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M68AW256DL: Description4 Mbit (256K x16) 3.0V Asynchronous SRAM; File Size106KB，20 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/

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M68AW256DL Overview

4 Mbit (256K x16) 3.0V Asynchronous SRAM

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M68AW256DL

4 Mbit (256K x16) 3.0V Asynchronous SRAM

FEATURES SUMMARY

SUPPLY VOLTAGE: 2.7 to 3.6V

Figure 1. Packages

256K x 16 bits SRAM with OUTPUT ENABLE

EQUAL CYCLE and ACCESS TIME: 55ns

SINGLE BYTE READ/WRITE

LOW STANDBY CURRENT

LOW V

DATA RETENTION: 1.5V

TRI-STATE COMMON I/O

AUTOMATIC POWER DOWN

DUAL CHIP ENABLE for EASY DEPTH

EXPANSION

BGA

TSOP44 Type II (ND)

TFBGA48 (ZB)

7 x 8 mm

June 2002

1/20

M68AW256DL

TABLE OF CONTENTS

SUMMARY DESCRIPTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Figure 2. Logic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Table 1. Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Figure 3. TSOP Connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Figure 4. TFBGA Connections (Top view through package). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Figure 5. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Table 2. Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

DC AND AC PARAMETERS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Table 3. Operating and AC Measurement Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Figure 6. AC Measurement I/O Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Figure 7. AC Measurement Load Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Table 4. Capacitance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Table 5. DC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

OPERATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Table 6. Operating Modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Read Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Figure 8. Address Controlled, Read Mode AC Waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Figure 9. Chip Enable or Output Enable Controlled, Read Mode AC Waveforms. . . . . . . . . . . . . . 10

Figure 10. Chip Enable or UB/LB Controlled, Standby Mode AC Waveforms . . . . . . . . . . . . . . . . 10

Table 7. Read and Standby Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Write Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Figure 11. Write Enable Controlled, Write AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Figure 12. Chip Enable Controlled, Write AC Waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Figure 13. UB/LB Controlled, Write AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Table 8. Write Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Figure 14. E1 Controlled, Low VCC Data Retention AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . 15

Figure 15. E2 Controlled, Low VCC Data Retention AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . 15

Table 9. Low V

Data Retention Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

PACKAGE MECHANICAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

TSOP44 Type II - 44 lead Plastic Thin Small Outline Type II, Package Outline . . . . . . . . . . . . . . . 16

TSOP 44 Type II - 44 lead Plastic Thin Small Outline Type II, Package Mechanical Data . . . . . . . 16

TFBGA48 7x8mm - 6x8 ball array, 0.75 mm pitch, Bottom View Package Outline. . . . . . . . . . . . . 17

TFBGA48 7x8mm - 6x8 ball array, 0.75 mm pitch, Package Mechanical Data. . . . . . . . . . . . . . . . 17

PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Table 12. Ordering Information Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

REVISION HISTORY. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Table 13. Document Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

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Description	4 Mbit (256K x16) 3.0V Asynchronous SRAM	4 Mbit (256K x16) 3.0V Asynchronous SRAM	4 Mbit (256K x16) 3.0V Asynchronous SRAM	4 Mbit (256K x16) 3.0V Asynchronous SRAM	4 Mbit (256K x16) 3.0V Asynchronous SRAM	4 Mbit (256K x16) 3.0V Asynchronous SRAM	4 Mbit (256K x16) 3.0V Asynchronous SRAM	4 Mbit (256K x16) 3.0V Asynchronous SRAM	4 Mbit (256K x16) 3.0V Asynchronous SRAM
Is it Rohs certified?	-	conform to	incompatible	conform to	conform to	conform to	incompatible	conform to	incompatible
Maker	-	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics
Parts packaging code	-	BGA	TSOP2	BGA	BGA	TSOP2	TSOP2	BGA	TSOP2
package instruction	-	6 X 7 MM, 0.75 MM PITCH, TFBGA-48	PLASTIC, TSOP2-44	6 X 7 MM, 0.75 MM PITCH, TFBGA-48	6 X 7 MM, 0.75 MM PITCH, TFBGA-48	PLASTIC, TSOP2-44	PLASTIC, TSOP2-44	6 X 7 MM, 0.75 MM PITCH, TFBGA-48	PLASTIC, TSOP2-44
Contacts	-	48	44	48	48	44	44	48	44
Reach Compliance Code	-	compli	_compli	compli	compli	compli	_compli	compli	_compli
ECCN code	-	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
Maximum access time	-	55 ns	55 ns	70 ns	70 ns	70 ns	70 ns	55 ns	55 ns
I/O type	-	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	-	R-PBGA-B48	R-PDSO-G44	R-PBGA-B48	R-PBGA-B48	R-PDSO-G44	R-PDSO-G44	R-PBGA-B48	R-PDSO-G44
JESD-609 code	-	e1	e0	e1	e1	e0	e0	e1	e0
length	-	7 mm	18.41 mm	7 mm	7 mm	18.41 mm	18.41 mm	7 mm	18.41 mm
memory density	-	4194304 bi	4194304 bi	4194304 bi	4194304 bi	4194304 bi	4194304 bi	4194304 bi	4194304 bi
Memory IC Type	-	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	-	16	16	16	16	16	16	16	16
Number of functions	-	1	1	1	1	1	1	1	1
Number of terminals	-	48	44	48	48	44	44	48	44
word count	-	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words
character code	-	256000	256000	256000	256000	256000	256000	256000	256000
Operating mode	-	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	-	85 °C	85 °C	85 °C	70 °C	85 °C	70 °C	70 °C	70 °C
organize	-	256KX16	256KX16	256KX16	256KX16	256KX16	256KX16	256KX16	256KX16
Output characteristics	-	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	TFBGA	TSOP2	TFBGA	TFBGA	TSOP2	TSOP2	TFBGA	TSOP2
Encapsulate equivalent code	-	BGA48,6X8,30	TSOP44,.46,32	BGA48,6X8,30	BGA48,6X8,30	TSOP44,.46,32	TSOP44,.46,32	BGA48,6X8,30	TSOP44,.46,32
Package shape	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	-	GRID ARRAY, THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	-	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	-	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V
Certification status	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	-	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm
Maximum standby current	-	0.00002 A	0.00002 A	0.00002 A	0.00002 A	0.00002 A	0.00002 A	0.00002 A	0.00002 A
Minimum standby current	-	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V
Maximum slew rate	-	0.026 mA	0.026 mA	0.02 mA	0.02 mA	0.02 mA	0.02 mA	0.026 mA	0.026 mA
Maximum supply voltage (Vsup)	-	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	-	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	-	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
surface mount	-	YES	YES	YES	YES	YES	YES	YES	YES
technology	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	-	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	-	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Tin/Lead (Sn/Pb)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	TIN LEAD	Tin/Lead (Sn/Pb)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Tin/Lead (Sn/Pb)
Terminal form	-	BALL	GULL WING	BALL	BALL	GULL WING	GULL WING	BALL	GULL WING
Terminal pitch	-	0.75 mm	0.8 mm	0.75 mm	0.75 mm	0.8 mm	0.8 mm	0.75 mm	0.8 mm
Terminal location	-	BOTTOM	DUAL	BOTTOM	BOTTOM	DUAL	DUAL	BOTTOM	DUAL
Maximum time at peak reflow temperature	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	-	6 mm	10.16 mm	6 mm	6 mm	10.16 mm	10.16 mm	6 mm	10.16 mm

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