W25M512JV
Featuring
3V 512M-BIT (2 x 256M-BIT)
SERIAL MCP FLASH MEMORY
With Multi I/O SPI & Concurrent Operations
Publication Release Date: September 06, 2017
- Revision D
W25M512JV
Table of Contents
1.
2.
3.
GENERAL DESCRIPTIONS ............................................................................................................. 6
FEATURES ....................................................................................................................................... 6
PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 7
3.1
Pad Configuration WSON 8x6-mm ...................................................................................... 7
3.2
Pad Description WSON 8x6-mm .......................................................................................... 7
3.3
Pin Configuration SOIC 300-mil ........................................................................................... 8
3.4
Pin Description SOIC 300-mil ............................................................................................... 8
3.5
Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ................................................. 9
3.6
Ball Description TFBGA 8x6-mm ......................................................................................... 9
DEVICE CONFIGURATION & PIN DESCRIPTIONS..................................................................... 10
4.1
Serial MCP (SpiStack
®
) Device Configuration ................................................................... 10
4.2
Chip Select (/CS) ................................................................................................................ 10
4.3
Serial Input & Output (DI, DO and IO0, IO1, IO2, IO3) ...................................................... 10
4.4
Serial Clock (CLK) .............................................................................................................. 10
4.5
Reset (/RESET) .................................................................................................................. 10
SINGLE DIE (W25Q256JV) BLOCK DIAGRAM ............................................................................. 11
FUNCTIONAL DESCRIPTIONS ..................................................................................................... 12
6.1
Device Operations .............................................................................................................. 12
6.1.1
6.1.2
6.1.3
6.1.4
6.1.5
Stacked Die Operations ........................................................................................................ 12
Standard SPI Instructions ..................................................................................................... 12
Dual & Quad SPI Instructions ............................................................................................... 13
3-Byte / 4-Byte Address Modes ............................................................................................ 13
Software Reset & Hardware /RESET pin .............................................................................. 13
4.
5.
6.
7.
6.2
Write Protection .................................................................................................................. 14
STATUS AND CONFIGURATION REGISTERS ............................................................................ 15
7.1
Status Registers ................................................................................................................. 15
7.1.1
7.1.2
7.1.3
7.1.4
7.1.5
7.1.6
7.1.7
7.1.8
7.1.9
7.1.10
7.1.11
7.1.12
7.1.13
7.1.14
7.1.15
Program/Erase/Write In Progress (BUSY)
–
Status Only
.................................................. 15
Write Enable Latch (WEL)
–
Status Only
........................................................................... 15
Block Protect Bits (BP3, BP2, BP1, BP0)
–
Volatile/Non-Volatile Writable
........................ 16
Top/Bottom Block Protect (TB)
–
Volatile/Non-Volatile Writable
........................................ 16
Complement Protect (CMP)
–
Volatile/Non-Volatile Writable
............................................ 16
Status Register Lock (SRL)
–
Volatile/Non-Volatile OTP Writable
..................................... 16
Erase/Program Suspend Status (SUS)
–
Status Only
....................................................... 17
Security Register Lock Bits (LB3, LB2, LB1)
–
Volatile/Non-Volatile OTP Writable
........... 17
Current Address Mode (ADS)
–
Status Only
..................................................................... 17
Power-Up Address Mode (ADP)
–
Non-Volatile Writable
................................................ 17
Write Protect Selection (WPS)
–
Volatile/Non-Volatile Writable
...................................... 17
Output Driver Strength (DRV1, DRV0)
–
Volatile/Non-Volatile Writable
.......................... 18
Reserved Bits
–
Non Functional
...................................................................................... 18
Single Die W25Q256JV Status Register Memory Protection (WPS = 0, CMP = 0) ............ 19
Single Die W25Q256JV Status Register Memory Protection (WPS = 0, CMP = 1) ............ 20
-1-
W25M512JV
7.1.16
Single Die W25Q256JV Individual Block Memory Protection (WPS=1) .............................. 21
7.2
8.
