9
8
7
6
5
4
3
2
1
NOTES
1.
2.
½品詳細寸法については½品単½図面を参照下さい。
FOR DETAIL OF CONNECTOR DIMENSIONS, SEE PRODUCT DRAWING.
梱包数量：3000個／リール
E
引き出し方向
PULL OUT DIRECTION
REEL
3.
NUMBER OF CONNECTORS : 3000 PCS/REEL.
リードテープ長さ
LEAD TAPE LENGTH.
引き出し方向
PULL OUT DIRECTION
E
20PCS.MIN.
TOP TAPE BONDED PART.(EMPTY)
トップテープ接着部(空エンボス)
D
⌀
330
±
2
(
⌀
80)
トップテープリーダー部
TOP TAPE LEADER PART
400MIN.
部品挿入部
COMPONENT
SUPPLIER
.
末端部(空部)
TAIL PART
(EMPTY)
160MIN.
D
4.
5.
.カバーテープの剥離強度については、IEC60286-3に準拠
COVER TAPE PEEL FORCE IS DEFINED BY IEC 60286-3.
材料
MATERIAL
(CARRIER
キャリアテープ
TAPE)
：ポリスチレン
(POLYSTYRENE)
(TOP TAPE)
：PET, PE, PEF
トップテープ
(REEL)
(PS)
リール ：ポリスチレン <リサイクル材含む>
POLYSTYRENE (PS)<RECYCLE MATERIAL CONTAINED>
ELV及びRoHS適合品
ELV AND RoHS COMPLIANT
C
F
C
±
1
D
±
1
6.
C
(
⌀
10
)
B
(
22
)
(
2
)
(
120
°
)
B
501461**91
MODEL NO.
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
2015/12/09
2015/12/24
2015/12/24
(
⌀
21
)
(
⌀
13
)
GENERAL
TOLERANCES
(UNLESS SPECIFIED)
ANGULAR TOL ±
°
DIMENSION UNITS
SCALE
mm
DRWN BY
DATE
---
REDRAW
4 PLACES
±
±
±
±
±
NVELUSAMY
CHK'D BY
DATE
2015/12/09
102256
NVELUSAMY
YNOGAWA
YNOGAWA
A
DETAIL F
3 PLACES
2 PLACES
1 PLACE
0 PLACES
0.5 FPC CONN BACK FLIP
H=0.8 EMBSTP PKG LOW-HALOGEN
HIIJIMA
APPR BY
DATE
A
2015/12/24
YNOGAWA
DRAWING SIZE
PRODUCT CUSTOMER DRAWING
SERIES
MATERIAL NUMBER
CUSTOMER
EC NO:
DRWN:
CHK'D:
APPR:
THIRD ANGLE PROJECTION
RELEASE STATUS
FORMAT: master-tb-prod-A3
REVISION: F
DATE: 2015/11/16
9
P1
RELEASE DATE
2015/12/24
8
03:08:15
7
6
5
A
REV
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
501461
DOCUMENT NUMBER
SEE CHART
GENERAL
DOC TYPE
DOC PART
SHEET NUMBER
A3
3
4
5014610001
2
PSD
000
1
1 OF 2
9
8
7
6
5
4
3
2
1
E
引き出し方向
PULL OUT DIRECTION
E
½
3.37
½
½
3.2
½
501461**92
トップテープ
TOP TAPE
½
1.115
½
X
½
3.37
½
½
3.2
½
D
½
B
½
½
B
½
½
A
½
½
0.97
½
D
16
±
0.3
½
7.5
½
1.75
±
0.1
C
0.3
±
0.05
SECT. Y-Y
½
2
½
⌀
1.5
+0.1
0
12
±
0.1
Y
X
Y
C
½
1.62
½
SECT. X-X
16mm 幅キャリアテープ
16mm WIDTH CARRIER TAPE
4
±
0.1
累積ピッチ 40
±
0.2
ACCUMULATIVE
PITCH 40
±
0.2
B
16
5.7
4.7
21.4 17.4
4.2
3.7
D
C
6.2
5.2
4.7
4.2
キャリアテープ幅
CARRIER TAPE WIDTH
DIMENSION UNITS
(B)
5014610891
5014610691
5014610591
5014610491
EMBOSSED PACKAGE
(A)
ORDER NO. オーダー番号
8
6
5
4
B
極数
CIRCUITS
CONNECTOR SERIES NO:501461**92
