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HUF76619D3S

Description
MOSFET N-CH 100V 18A DPAK
Categorysemiconductor    Discrete semiconductor   
File Size400KB,10 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
Environmental Compliance
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HUF76619D3S Overview

MOSFET N-CH 100V 18A DPAK

HUF76619D3S Parametric

Parameter NameAttribute value
FET typeN channel
technologyMOSFET (metal oxide)
Drain-source voltage (Vdss)100V
Current - Continuous Drain (Id) at 25°C18A(Tc)
Drive voltage (maximum Rds On, minimum Rds On)4.5V,10V
Rds On (maximum value) when different Id, Vgs85 milliohms @ 18A, 10V
Vgs (th) (maximum value) when different Id3V @ 250µA
Gate charge (Qg) at different Vgs (maximum value)29nC @ 10V
Vgs (maximum value)±16V
Input capacitance (Ciss) at different Vds (maximum value)767pF @ 25V
FET function-
Power dissipation (maximum)75W(Tc)
Operating temperature-55°C ~ 175°C(TJ)
Installation typesurface mount
Supplier device packagingTO-252AA
Package/casingTO-252-3, DPak (2 leads + tab), SC-63
HUF76619D3, HUF76619D3S
Data Sheet
November 1999
File Number
4690.3
18A, 100V, 0.087 Ohm, N-Channel, Logic
Level UltraFET® Power MOSFET
Title
UF7
19D
UF76
9D3
bjec
HUF76619D3
Packaging
JEDEC TO-251AA
DRAIN
(FLANGE)
JEDEC TO-252AA
DRAIN
(FLANGE)
Features
• Ultra Low On-Resistance
- r
DS(ON)
= 0.085
Ω,
V
GS
=
10V
- r
DS(ON)
= 0.087
Ω,
V
GS
=
5V
• Simulation Models
- Temperature Compensated PSPICE® and SABER™
Electrical Models
- Spice and SABER Thermal Impedance Models
- www.Intersil.com
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
• Switching Time vs R
GS
Curves
SOURCE
DRAIN
GATE
GATE
SOURCE
HUF76619D3S
0V,
87
m,
A,
ann
gic
vel
raF
wer
OSF
)
utho
eyw
s
tersi
rpor
on,
ann
gic
vel
raF
wer
Symbol
D
Ordering Information
G
PART NUMBER
HUF76619D3
S
PACKAGE
TO-251AA
TO-252AA
BRAND
76619D
76619D
HUF76619D3S
NOTE: When ordering, use the entire part number. Add the suffix T to
obtain the TO-252AA variant in tape and reel, e.g., HUF76619D3ST.
Absolute Maximum Ratings
T
C
= 25
o
C, Unless Otherwise Specified
HUF76619D3, HUF76619D3S
100
100
±
16
18
18
12
12
Figure 4
Figures 6, 17, 18
75
0.5
-55 to 175
300
260
UNITS
V
V
V
A
A
A
A
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V
DSS
Drain to Gate Voltage (R
GS
= 20k
) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
DGR
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V
GS
Drain Current
Continuous (T
C
= 25
o
C, V
GS
= 5V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
D
Continuous (T
C
= 25
o
C, V
GS
= 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
D
Continuous (T
C
= 100
o
C, V
GS
= 5V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
D
Continuous (T
C
= 100
o
C, V
GS
= 4.5V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
D
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
DM
Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . UIS
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
D
Derate Above 25
o
C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
J
, T
STG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
L
Package Body for 10s, See Techbrief TB334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
pkg
NOTES:
1. T
J
= 25
o
C to 150
o
C.
W
W/
o
C
o
C
o
C
o
C
CAUTION:
Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Product reliability information can be found at http://www.mtp.intersil.com/reliability.html
For severe environments, see our Automotive HUFA series.
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 and QS9000 quality systems certification.
©2001 Fairchild Semiconductor Corporation
HUF76619D3, HUF76619D3S Rev. A

HUF76619D3S Related Products

HUF76619D3S HUF76619D3ST
Description MOSFET N-CH 100V 18A DPAK MOSFET N-CH 100V 18A DPAK
FET type N channel N channel
technology MOSFET (metal oxide) MOSFET (metal oxide)
Drain-source voltage (Vdss) 100V 100V
Current - Continuous Drain (Id) at 25°C 18A(Tc) 18A(Tc)
Drive voltage (maximum Rds On, minimum Rds On) 4.5V,10V 4.5V,10V
Rds On (maximum value) when different Id, Vgs 85 milliohms @ 18A, 10V 85 milliohms @ 18A, 10V
Vgs (th) (maximum value) when different Id 3V @ 250µA 3V @ 250µA
Gate charge (Qg) at different Vgs (maximum value) 29nC @ 10V 29nC @ 10V
Vgs (maximum value) ±16V ±16V
Input capacitance (Ciss) at different Vds (maximum value) 767pF @ 25V 767pF @ 25V
Power dissipation (maximum) 75W(Tc) 75W(Tc)
Operating temperature -55°C ~ 175°C(TJ) -55°C ~ 175°C(TJ)
Installation type surface mount surface mount
Supplier device packaging TO-252AA TO-252AA
Package/casing TO-252-3, DPak (2 leads + tab), SC-63 TO-252-3, DPak (2 leads + tab), SC-63

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