M68AW256DL55ZB6T datasheet, PDF

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M68AW256DL55ZB6T: Description4 Mbit (256K x16) 3.0V Asynchronous SRAM; Categorystorage storage; File Size106KB，20 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/; Environmental Compliance

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M68AW256DL55ZB6T Overview

4 Mbit (256K x16) 3.0V Asynchronous SRAM

M68AW256DL55ZB6T Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	STMicroelectronics
Parts packaging code	BGA
package instruction	6 X 7 MM, 0.75 MM PITCH, TFBGA-48
Contacts	48
Reach Compliance Code	compli
ECCN code	3A991.B.2.A
Maximum access time	55 ns
I/O type	COMMON
JESD-30 code	R-PBGA-B48
JESD-609 code	e1
length	7 mm
memory density	4194304 bi
Memory IC Type	STANDARD SRAM
memory width	16
Number of functions	1
Number of terminals	48
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	256KX16
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Encapsulate equivalent code	BGA48,6X8,30
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3/3.3 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum standby current	0.00002 A
Minimum standby current	1.5 V
Maximum slew rate	0.026 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal form	BALL
Terminal pitch	0.75 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	6 mm

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M68AW256DL

4 Mbit (256K x16) 3.0V Asynchronous SRAM

FEATURES SUMMARY

SUPPLY VOLTAGE: 2.7 to 3.6V

Figure 1. Packages

256K x 16 bits SRAM with OUTPUT ENABLE

EQUAL CYCLE and ACCESS TIME: 55ns

SINGLE BYTE READ/WRITE

LOW STANDBY CURRENT

LOW V

DATA RETENTION: 1.5V

TRI-STATE COMMON I/O

AUTOMATIC POWER DOWN

DUAL CHIP ENABLE for EASY DEPTH

EXPANSION

BGA

TSOP44 Type II (ND)

TFBGA48 (ZB)

7 x 8 mm

June 2002

1/20

M68AW256DL

TABLE OF CONTENTS

SUMMARY DESCRIPTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Figure 2. Logic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Table 1. Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Figure 3. TSOP Connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Figure 4. TFBGA Connections (Top view through package). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Figure 5. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Table 2. Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

DC AND AC PARAMETERS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Table 3. Operating and AC Measurement Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Figure 6. AC Measurement I/O Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Figure 7. AC Measurement Load Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Table 4. Capacitance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Table 5. DC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

OPERATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Table 6. Operating Modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Read Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Figure 8. Address Controlled, Read Mode AC Waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Figure 9. Chip Enable or Output Enable Controlled, Read Mode AC Waveforms. . . . . . . . . . . . . . 10

Figure 10. Chip Enable or UB/LB Controlled, Standby Mode AC Waveforms . . . . . . . . . . . . . . . . 10

Table 7. Read and Standby Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Write Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Figure 11. Write Enable Controlled, Write AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Figure 12. Chip Enable Controlled, Write AC Waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Figure 13. UB/LB Controlled, Write AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Table 8. Write Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Figure 14. E1 Controlled, Low VCC Data Retention AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . 15

Figure 15. E2 Controlled, Low VCC Data Retention AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . 15

Table 9. Low V

Data Retention Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

PACKAGE MECHANICAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

TSOP44 Type II - 44 lead Plastic Thin Small Outline Type II, Package Outline . . . . . . . . . . . . . . . 16

TSOP 44 Type II - 44 lead Plastic Thin Small Outline Type II, Package Mechanical Data . . . . . . . 16

TFBGA48 7x8mm - 6x8 ball array, 0.75 mm pitch, Bottom View Package Outline. . . . . . . . . . . . . 17

TFBGA48 7x8mm - 6x8 ball array, 0.75 mm pitch, Package Mechanical Data. . . . . . . . . . . . . . . . 17

PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Table 12. Ordering Information Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

REVISION HISTORY. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Table 13. Document Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