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
2015/12/09
2015/12/24
2015/12/24
GENERAL
TOLERANCES
(UNLESS SPECIFIED)
ANGULAR TOL ±
°
SCALE
mm
DRWN BY
DATE
---
REDRAW
4 PLACES
±
±
±
±
±
NVELUSAMY
CHK'D BY
DATE
2015/12/09
102256
NVELUSAMY
YNOGAWA
YNOGAWA
3 PLACES
2 PLACES
1 PLACE
0 PLACES
0.5 FPC CONN BACK FLIP
H=0.8 EMBSTP PKG LOW-HALOGEN
A
HIIJIMA
APPR BY
DATE
A
2015/12/24
YNOGAWA
DRAWING SIZE
PRODUCT CUSTOMER DRAWING
SERIES
MATERIAL NUMBER
CUSTOMER
EC NO:
DRWN:
CHK'D:
APPR:
THIRD ANGLE PROJECTION
RELEASE STATUS
FORMAT: tb-prod-A3
REVISION: F
DATE: 2015/11/16
P1
RELEASE DATE
2015/12/24
03:08:15
A
7
6
5
REV
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
501461
DOCUMENT NUMBER
SEE CHART
GENERAL
DOC TYPE
DOC PART
SHEET NUMBER
A3
3
5014610001
PSD
000
2 OF 2
9
8
4
2
1
9
8
7
6
5
4
3
2
1
E
½
3.01
½
アクチュエータ
ACTUATOR
ハウジング
HOUSING
0.46
±
0.2
0.8
±
0.1
（アクチュエータが開口した状態）
(WHEN ACTUATOR IS OPENED)
A
±
0.1
C
±
0.1
½
0.2
½
0.27
±
0.1
0.5
±
0.1
0.15
±
0.1
D
3.2
±
0.25
3.1
±
0.2
回路番号１
CIRCUIT NO.1
E
±
0.1
B
±
0.1
補強金具
FITTING NAIL
ターミナル
TERMINAL
0.15
±
0.1
D
±
0.2
C
注記
NOTES:
1. 材質
MATERIAL
ハウジング：黒色、ポリアミド(PA46)、ガラス充填、UL94HB
HOUSING:BLACK,POLYAMIDE,GLASS FILLED,UL94HB
アクチュエーター：ナチュラル（½色）、ポリアミド(PA46)、ガラス充填、UL94HB
ACTUATOR:NATURAL(WHITE),POLYAMIDE,GLASS FILLED,UL94HB
ターミナル：リン青銅（½＝0.15）
TERMINAL:PHOSPHOR BRONZE (t=0.15)
補強金具：リン青銅（½＝0.15）
NAIL:PHOSPHOR BRONZE (t=0.15)
2. めっき仕様
PLATING
ターミナル: 接点部：部分金メッキ(0.1μm以上）
テール部 :部分金メッキ
下地 ニッケルメッキ(1.0μm以上)
TERMINAL : CONTACT AREA :SEPARATED GOLD PLATING
(0.1 MICROMETER MINIMUM)
SOLDER TAIL AREA :SEPARATED GOLD PLATING
UNDER PLATING ; NICKEL PLATING OVERALL
(1.0 MICROMETER MINIMUM)
補強金具： 錫メッキ(1.0μm以上)
下地 ニッケルメッキ(1.0μm以上）
FITTING NAIL : TIN PLATING 1.0 MICROMETER MINIMUM.
UNDER PLATING ; NICKEL PLATING OVERALL
(1.0 MICROMETER MINIMUM)
3. 平坦度は、０.１½½以下とする。
TAILS AND NAILS COPLANARITY TO BE 0.1mm MAXIMUM.
4. ELV&RoHS COMPLIANT
E
D
3
±
0.1
0.58
±
0.1
1.64
±
0.2
C
Z
FPC挿入方向
パッド面
Z
B
ISO VIEW (参考）
½
1.7
½
½
1
½
FPC挿入深さ
INSERTION DEPTH OF FPC
接点½½
LENGTH TO CONTACT POINT
DIMENSION UNITS
4.5
3.5
3.0
2.5
E
4.97
3.97
3.47
2.97
D
4.18
3.18
2.68
2.18
C
5.5
4.5
4.0
3.5
B
3.5
2.5
2.0
1.5
5014610891
8
5014610691
6
5
5014610591
4
5014610491
EMBOSSED TAPE PKG.
極 数(N)
A
ORDER NO. オーダー番号
CIRCUITS(N)
CONNECTOR NO.
