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LCW W5SN-HZKX-N3P5-Z

Description
LED PLAT DRAGON WARM WHITE 2SMD
CategoryLED optoelectronic/LED   
File Size288KB,19 Pages
ManufacturerOsram Opto Semiconductor
Websitehttps://www.osram.com/index-2.jsp
Environmental Compliance
Download Datasheet Parametric Compare View All

LCW W5SN-HZKX-N3P5-Z Overview

LED PLAT DRAGON WARM WHITE 2SMD

LCW W5SN-HZKX-N3P5-Z Parametric

Parameter NameAttribute value
colorwhite, warm color
CCT(K)3000K
Flux, current at 85°C - Test-
Flux, current at 25°C - Test61 lm(39 lm ~ 82 lm)
Current - Test700mA
Voltage - Forward (Vf) (Typical)3.6V
Lumens/Watt at different test currents24 lm/W
CRI (high color rendering index)-
Current - maximum1A
perspective120°
Installation typesurface mount
Package/casing2-SMD, gull wing exposed pad
Supplier device packagingSMD
size/dimensions0.276" long x 0.236" wide (7.00mm x 6.00mm)
Height - Installation (maximum)0.079"(2.00mm)
Package thermal resistance11°C/W
Platinum DRAGON
®
warm white with Chip Level Conversion (CLC)
Lead (Pb) Free Product - RoHS Compliant
LCW W5SN
Released
Besondere Merkmale
Gehäusetyp:
weißes SMD Gehäuse, klarer
Silikon - Verguss, Chip level conversion
Typischer Lichtfluss:
60 lm bei 700 mA
Besonderheit des Bauteils:
hocheffiziente
Lichtquelle bei geringem Platzbedarf
Farbort:
x = 0,42, y = 0,40 nach CIE 1931 (weiß)
Farbtemperatur:
2500K bis 4800K
Abstrahlwinkel:
Lambertscher Strahler (120°)
Technologie:
ThinGaN
®
optischer Wirkungsgrad:
24 lm/W
Gruppierungsparameter:
Lichtstrom, Farbort
Verarbeitungsmethode:
für alle
SMT-Bestücktechniken geeignet
Lötmethode:
IR Reflow Löten
Vorbehandlung:
nach JEDEC Level 2
Gurtung:
24-mm Gurt mit 800/Rolle, ø180 mm
ESD-Festigkeit:
ESD-sicher bis 2 kV nach
JESD22-A114-D
Features
package:
white SMD package, colorless clear
silicone resin; chip level conversion
typical Luminous Flux:
60 lm at 700 mA
feature of the device:
high efficient lightsource
at low space
color coordinates:
x = 0.42, y = 0.40 acc. to
CIE 1931 (white)
color temperature:
2500K to 4800K
viewing angle:
Lambertian Emitter (120°)
technology:
ThinGaN
®
optical efficiency:
24 lm/W
grouping parameter:
luminous flux,
color coordinates
assembly methods:
suitable for all
SMT assembly methods
soldering methods:
IR reflow soldering
preconditioning:
acc. to JEDEC Level 2
taping:
24 mm tape with 800/reel, ø180 mm
ESD-withstand voltage:
up to 2 kV acc. to
JESD22-A114-D
Applications
• exterior and interior automotive lighting
(e.g. front light)
• Flashlight
• backlighting (illuminated advertising, general
lighting)
• reading lamps (aircraft, car, bus)
• substitution of micro incandescent lamps
• indoor and outdoor commercial and residential
architectural lighting
• display backlight where high brightness is required
e.g. TFT
• decorative and entertainment lighting
• signal and symbol luminaire for orientation
• marker lights (e.g. steps, exit ways, etc.)
Anwendungen
• Außen- und Innenbeleuchtung im Automobilbe-
reich (z.B. Scheinwerfer)
• Blitzlicht
• Hinterleuchtung (Werbebeleuchtung,
Allgemeinbeleuchtung)
• Leselampen (Flugzeug, Auto, Bus)
• Ersatz von Kleinst-Glühlampen
• Fassadenbeleuchtung im Innen- und
Außenbereich
• Display Hinterleuchtung mit hohem
Helligkeitsbedarf z. B. TFT
• Dekorative Beleuchtung
• Signal- und Symbolleuchten zur Orientierung
• Markierungsbeleuchtung (Stufen, Fluchtwege, u.ä.)
2007-08-16
1

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