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Description	4 Mbit (256K x16) 3.0V Asynchronous SRAM	4 Mbit (256K x16) 3.0V Asynchronous SRAM	4 Mbit (256K x16) 3.0V Asynchronous SRAM	4 Mbit (256K x16) 3.0V Asynchronous SRAM	4 Mbit (256K x16) 3.0V Asynchronous SRAM	4 Mbit (256K x16) 3.0V Asynchronous SRAM	4 Mbit (256K x16) 3.0V Asynchronous SRAM	4 Mbit (256K x16) 3.0V Asynchronous SRAM	4 Mbit (256K x16) 3.0V Asynchronous SRAM
Is it Rohs certified?	conform to	-	incompatible	conform to	conform to	conform to	incompatible	conform to	incompatible
Maker	STMicroelectronics	-	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics
Parts packaging code	BGA	-	TSOP2	BGA	BGA	TSOP2	TSOP2	BGA	TSOP2
package instruction	6 X 7 MM, 0.75 MM PITCH, TFBGA-48	-	PLASTIC, TSOP2-44	6 X 7 MM, 0.75 MM PITCH, TFBGA-48	6 X 7 MM, 0.75 MM PITCH, TFBGA-48	PLASTIC, TSOP2-44	PLASTIC, TSOP2-44	6 X 7 MM, 0.75 MM PITCH, TFBGA-48	PLASTIC, TSOP2-44
Contacts	48	-	44	48	48	44	44	48	44
Reach Compliance Code	compli	-	_compli	compli	compli	compli	_compli	compli	_compli
ECCN code	3A991.B.2.A	-	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
Maximum access time	55 ns	-	55 ns	70 ns	70 ns	70 ns	70 ns	55 ns	55 ns
I/O type	COMMON	-	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PBGA-B48	-	R-PDSO-G44	R-PBGA-B48	R-PBGA-B48	R-PDSO-G44	R-PDSO-G44	R-PBGA-B48	R-PDSO-G44
JESD-609 code	e1	-	e0	e1	e1	e0	e0	e1	e0
length	7 mm	-	18.41 mm	7 mm	7 mm	18.41 mm	18.41 mm	7 mm	18.41 mm
memory density	4194304 bi	-	4194304 bi	4194304 bi	4194304 bi	4194304 bi	4194304 bi	4194304 bi	4194304 bi
Memory IC Type	STANDARD SRAM	-	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	16	-	16	16	16	16	16	16	16
Number of functions	1	-	1	1	1	1	1	1	1
Number of terminals	48	-	44	48	48	44	44	48	44
word count	262144 words	-	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words
character code	256000	-	256000	256000	256000	256000	256000	256000	256000
Operating mode	ASYNCHRONOUS	-	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	-	85 °C	85 °C	70 °C	85 °C	70 °C	70 °C	70 °C
organize	256KX16	-	256KX16	256KX16	256KX16	256KX16	256KX16	256KX16	256KX16
Output characteristics	3-STATE	-	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TFBGA	-	TSOP2	TFBGA	TFBGA	TSOP2	TSOP2	TFBGA	TSOP2
Encapsulate equivalent code	BGA48,6X8,30	-	TSOP44,.46,32	BGA48,6X8,30	BGA48,6X8,30	TSOP44,.46,32	TSOP44,.46,32	BGA48,6X8,30	TSOP44,.46,32
Package shape	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH	-	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL	-	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	3/3.3 V	-	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V
Certification status	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	-	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm
Maximum standby current	0.00002 A	-	0.00002 A	0.00002 A	0.00002 A	0.00002 A	0.00002 A	0.00002 A	0.00002 A
Minimum standby current	1.5 V	-	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V
Maximum slew rate	0.026 mA	-	0.026 mA	0.02 mA	0.02 mA	0.02 mA	0.02 mA	0.026 mA	0.026 mA
Maximum supply voltage (Vsup)	3.6 V	-	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	2.7 V	-	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3 V	-	3 V	3 V	3 V	3 V	3 V	3 V	3 V
surface mount	YES	-	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	-	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	-	Tin/Lead (Sn/Pb)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	TIN LEAD	Tin/Lead (Sn/Pb)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Tin/Lead (Sn/Pb)
Terminal form	BALL	-	GULL WING	BALL	BALL	GULL WING	GULL WING	BALL	GULL WING
Terminal pitch	0.75 mm	-	0.8 mm	0.75 mm	0.75 mm	0.8 mm	0.8 mm	0.75 mm	0.8 mm
Terminal location	BOTTOM	-	DUAL	BOTTOM	BOTTOM	DUAL	DUAL	BOTTOM	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	6 mm	-	10.16 mm	6 mm	6 mm	10.16 mm	10.16 mm	6 mm	10.16 mm

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