B
5014610492
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
2016/01/12
2016/01/18
2016/01/18
GENERAL
TOLERANCES
(UNLESS SPECIFIED)
ANGULAR TOL ±
°
SCALE
mm
DRWN BY
DATE
10:1
2015/12/09
DATE
REVISED
4 PLACES
±
±
±
±
±
NVELUSAMY
CHK'D BY
102468
MTAKAHASHI04
TKUSUHARA01
TKUSUHARA01
3 PLACES
2 PLACES
1 PLACE
0 PLACES
0.5 FPC CONN BACK FLIP
HGT=0.8 HSG ASSY LOW-HALOGEN
A
接点部（下面）
CONTACT POINT
(BOTTOM CONTACT)
HIIJIMA
APPR BY
DATE
2015/12/24
2015/12/24
A
PRODUCT CUSTOMER DRAWING
SERIES
MATERIAL NUMBER
CUSTOMER
EC NO:
DRWN:
CHK'D:
APPR:
SECTION Z-Z
2016/01/18
09:21:29
YNOGAWA
DRAWING SIZE
THIRD ANGLE PROJECTION
RELEASE STATUS
FORMAT: tb-prod-A3
REVISION: F
DATE: 2015/11/16
P1
RELEASE DATE
B
7
6
5
REV
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
501461
DOCUMENT NUMBER
SEE CHART
GENERAL
DOC TYPE
DOC PART
SHEET NUMBER
A3
3
5014611004
PSD
000
1 OF 2
9
8
4
2
1
9
8
7
6
5
4
3
2
1
E
0.5(N-1)+0.3
±
0.03
0.5(N+1)
±
0.05
端子部メッキ：金メッキ(0.1μm以上)、
下地ニッケルメッキ(2½6μm)
PLATING：GOLD PLATING(0.1μm MIN.),
NICKEL UNDER PLATING(2½6μm)
A
⌯
0.04
A
E
0.12
±
0.03
仕上がり厚さ
THISCKNESS
A
±
0.05
0.5
±
0.05
0.3
±
0.05
A
±
0.03
1.21
±
0.05
0.12
±
0.03
0.5
±
0.03
⌯
0.04
A
0.64
±
0.05
R
0.2
±
0.1
1.96
±
0.05
½
1.64
½
D
3 MIN.
2.35
+0.15
0
R
0.2
±
0.1
1.4
±
0.2
0.5
±
0.1
0.7
±
0.1
シャープエッジのこと
0.3
±
0.03
0.3
±
0.03
D
0.77
±
0.05
0.52
±
0.05
0.3
±
0.05
B
±
0.05
1
±
0.05
R
0.2 MAX.
補強板：ポリイミド
STIFFNER BOARD: POLYIMIDE
B
カバーレイ：ポリイミド（12μm）
COVER FILM: POLYIMIDE（12μm）
熱硬化接着剤
THERMOSETTING ADHESHIVE
熱硬化接着剤
THERMOSETTING ADHESHIVE
導½部：銅箔（18μm）
COPPER FOIL（18μm）
C
熱硬化接着剤
THERMOSETTING ADHESHIVE
推奨基板レイアウト
RECOMMENDED P.C.BOARD PATTERN LAYOUT
マスク厚 ：120μm
マスク開口率：100%
SCREEN THICKNESS : 120μm
SCREEN OPEN RATIO : 100%
ベースフィルム：ポリイミド（12μm）
BASE FILM: POLYIMIDE（12μm）
パターン禁止範囲
PATTERN
PROHIBITION AREA
適合金メッキＦＰＣ推奨寸法
APPLICABLE FPC OF GOLD
PLATING RECOMMENDED DIMENSION
仕上がり厚さ：0.12
±
0.03
THICKNESS : 0.12+0.03/-0.03
C
REVISED
102468
MTAKAHASHI04
TKUSUHARA01
TKUSUHARA01
FPCについて：
抜き方向は、導½側から補強板側を推奨します。
補強フィルム材質は、ポリイミドを推奨します。
接着剤は、熱硬化接着剤を推奨します。
尚、接着剤の接点部への付着は、導通不良の原因となりますので染み出しが無いよう、お願いします。
ABOUT FPC :
RECOMMENDED PUNCHER DIRECTION :
FROM CONDUCTOR SIDE TO STIFFNER FILME SIDE.
RECOMMENDED MATERIAL :
STIFFNER FILME : POLYIMIDE
BONDING AGENT : THRMOSETTING AGENT
PLEASE PUT APPROPRIATE AMOUNT OF ADHESIVE MAY CAUSE
THE DEFECT IN ELECTRICAL CONTINUITY.
B
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
2016/01/12
2016/01/18
2016/01/18
GENERAL
TOLERANCES
(UNLESS SPECIFIED)
ANGULAR TOL ±
°
DIMENSION UNITS
SCALE
mm
DRWN BY
DATE
10:1
2015/12/09
DATE
4 PLACES
3 PLACES
2 PLACES
1 PLACE
0 PLACES
±
±
±
±
±
NVELUSAMY
CHK'D BY
0.5 FPC CONN BACK FLIP
HGT=0.8 HSG ASSY LOW-HALOGEN
A
HIIJIMA
APPR BY
DATE
2015/12/24
2015/12/24
A
PRODUCT CUSTOMER DRAWING
SERIES
MATERIAL NUMBER
CUSTOMER
YNOGAWA
DRAWING SIZE
EC NO:
DRWN:
CHK'D:
APPR:
THIRD ANGLE PROJECTION
RELEASE STATUS
FORMAT: master-tb-prod-A3
REVISION: F
DATE: 2015/11/16
9
P1
RELEASE DATE
2016/01/18
8
09:21:29
7
6
5
B
REV
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
501461
DOCUMENT NUMBER
SEE CHART
GENERAL
DOC TYPE
DOC PART
SHEET NUMBER
A3
3
4
5014611004
2
PSD
000
1
2 OF 2
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