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909-37-2-33-2-B-0

Description
HEAT SINK PIN FIN 37X37MM CLIP
CategoryThermal management products   
File Size295KB,3 Pages
ManufacturerWakefield-Vette
Websitehttp://www.wakefield-vette.com/
Environmental Compliance
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909-37-2-33-2-B-0 Overview

HEAT SINK PIN FIN 37X37MM CLIP

ELLIPTICAL FIN HEAT SINK
908 Series
Wakefield-Vette’s 900 Series Heat Sinks for Chipset can match up
to devices from
Intel, Broadcom, Xilinx, TI, Motorola, ATI, AMD, Nvidia, Vishay, Pow
erex, Infineon, Microsemi, and many more.
These heat sinks are designed for air flow applications in the
Telecom, Data Center, Networking, Cloud Computing, and many
more Industries.
Material:
AL 6063
Finish:
Black Anodize
PART #
908-35-1-12-2-B-0
908-35-1-15-2-B-0
908-35-1-18-2-B-0
908-35-1-21-2-B-0
908-35-1-23-2-B-0
908-35-1-28-2-B-0
908-35-1-33-2-B-0
HEIGHT
(mm)
12
15
18
21
23
28
33
CHIP SIZE
(mm)
35
35
35
35
35
35
35
NATURAL
CONVECTION
11.1 C/W
10.58 C/W
10.06 C/W
9.53 C/W
8.75 C/W
7.93 C/W
7.11 C/W
FORCED CONVECTION (C/W)
200 LFM 400 LFM
600 LFM
3.07 C/W
2.79 C/W
2.54 C/W
2.35 C/W
2.13 C/W
1.94 C/W
1.69 C/W
2.07 C/W
1.87 C/W
1.69 C/W
1.52 C/W
1.35 C/W
1.19 C/W
1.02 C/W
1.64 C/W
1.46 C/W
1.27 C/W
1.15 C/W
1.01 C/W
.86 C/W
.72 C/W
THERMAL PERFORMANCE:
4
908-35-1-12-2-B-0
3.5
908-35-1-15-2-B-0
3
C/ Watt
908-35-1-18-2-B-0
2.5
908-35-1-21-2-B-0
2
908-35-1-23-2-B-0
1.5
1
0.5
200 LFM
400 LFM
Forced Convection
Series
Chip Size
Construction
Height
Chip Height
Finish
Interface
908-35-1-28-2-B-0
908-35-1-33-2-B-0
600 LFM
19-
19
21
23
27
908-
29
31
33
35
37.5
40
1-
12-
12 = 11.6
15 = 14.6
18 = 17.6
21 = 20.6
1-
1 = .9-2.1
2 = 2.2-3.4
B-
1
0 = None
1 = T725
1= Eliptical
Fin
23 = 22.6
28 = 27.6
33 = 32.6
B = BLK
ANO
T h e r m a l
C o o l i n g
S o l u t i o n s
f r o m
S m a r t
t o
F i n i s h
www.wakefield-vette.com
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