Extended Address Register
–
Volatile Writable Only
...................................................... 22
INSTRUCTIONS ............................................................................................................................. 23
8.1
Device ID and Instruction Set Tables ................................................................................. 23
8.1.1
8.1.2
8.1.3
8.1.4
8.1.5
Manufacturer and Device Identification ................................................................................. 23
Instruction Set Table 1 (Standard Single SPI, 3-Byte Address Mode ADS=0)
(1)
................... 24
Instruction Set Table 2 (Dual/Quad SPI Instructions, 3-Byte Address Mode ADS=0) ........... 25
Instruction Set Table 3 (Standard Single SPI, 4-Byte Address Mode ADS=1)
(1)
................... 26
Instruction Set Table 4 (Dual/Quad SPI Instructions, 4-Byte Address Mode ADS=1) ........... 27
Software Die Select (C2h) .................................................................................................... 29
Write Enable (06h) ................................................................................................................ 30
Write Enable for Volatile Status Register (50h)..................................................................... 30
Write Disable (04h) ............................................................................................................... 31
Read Status Register-1 (05h), Status Register-2 (35h) & Status Register-3 (15h) ............... 31
Write Status Register-1 (01h), Status Register-2 (31h) & Status Register-3 (11h) ............... 32
Read Extended Address Register (C8h) ............................................................................... 34
Write Extended Address Register (C5h) ............................................................................... 35
Enter 4-Byte Address Mode (B7h) ........................................................................................ 36
Exit 4-Byte Address Mode (E9h) ......................................................................................... 36
Read Data (03h) ................................................................................................................. 37
Read Data with 4-Byte Address (13h)................................................................................. 38
Fast Read (0Bh) ................................................................................................................. 39
Fast Read with 4-Byte Address (0Ch)................................................................................. 40
Fast Read Dual Output (3Bh) ............................................................................................. 41
Fast Read Dual Output with 4-Byte Address (3Ch) ............................................................ 42
Fast Read Quad Output (6Bh) ............................................................................................ 43
Fast Read Quad Output with 4-Byte Address (6Ch) ........................................................... 44
Fast Read Dual I/O (BBh) ................................................................................................... 45
Fast Read Dual I/O with 4-Byte Address (BCh) .................................................................. 46
Fast Read Quad I/O (EBh).................................................................................................. 47
Fast Read Quad I/O with 4-Byte Address (ECh) ................................................................. 48
Set Burst with Wrap (77h) ................................................................................................... 49
Page Program (02h) ........................................................................................................... 50
Page Program with 4-Byte Address (12h)........................................................................... 51
Quad Input Page Program (32h)......................................................................................... 52
Quad Input Page Program with 4-Byte Address (34h) ........................................................ 53
Sector Erase (20h) .............................................................................................................. 54
Sector Erase with 4-Byte Address (21h) ............................................................................. 55
32KB Block Erase (52h)...................................................................................................... 56
64KB Block Erase (D8h) ..................................................................................................... 57
64KB Block Erase with 4-Byte Address (DCh).................................................................... 58
Single Die Chip Erase (C7h / 60h) ...................................................................................... 59
Erase / Program Suspend (75h) ......................................................................................... 60
Erase / Program Resume (7Ah) .......................................................................................... 61
8.2
Instruction Descriptions ...................................................................................................... 29
8.2.1
8.2.2
8.2.3
8.2.4
8.2.5
8.2.6
8.2.7
8.2.8
8.2.9
8.2.10
8.2.11
8.2.12
8.2.13
8.2.14
8.2.16
8.2.17
8.2.18
8.2.19
8.2.20
8.2.21
8.2.22
8.2.23
8.2.25
8.2.26
8.2.27
8.2.28
8.2.29
8.2.30
8.2.31
8.2.32
8.2.33
8.2.34
8.2.35
8.2.36
8.2.37
-2-
Publication Release Date: September 06, 2017
- Revision D
W25M512JV
8.2.38
8.2.39
8.2.40
8.2.41
8.2.42
8.2.43
8.2.44
8.2.45
8.2.46
8.2.47
8.2.48
8.2.49
8.2.50
8.2.51
8.2.52
8.2.53
Read Device ID (ABh)......................................................................................................... 62
Read Manufacturer / Device ID (90h) ................................................................................. 63
Read Manufacturer / Device ID Dual I/O (92h) ................................................................... 64
Read Manufacturer / Device ID Quad I/O (94h) .................................................................. 65
Read Unique ID Number (4Bh) ........................................................................................... 66
Read JEDEC ID (9Fh) ........................................................................................................ 67
Read SFDP Register (5Ah)................................................................................................. 68
Erase Security Registers (44h) ........................................................................................... 69
Program Security Registers (42h) ....................................................................................... 70
Read Security Registers (48h) ............................................................................................ 71
Individual Block/Sector Lock (36h) ...................................................................................... 72
Individual Block/Sector Unlock (39h) .................................................................................. 73
Read Block/Sector Lock (3Dh)............................................................................................ 74
Global Block/Sector Lock (7Eh) .......................................................................................... 75
Global Block/Sector Unlock (98h) ....................................................................................... 75
Enable Reset (66h) and Reset Device (99h) ...................................................................... 76
9.
