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DSP8-08S-TUB

Description
DIODE ARRAY
Categorysemiconductor    Discrete semiconductor   
File Size125KB,5 Pages
ManufacturerIXYS ( Littelfuse )
Websitehttp://www.ixys.com/
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DSP8-08S-TUB Overview

DIODE ARRAY

DSP8-08S-TUB Parametric

Parameter NameAttribute value
Diode configuration1 pair in series
Diode typestandard
Voltage - DC Reverse (Vr) (Maximum)800V
Current - average rectification (Io) (per diode)8A
Voltage at different If - Forward (Vf1.35V @ 16A
speedStandard recovery >500ns, >200mA (Io)
Current at different Vr - Reverse leakage current10µA @ 800V
Operating Temperature - Junction-55°C ~ 150°C
Installation typesurface mount
Package/casingTO-263-3, D²Pak (2-lead + tab), TO-263AB
Supplier device packagingTO-263(D2Pak)
DSP8-08S
Standard Rectifier
V
RRM
I
FAV
V
F
=
2x 800 V
=
=
8A
1.08 V
Phase leg
Part number
DSP8-08S
Backside: anode/cathode
1
2/4
3
Features / Advantages:
Planar passivated chips
Very low leakage current
Very low forward voltage drop
Improved thermal behaviour
Applications:
Diode for main rectification
For single and three phase
bridge configurations
Package:
TO-263 (D2Pak)
Industry standard outline
RoHS compliant
Epoxy meets UL 94V-0
Terms Conditions of usage:
The data contained in this product data sheet is exclusively intended for technically trained staff. The user will have to evaluate the suitability of the product for the intended application and
the completeness of the product data with respect to his application. The specifications of our components may not be considered as an assurance of component characteristics. The
information in the valid application- and assembly notes must be considered. Should you require product information in excess of the data given in this product data sheet or which concerns
the specific application of your product, please contact the sales office, which is responsible for you.
Due to technical requirements our product may contain dangerous substances. For information on the types in question please contact the sales office, which is responsible for you.
Should you intend to use the product in aviation, in health or live endangering or life support applications, please notify. For any such application we urgently recommend
- to perform joint risk and quality assessments;
- the conclusion of quality agreements;
- to establish joint measures of an ongoing product survey, and that we may make delivery dependent on the realization of any such measures.
IXYS reserves the right to change limits, conditions and dimensions.
Data according to IEC 60747and per semiconductor unless otherwise specified
20130107b
© 2013 IXYS all rights reserved

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