL, SDL,

ESS, ESD

TYPE

STRIP

NO. PINS

PER ROW

PLATING

OPTION

LEAD

STYLE

FEATURES

•

Low-proﬁle design

achieves (3.89 mm)

.153" board spacings

when mated with SL

Series.

•

Approach the reliability

of a permanent

connection with the

ﬂexibility of a separable

connection.

= Standard Single Row

BBS

BBL

(2.54) .100 x No. of Positions

(2.54)

.100

(2.54) .100 TYP

(1.27)

.050

= 20 µ" (0.51 µm)

Gold

–G

–T

= Tin

= Low-Proﬁle Single Row

(2.54)

.100

SPECIFICATIONS

For complete speciﬁcations

see www.samtec.com?BBS,

www.samtec.com?BBL,

www.samtec.com?BHS

www.samtec.com?BBD or

www.samtec.com?BDL

Insulator Material:

Black Glass Filled Polyester

(BBS, BBD)

Black High Temp Nylon

(BDL)

Black Liquid Crystal Polymer

(BHS, BBL)

Temperature Range:

-55 °C to +125 °C

Terminal Material:

Phosphor Bronze or Brass

Plating:

Au or Sn over 50 µ" (1.27 µm) Ni

RoHS Compliant:

Yes

Lead-Free Solderable:

Wave only

(BBS, BBD, BBL, BDL)

Wave, or reﬂow with

all Au (BHS)

= High Temp Single Row

BHS

BBL body available with

Styles –E & –F only.

BBS

BHS

BBL

(2.54) .100 x No. of Positions

= Standard Double Row

BBD

BDL

(5.08)

.200

(2.54) .100 TYP

(2.54)

.100

(1.27)

.050

01 THRU 32

= BBS & BBL

(2.54)

.100

01 THRU 36

BDL body available with

Styles –E & –F only.

= Low-Proﬁle Double Row

BBD

= BBD, BDL & BHS

BDL

Z = (5.33 mm) .210"

–A

Z = (8.51 mm) .335"

–B

Z = (14.86 mm) .585"

–C

Z = (1.78 mm) .070"

–E

Z = (2.16 mm) .085"

–F

RECOGNITIONS

For complete scope

of recognitions see

www.samtec.com/quality

(3.18)

.125

(0.46)

.018

DIA

(1.27)

.050

(1.78)

.070

DIA

(1.27)

.050 DIA

(0.46)

.018

DIA

Style E:

(2.74)

.108

Style F:

(3.18)

.125

(0.46)

.018 DIA

(1.78)

.070 DIA

(0.46)

.018 DIA

(3.18)

.125

FILE NO. E111594

BBL

Series

(3.18)

.125

BBD

Series

BDL

Series

BBS and BHS

Series

Note:

Some lengths, styles and

options are non-standard,

non-returnable.

Due to technical progress, all designs, speciﬁcations and components are subject to change without notice.

All parts within this catalog are built to Samtec’s speciﬁcations.

Customer speciﬁc requirements must be approved by Samtec and identiﬁed in a Samtec customer-speciﬁc drawing to apply.

WWW.SAMTEC.COM

Recommended Resources

Automotive power converter circuit design

Touch lighting delayed light off circuit 5

3.5V power supply, stable low voltage, low power consumption reference voltage generation circuit

Automatic intermittent forward and reverse control circuit for elevator traction machine simulation test

Four channel commutator

BQ2000 charging management flow chart

[RT-Thread Reading Notes] Part 2 (5) Interrupt Management and Bidirectional Linked List: [align=left]The RTT system uses interrupts in the same way as the bare metal system does, but the interrupts can be associated with system threads with the help of the operating system's kernel IPC co...; 我爱下载 Real-time operating system RTOS

How to change the display resolution of DE1-SoC?: The DE1-SoC board is connected to an external LCD monitor, keyboard and mouse via VGA; the official Linux_console_with_FrameBuffer is installed. There is only one resolution of 1024x768, and the best ...; cncqzxj FPGA/CPLD

Heroes from all walks of life, please help me with the tcpmp sample problem!: I compiled the sample of TCPMP into sample.exe and copied it together with common.dll and other components (decoder, language pack) to the same folder and downloaded it to the SD card of a navigation ...; wisper Embedded System

Analysis of the three major architectural elements of RF signal sources: Engineers are familiar with RF signal sources, which are often used to calibrate spectrum analyzers, modulation analyzers, power meters, frequency meters, RF millivolt meters, high-frequency digital o...; 博宇讯铭 Test/Measurement

How to choose a more suitable power resistor?: [i=s]This post was last edited by qwqwqw2088 on 2018-2-27 08:20[/i] [size=4][b]Chapter 1 Power of Resistors[/b] The rated power of a resistor is defined as the maximum power that the resistor is allow...; qwqwqw2088 Analogue and Mixed Signal

The development board is connected to an IP camera for remote monitoring.: I am using a development board to connect an IP camera to monitor a distant scene through the network. The picture is very slow and basically just stays on one interface. However, the picture I see on...; paulowmia Embedded System

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components