ELECTRICAL CHARACTERISTICS............................................................................................... 77
9.1
Absolute Maximum Ratings (1) .......................................................................................... 77
9.2
Operating Ranges .............................................................................................................. 77
9.3
Power-up Power-down Timing and Requirements ............................................................. 78
9.4
DC Electrical Characteristics
(1)
........................................................................................... 79
9.5
AC Measurement Conditions ............................................................................................. 80
9.6
AC Electrical Characteristics
(4,5)
......................................................................................... 81
9.7
Serial Output Timing ........................................................................................................... 83
9.8
Serial Input Timing.............................................................................................................. 83
PACKAGE SPECIFICATIONS ....................................................................................................... 84
10.1 8-Pad WSON 8x6-mm (Package Code E) ......................................................................... 84
10.2 16-Pin SOIC 300-mil (Package Code F) ............................................................................ 85
10.3 24-Ball TFBGA 8x6-mm (Package Code B, 5x5-1 Ball Array) ........................................... 86
10.4 24-Ball TFBGA 8x6-mm (Package Code C, 6x4 Ball Array) .............................................. 87
ORDERING INFORMATION .......................................................................................................... 88
11.1 Valid Part Numbers and Top Side Marking ........................................................................ 89
REVISION HISTORY ...................................................................................................................... 90
10.
11.
12.
-3-
W25M512JV
Table of Figures
Figure 1a. W25M512JV Pad Assignments, 8-pad WSON 8x6-mm (Package Code E) ............................... 7
Figure 1b. W25M512JV Pin Assignments, 16-pin SOIC 300-mil (Package Code F) ................................... 8
Figure 1c. W25M512JV Ball Assignments, 24-ball TFBGA 8x6-mm (Package Code B & C) ...................... 9
Figure 2a. W25M512JV Device Configuration ............................................................................................ 10
Figure 2b. Single Die W25Q256JV Serial Flash Memory Block Diagram .................................................. 11
Figure 2c. W25M512JV Serial Flash Memory Operation Diagram ............................................................. 12
Figure 3a. Status Register-1 ....................................................................................................................... 15
Figure 3b. Status Register-2 ....................................................................................................................... 17
Figure 3c. Status Register-3 ....................................................................................................................... 18
Figure 3d. Individual Block/Sector Locks (Single Die W25Q256JV) .......................................................... 21
Figure 3e. Extended Address Register (Single Die W25Q256JV).............................................................. 22
Figure 4. Software Die Select Instruction .................................................................................................... 29
Figure 5. Write Enable Instruction ............................................................................................................... 30
Figure 6. Write Enable for Volatile Status Register Instruction ................................................................... 30
Figure 7. Write Disable Instruction .............................................................................................................. 31
Figure 8. Read Status Register Instruction ................................................................................................. 31
Figure 9a. Write Status Register-1/2/3 Instruction ...................................................................................... 32
Figure 9b. Write Status Register-1/2 Instruction ......................................................................................... 33
Figure 10. Read Extended Address Register Instruction ............................................................................ 34
Figure 11. Write Extended Address Register Instruction ............................................................................ 35
Figure 12. Enter 4-Byte Address Mode instruction ..................................................................................... 36
Figure 13. Exit 4-Byte Address Mode instruction ........................................................................................ 36
Figure 14. Read Data Instruction ................................................................................................................ 37
Figure 15. Read Data with 4-Byte Address Instruction ............................................................................... 38
Figure 16. Fast Read Instruction ................................................................................................................. 39
Figure 17. Fast Read with 4-Byte Address Instruction ............................................................................... 40
Figure 19. Fast Read Dual Output Instruction ............................................................................................ 41
Figure 20. Fast Read Dual Output with 4-Byte Address Instruction ........................................................... 42
Figure 21. Fast Read Quad Output Instruction ........................................................................................... 43
Figure 22. Fast Read Quad Output with 4-Byte Address Instruction .......................................................... 44
Figure 23. Fast Read Dual I/O Instruction .................................................................................................. 45
Figure 24. Fast Read Dual I/O w/ 4-Byte Address Instruction .................................................................... 46
Figure 26. Fast Read Quad I/O Instruction ................................................................................................. 47
Figure 27. Fast Read Quad I/O w/ 4-Byte Address Instruction ................................................................... 48
Figure 29. Set Burst with Wrap Instruction ................................................................................................. 49
Figure 30. Page Program Instruction .......................................................................................................... 50
Figure 31. Page Program with 4-Byte Address Instruction ......................................................................... 51
Figure 32. Quad Input Page Program Instruction ....................................................................................... 52
Figure 33. Quad Input Page Program with 4-Byte Address Instruction ...................................................... 53
Figure 34. Sector Erase Instruction ............................................................................................................ 54
Figure 35. Sector Erase with 4-Byte Address Instruction ........................................................................... 55
Figure 36. 32KB Block Erase Instruction .................................................................................................... 56
Publication Release Date: September 06, 2017
- Revision D
-4-
Embedded System
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